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Class 257/E21.358 - Rectifier diode (EPO)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E21.352. This subclass
No. of patents: 72
Last issue date: 06/03/2008


1    
NumberTitleIssue Date
7381997Lateral silicided diodes
A structure and method of fabricating lateral diodes. The diodes include Schottky diodes and PIN diodes. The method of fabrication includes forming one or more doped regions and more trenches in a silicon substrate and forming metal silicides on the sidewalls of the...
06/03/2008
7335927Lateral silicided diodes
A structure and method of fabricating lateral diodes. The diodes include Schottky diodes and PIN diodes. The method of fabrication includes forming one or more doped regions and more trenches in a silicon substrate and forming metal silicides on the sidewalls of the...
02/26/2008
7326965Surface-emitting type device and its manufacturing method
A surface-emitting type device includes a substrate including a first face, a second face that is tilted with respect to the first face and has a plane index different from a plane index of the first face, and a third face that is tilted with respect to the second f...
02/05/2008
6699775Manufacturing process for fast recovery diode
A termination structure and reduced mask process for its manufacture for either a FRED device or any power semiconductor device comprises at least two concentric diffusion guard rings and two spaced silicon dioxide rings used in the definition of the two ...
03/02/2004
6692998Integrated high quality diode
A high-quality diode is formed in an SOI process, using standard steps and implant doses that are used in the process for other devices such as a FET and a buried resistor; in particular using a buried resistor mask and implant to form one side of the dio...
02/17/2004
6693024Semiconductor component with a semiconductor body having a multiplicity of pores and method for fabricating
The semiconductor component is fabricated on the basis of a semiconductor body with a first and a second surface. A multiplicity of pores are formed in the semiconductor body. The pores extend into the semiconductor body proceeding from the first surface ...
02/17/2004
6646304Universal semiconductor wafer for high-voltage semiconductor components
A universal semiconductor wafer for high-voltage semiconductor components includes at least one layer of a first conductivity type which is provided on a semiconductor substrate of the first conductivity type. A plurality of floating semiconductor zones o...
11/11/2003
6639301Semiconductor device and manufacturing method thereof
A semiconductor device embraces an n-type first semiconductor region, defined by first and second end surfaces and a first outer surface connecting the first and second end surfaces; a p-type second semiconductor region, defined by third and fourth end su...
10/28/2003
6635494Method of forming a two-dimensionally arrayed quantum device using a metalloprotein complex as a quantum-dot mask array
A quantum device is constituted from a two-dimensional array of quantum dots formed from metal atom aggregates contained in a metalloprotein complex. The metalloprotein is arranged on the surface of a substrate having an insulation layer with a pitch of t...
10/21/2003
6605854Schottky diode with bump electrodes
The package size of a diode is made smaller. On the element forming face of a semiconductor substrate having a p- -type conductive type, after a hyper-abrupt p+ n+ junction of a p+ -type diffusion layer, an n
08/12/2003
6603153Fast recovery diode and method for its manufacture
A soft recovery diode is made by first implanting helium into the die to a location below the P/N junction and the implant annealed. An E-beam radiation process then is applied to the entire wafer and is also annealed. The diode then has very soft recover...
08/05/2003
6580150Vertical junction field effect semiconductor diodes
Semiconductor diodes are diode connected vertical cylindrical field effect devices having one diode terminal as the common connection between a gate and a source/drain of the vertical cylindrical field effect devices. Methods of forming the diode connecte...
06/17/2003
6579772Discrete semiconductor device and manufacturing method thereof
A semiconductor device is provided, which prevents the development of localized breakdowns at the semiconductor sidewall, having a stabilized, desired breakdown voltage. It embraces a p-type third semiconductor region formed on a first main surface of an ...
06/17/2003
6500741Method for making high voltage device
An electrical device such as a diode usable in high voltage applications wherein the electrical device is fabricated from a method which yields a plurality of high voltage electrical devices, the present method including providing a substrate of a semicon...
12/31/2002
6501146Semiconductor device and method of manufacturing thereof
A plurality of p anode regions are formed at one surface of an n- substrate. A trench is formed in each p anode region. An ohmic junction region is formed between an anode metallic electrode and the p anode region. The p anode region has a mini...
12/31/2002
6495888Semiconductor device with p-n junction diode and method of forming the same
The present invention provides a semiconductor device having: a first semiconductor region of a first conductivity type having a first area and a second area; at least a diffusion region of a second conductivity type being provided on the first area and i...
12/17/2002
6495900Insulator for electrical structure
Structures and methods are disclosed for insulating a polysilicon gate adjacent to an electrically active region with a silicon base layer. A layer of silicon nitride having a thickness in a range from about 100 Å to about 150 Å is conformally deposited...
12/17/2002
6489215Method of making insulator for electrical structures
Structures and methods are disclosed for insulating a polysilicon gate adjacent to an electrically active region with a silicon base layer. A layer of silicon nitride having a thickness in a range from about 100 Å to about 150 Å is conformally deposited...
12/03/2002
6479885High voltage device and method
An electrical device such as a diode usable in high voltage applications wherein the electrical device is fabricated from a method which yields a plurality of high voltage electrical devices, the present method including providing a substrate of a semicon...
11/12/2002
6469368Method for producing a high-speed power diode with soft recovery, and a power diode produced using such a method
In a method for producing a high-speed power diode with soft recovery, in which method the carrier life within the associated semiconductor substrate (10) is governed by first, unmasked bombardment (14) with an axial profile and by subsequent, second, mas...
