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Patent No. 5970981

Mouthguard made at least partially from an edible candy

A mouthguard includes a U-shaped upper bite plate which removably fits over upper teeth of a person, with the entire upper bite plate being made from a soft, deformable and edible gummi candy.

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Class 257/E21.128 - Carbon on a noncarbon semiconductor substrate (EPO)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E21.124. This subclass
No. of patents: 13
Last issue date: 05/06/2008


NumberTitleIssue Date
7368823Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device having an interconnection part formed of multiple carbon nanotubes is disclosed. The method includes the steps of (a) forming a growth mode control layer controlling the growth mode of the carbon nanotubes, (b) formin...
05/06/2008
7288490Increased alignment in carbon nanotube growth
Method and system for fabricating an array of two or more carbon nanotube (CNT) structures on a coated substrate surface, the structures having substantially the same orientation with respect to a substrate surface. A single electrode, having an associated voltage s...
10/30/2007
7285483Coated semiconductor wafer, and process and apparatus for producing the semiconductor wafer
A susceptor configured to receive a semiconductor wafer for deposition of a layer on a front surface of the semiconductor wafer by chemical vapor deposition (CVD) has a gas-permeable structure with a porosity of at least 15%, a density of from 0.5 to 1.5 g/cm3
10/23/2007
5656828Electronic component with a semiconductor composite structure
The invention relates to a semiconductor composite structure for an electronic component. The semiconductor composite structure comprises a diamond layer, which is substantially undoped except for unavoidable impurities, one side of which is covered by a ...
08/12/1997
5525537Process of producing diamond composite structure for electronic components
The invention relates to a composite structure for electronic components comprising a growth substrate, an intermediate layer having substantially a crystallographic lattice structure arranged on the growth substrate, and a diamond layer applied on top of...
06/11/1996
5488232Oriented diamond film structures on non-diamond substrates
The present invention provides a semiconductor device comprising a first layer of a metal silicide and a second layer on the first metal silicide layer; the second layer comprising a semiconducting diamond film. The present invention also provides a metho...
01/30/1996
5306928Diamond semiconductor device having a non-doped diamond layer formed between a BN substrate and an active diamond layer
A semiconductor device utilizing a non-doped diamond layer between a substrate and an active diamond layer. Such a structure decreases the resistivity and increases the carrier density. Further, when contacts are formed on the active layer, this layer str...
04/26/1994
5304461Process for the selective deposition of thin diamond film by gas phase synthesis
Thin diamond films can be selectively deposited imagewise on a substrate by gas phase synthesis. The substrate may be either a silicon substrate or a basal thin diamond film formed beforehand on a substrate by gas phase synthesis. Where a silicon substrat...
04/19/1994
5196366Method of manufacturing electric devices
A method of manufacturing electric devices is described. Discrete single crystals are formed on a substrate to be coated. The formation of these crystals is carried out by forming discrete crystallization centers in the surface of the substrate and growin...
03/23/1993
5144380Diamond semiconductor device with a non-doped diamond thin film between a diamond active layer and a substrate
A semiconductor device utilizing a nondoped diamond layer between a substrate and an active diamond layer. Such a structure decreases the resistivity and increases the carrier density. Further, when contacts are formed on the active layer, this layer stru...
09/01/1992
5086014Schottky diode manufacturing process employing the synthesis of a polycrystalline diamond thin film
A schottky diode manufacturing process employing diamond film comprises forming a B-doped p-type polycrystalline diamond film on a low-resistance p-type Si substrate by CVD using a source gas consisting of CH4, H2 and B2 H...
02/04/1992
5006203Diamond growth method
Preferred embodiments first adjust reactor conditions to grow a diamondlike film (114) on a silicon substrate (102). Reactor conditions are then adjusted to etch the diamondlike film surface, providing a high density of diamond nucleation sites (108). Fin...
04/09/1991
4863529Thin film single crystal diamond substrate
A thin film single crystal diamond substrate which comprises a base substrate selected from the group consisting of a single crystal silicon substrate and a single crystal GaAs substrate, an intermediate layer consisting of single crystal silicon carbide ...
09/05/1989
 
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