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"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 7435621 | Method of fabricating wafer level package A method of fabricating wafer level package is provided. First, a wafer having a front and a rear surfaces is provided. Several fosses are then formed on the front surface of the wafer. Next, an insulative layer is formed on a surface of each fosse; a conductive lay... | 10/14/2008 |
| 7402459 | Quad flat no-lead (QFN) chip package assembly apparatus and method In one embodiment the present invention includes a method of fabricating a quad flat no-lead (QFN) chip package. The method includes forming a stamped lead frame; forming a die pad and a lead shrink on one side of the stamped lead frame; mounting a die on the die pa... | 07/22/2008 |
| 7394152 | Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same The present invention provide a wafer level chip size packaged chip device with a N-shape junction at which external leads electrically connect to peripheral arrayed compatible pads and a method of fabricating the same. In the wafer level chip size package, with suc... | 07/01/2008 |
| 7393760 | Method for dicing glass substrate A method for dicing a sheet workpiece includes the following steps. A base (10) is provided. A water-soluble adhesive (20) is coated onto the base, and the workpiece is placed on the water-soluble adhesive. The water-soluble adhesive is hardened so as ... | 07/01/2008 |
| 7374967 | Multi-stack chip size packaging method In multi-stack chip size packaging a plurality chips, a first chip is electrically interconnected on a top surface of a substrate using a bump. Next, an epoxy is coated on the first chip and is stacked a second chip thereon, wherein the second chip is electrically i... | 05/20/2008 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabri... | 04/22/2008 |
| 7361988 | Apparatuses and methods to route line to line Various methods and apparatuses are described in which a printed circuit board has trace lines. Input/output pads on the printed circuit board may have approximately the same width dimension as a trace line connected to those input/output pads. A first group of vias... | 04/22/2008 |
| 7361027 | Contact structure, display device and electronic device A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented... | 04/22/2008 |
| 7306974 | Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies Packaged microelectronic devices, methods for packaging microelectronic devices, and methods of operating microelectronic devices. In one embodiment, a packaged microelectronic device comprises a die including integrated circuitry, a first casing coating at least a ... | 12/11/2007 |
| 7294914 | Interconnect structure An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate. ... | 11/13/2007 |
| 7285444 | Method of manufacturing semiconductor device A semiconductor device which includes: a semiconductor chip with plural pads; a tab connected with the semiconductor chip; bus bars which are located outside of the semiconductor chip and connected with the tab; a sealing body which resin-seals the semiconductor chi... | 10/23/2007 |
| 7246434 | Method of making a surface mountable PCB module A printed-circuit board (PCB) module has co-planar solder pads on a bottom surface. The solder pads can be surface-mounted to pads on a main board, allowing the PCB module to be surface mounted without wire leads extending from the PCB module substrate. A cavity is ... | 07/24/2007 |
| 7235429 | Conductive block mounting process for electrical connection A process for mounting conductive blocks on a surface of a substrate is disclosed wherein the substrate may be an IC chip, carrier, or a PCB. An adhesive layer is formed on each of the pads of the substrate. Thereafter, a plurality of conductive blocks are scattered... | 06/26/2007 |
| 7195953 | Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein A lead frame comprises a stage for mounting a semiconductor chip thereon, a plurality of leads arranged in the periphery of the stage, and a plurality of lead interconnection members (e.g., dam bars) for interconnecting the leads, wherein a plurality of through hole... | 03/27/2007 |
| 7192808 | Semiconductor device having a lead frame smaller than a semiconductor chip and manufacturing method therefor A semiconductor device is produced using a lead frame whose size is smaller than a prescribed center area of a semiconductor chip surrounded by its bonding pads, which are connected with electrodes supported by electrode supports and interconnected with outer frames... | 03/20/2007 |
| 7176058 | Chip scale package and method of fabricating the same Disclosed are a chip scale package and a method of fabricating the chip scale package. The chip scale package comprises conductive layers with a designated depth formed on an upper and a lower surfaces of a chip, and electrode surfaces formed on the same side surfac... | 02/13/2007 |
| 7109065 | Bumped chip carrier package using lead frame and method for manufacturing the same An improved bumped chip carrier (BCC) package according to the present invention includes a resin-molded lead frame encapsulating an attached semiconductor integrated circuit (IC) and a plurality of interconnecting wire bonds attaching a plurality of contact pads on... | 09/19/2006 |
| 7102461 | Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element In a surface acoustic wave element according to an embodiment of this invention, raised electrodes 20 formed on thin film electrodes 18 are provided with throughholes 31. Additionally, bumps 26 arranged on the raised electrodes 20 ... | 09/05/2006 |
| 6994803 | Ball grid array module The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is acc... | 02/07/2006 |
