Bizarre Patents
An electrified table cloth for preventing crawling insects from gaining access to the consumer's food or drink.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7435991 | Micromechanical sensor A micromechanical sensor and a method for manufacturing same are described. A secure diaphragm restraint, independent of fluctuations in the cavern etching process due to the process technology, and a free design of the diaphragm are made possible by designing a sui... | 10/14/2008 |
| 7427774 | Targets for measurements in semiconductor devices Targets or test structures used for measurements in semiconductor devices having long lines exceeding design rule limitations are divided into segments. In one embodiment, the segments have periodicity in a direction parallel to the length of the lines. In another e... | 09/23/2008 |
| 7425458 | Selectable decoupling capacitors for integrated circuits and associated methods Selectable capacitors are used to modify performance characteristics of functional circuit elements of an integrated circuit (IC). In an embodiment, the decoupling capacitors are implemented as additional or alternative mounting pads on a surface of the IC. At least... | 09/16/2008 |
| 7423288 | Technique for evaluating a fabrication of a die and wafer The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performa... | 09/09/2008 |
| 7416986 | Test structure and method for detecting via contact shorting in shallow trench isolation regions A test structure for detecting void formation in semiconductor device layers includes a plurality of active device areas formed in a substrate, a plurality of shallow trench isolation (STI) regions separating the active device areas, a plurality of gate electrode st... | 08/26/2008 |
| 7408189 | Method of testing FPC bonding yield and FPC having testing pads thereon A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are ... | 08/05/2008 |
| 7407822 | Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching the insulating film, and method for controlling the punching apparatus The invention provides an inspection apparatus and an inspection method for detecting defects, a punching apparatus, and a method for controlling a punching apparatus, for the purpose of immediate detection of debris from being lifted toward the surface of an insula... | 08/05/2008 |
| 7405089 | Method and apparatus for measuring a surface profile of a sample In order to measure a surface profile of a sample, an imprint of the surface profile to be examined is produced in a transfer material. The sample contains processed semiconductor material and is in particular a patterned semiconductor wafer or part of a patterned s... | 07/29/2008 |
| 7405423 | Random number generating device The objective is to provide a random number generating device having a smaller circuit size and a smaller value of output bias. The random number generating device includes a pair of first and second current paths arranged in parallel with each other, and a pair of ... | 07/29/2008 |
| 7402444 | Method and apparatus for manufacturing a semiconductor device A method of manufacturing a semiconductor device using a wafer emissivity calculated from a wafer reflectivity to calculate a wafer temperature and to calculate target values for heat source optical intensities provided to a plurality of heat sources which heat the ... | 07/22/2008 |
| 7402443 | Methods of providing families of integrated circuits with similar dies partially disabled using product selection codes A method of providing a family of integrated circuits (ICs) includes applying a first product selection code (PSC) to a first IC die, applying a second PSC to a second IC die, and providing a third packaged IC die. The first IC die includes first and second portions... | 07/22/2008 |
| 7396694 | Structure for monitoring semiconductor polysilicon gate profile Detection of a profile drift of a polysilicon line is enhanced by a test structure that (1) measures a bottom width and an average width of a cross sectional area of the same polysilicon line (2) correlates the two measurements, and (3) compares... | 07/08/2008 |
| 7393702 | Characterizing the integrity of interconnects The present invention provides for a system and method of characterizing the integrity of a barrier structure. The barrier structure is an interconnect comprising a porous dielectric layer sandwiched between at least one barrier layer and at least one conducting lay... | 07/01/2008 |
| 7390682 | Method for testing metal-insulator-metal capacitor structures under high temperature at wafer level A test methodology is provided for testing metal-insulator-metal (MIM) capacitor structures under high temperatures at the wafer level. A resistor is formed on a region of dielectric isolation material formed in a semiconductor substrate. The MIM capacitor is formed... | 06/24/2008 |
| 7384803 | Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device Excitation light is irradiated onto a GaN layer on a silicon carbide substrate constituting a layered product that is set on a stage. Then light is emitted from a defective part caused by a structural defect of the silicon carbide substrate out of the GaN layer. By ... | 06/10/2008 |
| 7381577 | Early detection test for identifying defective semiconductor wafers in a front-end manufacturing line A method and apparatus for identifying defective partially manufactured semiconductor wafers in a manufacturing line is described, wherein defects caused by silicon erosion created by over-etching the wafer can be detected. The method described herein is based on an... | 06/03/2008 |
| 7378290 | Isolation circuit An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is provided to transfer the other signal from the second pad to the third p... | 05/27/2008 |
| 7378288 | Systems and methods for producing light emitting diode array Systems and methods are disclosed for producing vertical LED array on a metal substrate; evaluating said array of LEDs for defects; destroying one or more defective LEDs; forming good LEDs only LED array suitable for wafer level package. ... | 05/27/2008 |
| 7355201 | Test structure for measuring electrical and dimensional characteristics A test structure includes first and second combs, at least a first pair of base nodes, and a second pair of finger nodes. The first comb includes a first base and a first plurality of fingers extending from the first base. The second comb includes a second base and ... | 04/08/2008 |
| 7345366 | Apparatus and method for testing component built in circuit board A multi-layered circuit board a built-in component including multiple terminals, at least one signal pad formed on a top surface of the multi-layered circuit board for signal transmission, each of the at least one signal pad corresponding to one of the multiple term... | 03/18/2008 |
