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| Number | Title | Issue Date |
| 7259091 | Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer By performing a wet chemical process after etching a via, contaminations may be removed and a thin passivation layer may be formed that may then be readily removed in a subsequent sputter etch process for forming a barrier/adhesion layer. In a particular embodiment,... | 08/21/2007 |
| 7202101 | Multi-metal layer MEMS structure and process for making the same The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, a... | 04/10/2007 |
| 7122387 | Deposition stop time detection apparatus and methods for fabricating copper wiring using the same A method for fabricating copper wiring of a semiconductor device comprises forming a deposition stop time detection pattern having two trench structures positioned with a predetermined distance from each other on a dielectric substrate; positioning a deposition stop... | 10/17/2006 |
| 7122389 | Method for processing semiconductor devices in a singulated form Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are tem... | 10/17/2006 |
| 6890773 | Dynamic maintenance of manufacturing system components A method and an apparatus for sorting between actual and perceived errors related to processing of semiconductor wafers. A plurality of semiconductor wafers are processed. Fault data relating to the processed semiconductor wafers is acquired. A trend associated with... | 05/10/2005 |