| 6627478 | Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction A microelectronic assembly is made by bonding the tip ends of leads on a first element to bonding contacts on a second element. The tip ends of the leads are releasably connected to the first element, so that the leads are held in place during the bonding... | 09/30/2003 |
| 6574860 | Ball grid array module The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This ta... | 06/10/2003 |
| 6503779 | Method of manufacturing flip chip type semiconductor device A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. A solder electrode is connected to each pad electrode and a metallic post is connected to each solder electrode. The surface of ... | 01/07/2003 |
| 6486003 | Expandable interposer for a microelectronic package and method therefor A method of fabricating a microelectronic package comprising an expandable structure includes the steps of providing first and second microelectronic elements having electrically conductive parts, providing the expandable structure between the microelectr... | 11/26/2002 |
| 6481616 | Bump bonding device and bump bonding method To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, ... | 11/19/2002 |
| 6383843 | Using removable spacers to ensure adequate bondline thickness A method is provided for die bonding a semiconductor device to a substrate, which method provides adequate and consistent bondline thickness and assures that the die is spaced from the substrate a predetermined amount. Embodiments include removably attach... | 05/07/2002 |
| 6383841 | Method for encapsulating with a fixing member to secure an electronic device The present invention is to provide a effective method for packing an electronic device including steps of: (a) putting an electronic device having a plurality of pins in a frame having a plurality of connecting members corresponding to said plurality of ... | 05/07/2002 |
| 6380634 | Conductor wires and semiconductor device using them The purpose of this invention is to provide a type of conductor wires which are appropriate for making a thin semiconductor device and can minimize problems of short-circuits between wires. This invention pertains to a type of conductor wires for electric... | 04/30/2002 |
| 6333207 | Peelable lead structure and method of manufacture A microelectronic component connection is made by providing a lead, extending along the surface of a first element such as a semiconductor chip or wafer, such that at least a part of the lead adheres to the surface of the first element. The adhesion betwe... | 12/25/2001 |
| 6191489 | Micromechanical layer stack arrangement particularly for flip chip or similar connections A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess... | 02/20/2001 |
| 6144101 | Flip chip down-bond: method and apparatus A flip-chip semiconductor device comprises a carrier substrate having a conductor pattern on at least one side, and at least one semiconductor die with an active surface and an opposed ground surface. A conductive backing plate is conductively bonded to t... | 11/07/2000 |
| 6121070 | Flip chip down-bond: method and apparatus A flip-chip semiconductor device comprises a carrier substrate having a conductor pattern on at least one side and at least one semiconductor die with an active surface and an opposed ground surface. A conductive backing plate is conductively bonded to th... | 09/19/2000 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. ... | 08/08/2000 |
| 5830803 | Method for filling contact holes using a doctor blade The method produces liquid contacts in contact holes on a top side of a semiconductor component. The top side is not wettable by material provided for the liquid contacts. The walls and edges of the contact holes are wettable by the material. The contact ... | 11/03/1998 |
| 5510139 | Process for assembly and bonding of electronic components on an insulating support In a process for assembly and bonding of electric and/or electronic components (3), provided with metal connections (11), on an insulating support (1) to be provided with strip conductors, it is provided, to increase the economic efficiency, that a cataly... | 04/23/1996 |
| 5467913 | Solder ball supply device A solder ball supply device comprising flux supply means 200 which supplies flux at the same time to input and output terminals on substrate 1 prior to supply of solder balls, and solder ball supply means 300 which takes out a number of solder balls from ... | 11/21/1995 |
| 5402927 | Adjustable wire tensioning apparatus A multi-level fine wire tensioning apparatus is provided for use in high speed automatic wire bonders. The tensioning apparatus which surrounds the fine wire is mounted close to the bonding capillary and is adapted to apply one of a plurality of tension f... | 04/04/1995 |
| 5190206 | Ultrasonic wire bonding tool and method for self-threading same An improved tool for ultrasonic wire bonding, and a novel method by which the tool may be semi-automatically threaded with bonding wire are disclosed. The overall exterior shape of the tool is that of an elongated rectangular cross-section bar having at t... | 03/02/1993 |
| 5153704 | Semiconductor device using annealed bonding wire A resin encapsulated semiconductor device comprises a semiconductor element, a conductive base, a wire of aluminum connecting the element and the base, and a thermosetting resin encapsulating hermetically the component to protect the device from a mechani... | 10/06/1992 |
| 4856699 | Driving mechanism for a high-speed wire contacting device The invention relates to a drive mechanism for a wire bonding apparatus for large bonding regions, for connecting to bonding loci by means of wire bridges. The inventive drive mechanism is comprised of a drive motor (1) coupled to a first angle lever (2) ... | 08/15/1989 |
| 4744850 | Method for bonding an LSI chip on a wiring base A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles the... | 05/17/1988 |
