Class 257/E21.084 - Treatment of complete device, e.g., electroforming, heat treating (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E21.078. This subclass
No. of patents: 3
Last issue date: 03/25/2008

Number	Title	Issue Date
7348234	Methods of forming capacitor constructions The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si...	03/25/2008
7316969	Method and apparatus for thermally treating substrates The object of the disclosure is to measure temperature using pyrometers, in a simple and economic way, enabling precise temperature measurement, even for low temperatures. The disclosure presents an apparatus and method for thermally treating substrates, wherein the...	01/08/2008
7276438	Method of manufacturing wiring substrate A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserti...	10/02/2007

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