| 7335969 | Method of monitoring introduction of interfacial species A method for monitoring a nitridation process, including: (a) providing a semiconductor substrate; (b) forming a first dielectric layer on a top surface of the substrate; (c) introducing a quantity of interfacial species into the substrate; (d) removing the first di... | 02/26/2008 |
| 7332359 | Semiconductor device inspection method Techniques for inspecting semiconductor devices. An inspection condition using chip matrix data and chip size data is set. The intricate circuit patterns of at least one semiconductor device is inspected with the inspection condition. In an embodiment of the present... | 02/19/2008 |
| 7332360 | Early detection of metal wiring reliability using a noise spectrum The present invention generally provides an apparatus and a method for inspecting a substrate in a substrate processing system. In one aspect, a voltage or current source is used in conjunction with a power density receiving device, such as a spectrometer, to inspec... | 02/19/2008 |
| 7316936 | Laser decapsulation method A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24. Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned and scanned using an X, Y table 2 | 01/08/2008 |
| 7317204 | Test structure of semiconductor device A test structure of a semiconductor device is provided. The test structure includes a semiconductor substrate, a transistor which includes a gate electrode formed on first and second active regions defined within the semiconductor substrate, and first and second jun... | 01/08/2008 |
| 7317203 | Method and monitor structure for detecting and locating IC wiring defects A 3-dimensional PCM structure and method for using the same for carrying out 3-dimensional integrated circuit wiring electrical testing and failure analysis in an integrated circuit manufacturing process, the method including forming a first metallization layer; car... | 01/08/2008 |
| 7311738 | Positioning apparatus A positioning apparatus for positioning a substrate. The positioning apparatus includes a setting system which selectively sets one of a center of the substrate and a specific portion of an edge of the substrate as a positioning reference in accordance with informat... | 12/25/2007 |
| 7303928 | Process monitor and system for producing semiconductor A sensor on a semiconductor wafer is used as a process monitor and a capacitor is employed as a power supply for the sensor. The capacitor can be formed by stacking a poly-silicon layer and a silicon nitride layer on the wafer. A timer can be used to specify an oper... | 12/04/2007 |
| 7294914 | Interconnect structure An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate. ... | 11/13/2007 |
| 7282378 | Method of manufacturing inspection unit A conductive member having a first face adapted to be mounted on a board on which an inspection circuit is arranged, and a second face adapted to be opposed to a device to be inspected is prepared. The conductive member is formed with a first through hole having a f... | 10/16/2007 |
| 7279703 | Self-heating burn-in A method and an apparatus for self-heating burn-in have been disclosed. In one embodiment, a semiconductor device includes a plurality of gates, a multiplexer to select a clock signal out of a plurality of clock signals to toggle the plurality of gates in response t... | 10/09/2007 |
| 7276388 | Method, system, and apparatus for authenticating devices during assembly Methods and systems for authenticating the operation of electronic devices, such as RFID tags are provided. In accordance with the method, a web of substrates having a plurality of devices attached thereto are received. The operation of a first set of the plurality ... | 10/02/2007 |
| 7273761 | Box-in-box field-to-field alignment structure A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent box and a second translucent box. The second scribe includes at least a... | 09/25/2007 |
| 7271013 | Semiconductor device having a bond pad and method therefor A bond pad (10) has a probe region (14) and a wire bond region (12) that are substantially non-overlapping. In one embodiment, the bond pad (10) is connected to a final metal layer pad (16) and extends over an interconnect region (... | 09/18/2007 |
| 7265382 | Method and apparatus employing integrated metrology for improved dielectric etch efficiency A method and apparatus for processing a semiconductor wafer is provided for reducing dimensional variation by feeding forward information relating to photoresist mask CD and profile and underlying layer thickness measured at several points on the wafer to adjust the... | 09/04/2007 |
| 7253436 | Resistance defect assessment device, resistance defect assessment method, and method for manufacturing resistance defect assessment device A resistance defect assessment device provided on a wafer for assessing a resistance variation defect in a component of an integrated circuit device, the resistance defect assessment device including test patterns capable of measuring a resistance variation componen... | 08/07/2007 |
| 7250312 | Doping method and method for fabricating thin film transistor It is an object of the present invention to provide a doping apparatus, a doping method, and a method for fabricating a thin film transistor that can carry out doping to the carrier concentration which is optimum for obtaining the desired electric characteristic non... | 07/31/2007 |
| 7247508 | Semiconductor device with intermediate connector A semiconductor element and a circuit substrate each having electrodes disposed at narrow pitch are electrically connected with high reliability by conductive paste. A semiconductor device with a semiconductor section and a circuit substrate electrically connected a... | 07/24/2007 |
| 7242020 | Real-time monitoring of particles in semiconductor vacuum environment An apparatus includes semiconductor processing equipment. A particle detecting integrated circuit is positioned in a vacuum environment, the particle detecting integrated circuit containing a device having a pair of conductive lines exposed to the vacuum environment... | 07/10/2007 |
| 7229858 | Semiconductor wafer and semiconductor device manufacturing method using the same In a method of manufacturing a semiconductor device, a semiconductor wafer is prepared that includes a plurality of IC chips, each having a circuit including a terminal for applying an electrical quantity to the circuit, and a switch electrically connected to the te... | 06/12/2007 |