10/22/2002
6433370Method and apparatus for cylindrical semiconductor diodes
Semiconductor diodes are diode connected cylindrical junction field effect devices having one diode terminal as the common connection between a top gate, a back gate and a first channel terminal of the cylindrical junction field effect devices. The second...
08/13/2002
6403989Semiconductor device, method of manufacturing same, and circuit provided with such a device
The invention relates to a semiconductor device (10) comprising a semiconductor body (11) including, in succession, a first and a second semiconductor region (1, 2) of a first conductivity type having, respectively, a high and a low doping concentration, ...
06/11/2002
6400000Semiconductor device with a diode, and method of manufacturing such a device
The invention relates to a semiconductor device with a diode. The semiconductor body (10) comprises a stack of a first semiconductor region provided with a first connection conductor (5) and a second semiconductor region (2) connected to a second connecti...
06/04/2002
6392913Method of forming a polysilicon diode and devices incorporating such diode
A method for manufacturing a diode having a relatively improved on-off ratio. The diode is formed in a container in an insulative structure layered on a substrate of an integrated circuit. The container is then partially filled with a polysilicon material...
05/21/2002
6383836Diode and method for manufacturing the same
A diode is provided which includes a first-conductivity-type cathode layer, a first-conductivity-type drift layer placed on the cathode region and having a lower concentration than the cathode layer, a generally ring-like second-conductivity-type ring reg...
05/07/2002
6376346High voltage device and method for making the same
An electrical device such as a diode usable in high voltage applications wherein the electrical device is fabricated from a method which yields a plurality of high voltage electrical devices, the present method including providing a substrate of a semicon...
04/23/2002
6355971Semiconductor switch devices having a region with three distinct zones and their manufacture
In a semiconductor switch device such as an NPN transistor (T) or a power switching diode (D), a multiple-zone first region (1) of one conductivity type forms a switchable p-n junction (12) with a second region (2) of opposite conductivity type. In accord...
03/12/2002
6351023Semiconductor device having ultra-sharp P-N junction and method of manufacturing the same
A semiconductor device such as a P-N or P-I-N junction diode, includes a first semiconductor layer having a first conductivity-type and being mounted over a metal address line, and a second semiconductor layer having a second conductivity-type and being m...
02/26/2002
6346444Power semiconductor device using semi-insulating polycrystalline silicon and fabrication method thereof
A power semiconductor device having an improved high breakdown voltage and improved productivity, and a fabrication method thereof are provided. The power semiconductor includes a collector region of a first conductivity type formed in a semiconductor sub...
02/12/2002
6319738Two-dimensionally arrayed quantum device fabrication method
A quantum device is constituted from a two-dimensional array of quantum dots formed from metal atom aggregates contained in a metalloprotein complex. The metalloprotein is arranged on the surface of a substrate having an insulation layer with a pitch of t...
11/20/2001
6287928Two-dimensionally arrayed quantum device
A quantum device is constituted from a two-dimensional array of quantum dots formed from metal atom aggregates contained in metalloprotein complex. The metalloprotein is arranged on the surface of a substrate having an insulation layer with a pitch of the...
09/11/2001
6261874Fast recovery diode and method for its manufacture
A soft recovery diode is made by first implanting helium into the die to a location below the P/N junction and the implant annealed. An E-beam radiation process then is applied to the entire wafer and is also annealed. The diode then has very soft recover...
07/17/2001
6229157Method of forming a polysilicon diode and devices incorporating such diode
A method for manufacturing a diode having a relatively improved on-off ratio. The diode is formed in a container in an insulative structure layered on a substrate of an integrated circuit. The container is then partially filled with a polysilicon material...
05/08/2001
6221688Diode and method for manufacturing the same
A diode is provided which includes a first-conductivity-type cathode layer, a first-conductivity-type drift layer placed on the cathode region and having a lower concentration than the cathode layer, a generally ring-like second-conductivity-type ring reg...
04/24/2001
6194746Vertical diode structures with low series resistance
A vertical diode is provided having a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The di...
02/27/2001
6190996Method of making an insulator for electrical structures
Structures and methods are disclosed for insulating a polysilicon gate adjacent to an electrically active region with a silicon base layer. A layer of silicon nitride having a thickness in a range from about 100 Å to about 150 Å is conformally deposited...
02/20/2001
6190947Silicon semiconductor rectifier chips and manufacturing method thereof
This invention is directed to a semiconductor rectifier chip comprised of a semiconductor dice with at least one P-N junction, and the entire cutting surface of the dice sealed a passivation glass to omite the use of a expansion plate. The rectifier chip ...
02/20/2001
6180444Semiconductor device having ultra-sharp P-N junction and method of manufacturing the same
A semiconductor device such as a P-N or P-I-N junction diode, includes a first semiconductor layer having a first conductivity-type and being mounted over a metal address line, and a second semiconductor layer having a second conductivity-type and being m...
01/30/2001
6175143Schottky barrier
A diode is provided which includes a first-conductivity-type cathode layer, a first-conductivity-type drift layer placed on the cathode region and having a lower concentration than the cathode layer, a generally ring-like second-conductivity-type ring reg...
01/16/2001
6160306Diode of semiconductor device and method for manufacturing the same
A semiconductor diode device having the characteristic of soft recovery and a method for manufacturing the same. A first N+ layer contacts with a cathode electrode. An N- epitaxial layer is formed on the first N+ layer. A P- layer is formed to have an und...
12/12/2000
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