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| Number | Title | Issue Date |
| 7361588 | Etch process for CD reduction of arc material A method of reducing critical dimensions of a feature in a anti-reflective coating layer structure can utilize a polymerizing agent. The anti-reflective coating structure can be utilized to form various integrated circuit structures. The anti-reflective coating can ... | 04/22/2008 |
| 7354781 | Method of manufacturing field emission device A method of manufacturing a field emission device (FED) using a photoresist for performing multi-patterning processes, whereby different structures can be multi-patterned using a single photoresist mask. The photoresist has a solubility to a solvent by post-exposure... | 04/08/2008 |
| 7332444 | Method for smoothing areas in structures by utilizing the surface tension A method for smoothing areas of a structure made of a first material having a predetermined first glass transition temperature on a carrier includes the steps of: (1) applying a second material having a predetermined second glass transition temperature, so that the ... | 02/19/2008 |
| 7329618 | Ion implanting methods An ion implanting method includes forming a pair of spaced and adjacent features projecting outwardly from a substrate. At least outermost portions of the pair of spaced features are laterally pulled away from one another with a patterned photoresist layer received ... | 02/12/2008 |
| 7294586 | Method of processing a substrate, heating apparatus, and method of forming a pattern A method of processing a substrate, comprising forming a chemically amplified resist film on a substrate, irradiating energy beams to the chemically amplified resist film to form a latent image therein, carrying out heat treatment with respect to the chemically ampl... | 11/13/2007 |
| 7276452 | Method for removing mottled etch in semiconductor fabricating process A method for removing mottled etch in a semiconductor fabricating process, prevents mottled etch from being generated after etching, by performing ashing using an oxide plasma, prior to performing wet etching using a photoresist pattern. The method for removing the ... | 10/02/2007 |
| 7253113 | Methods for using a silylation technique to reduce cell pitch in semiconductor devices A method for forming a semiconductor device having a reduced pitch is provided. The method includes providing a substrate, forming a material layer over the substrate, forming a photoresist layer over the material layer, exposing a top surface of the photoresist lay... | 08/07/2007 |
| 7226852 | Preventing damage to low-k materials during resist stripping A method of forming a feature in a low-k dielectric layer is provided. A low-k dielectric layer is placed over a substrate. A patterned photoresist mask is placed over the low-k dielectric layer. At least one feature is etched into the low-k dielectric layer. A CO c... | 06/05/2007 |
| 7226873 | Method of improving via filling uniformity in isolated and dense via-pattern regions An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-patt... | 06/05/2007 |
| 7157319 | Method of patterning a thin film transistor that includes simultaneously forming a gate electrode and a pixel electrode A high-precision patterning is conducted with a half-tone resist thickness being prevented from varying due to the presence/absence of a base film. A transmitting portion and two kinds of semi-transmitting portions, providing different quantities of transmitted ligh... | 01/02/2007 |
| 7157377 | Method of making a semiconductor device using treated photoresist A semiconductor device is made by patterning a conductive layer for forming gates of transistors. The process for forming the gates has a step of patterning photoresist that overlies the conductive layer. The patterned photoresist is trimmed so that its width is red... | 01/02/2007 |
| 7144752 | Method of manufacturing organic electroluminescent display device and organic electroluminescent display device, and display device equipped with organic electroluminescent display device A method of manufacturing an organic electroluminescent display device, an organic electroluminescent display device, and a display device equipped with an organic electroluminescent display device are provided that enable a microlens to be formed without affecting ... | 12/05/2006 |
| 7053030 | Silicone hyper-branched polymer surfactant, method of preparing the same and method of rinsing using a rinsing solution comprising the same A silicone hyper-branched polymer surfactant is included in a rinsing solution which may be used to remove photoresist residues. The silicone hyper-branched polymer surfactant is prepared by polymerizing a monomer represented by the following chemical formula (1), w... | 05/30/2006 |
| 6677242 | Integrated shallow trench isolation approach A method for processing a silicon substrate disposed in a substrate process chamber includes transferring the substrate into the substrate process chamber. The substrate having a hard mask formed thereon and a patterned photoresist overlying the hard mask... | 01/13/2004 |
| 6673714 | Method of fabricating a sub-lithographic sized via A method of fabricating a sub-lithographic sized via is disclosed. A dual-polymer method is used to form a stacked layer of polymer materials wherein a first polymer layer has a first etch rate and a second polymer layer has a second etch rate. The first ... | 01/06/2004 |
| 6660459 | System and method for developing a photoresist layer with reduced pattern collapse A method of developing a photoresist layer on a semiconductor wafer in a developing chamber includes applying a developer to the photoresist layer, applying an alcohol rinse to the photoresist layer, and drying the wafer.... | 12/09/2003 |
| 6653030 | Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features A method and system for fabricating micron and sub-micron-sized features within a polymer layer of a nascent semiconductor device or other micro-device or nano-device. Small features are directly imprinted with an optical-mechanical stamp having correspon... | 11/25/2003 |
| 6645702 | Treat resist surface to prevent pattern collapse The present invention relates to systems and methods for increasing the hydrophobicity of patterned resists. In one embodiment, the present invention relates to a method of processing an ultra-thin resist, involving depositing the ultra-thin photoresist o... | 11/11/2003 |
| 6645851 | Method of forming planarized coatings on contact hole patterns of various duty ratios A method of forming a planarized photoresist coating on a substrate having holes with different duty ratios is described. A first photoresist preferably comprised of a Novolac resin and a diazonaphthoquinone photoactive compound is coated on a substrate a... | 11/11/2003 |
| 6638833 | Process for the fabrication of integrated devices with reduction of damage from plasma The process for the fabrication of an electronic device has the steps of forming a layer to be etched on top of a substrate in a wafer of semiconductor material; depositing a masking layer; and carrying out a plasma etch to define the geometry of the laye... | 10/28/2003 |
| 6630404 | Reducing feature dimension using self-assembled monolayer A method of fabricating a feature of an integrated circuit in a layer of material includes providing a layer of photoresist over the layer of material; exposing the layer of photoresist to a source of radiation to form an aperture therein, wherein the ape... | 10/07/2003 |
| 6602794 | Silylation process for forming contacts A method of forming narrow trenches in a layer of photoresist is disclosed. The method includes providing a photoresist layer and patterning the photoresist layer to form a plurality of apertures having sidewalls. The method can also include silylating th... | 08/05/2003 |
| 6593063 | Method of manufacturing a semiconductor device having an improved fine structure A first resist layer, capable of generating an acid, is formed on a semiconductor base layer and is developed in a shortened developing time than usual. The first resist pattern is covered with a second resist layer containing a material capable of crossl... | 07/15/2003 |
| 6579657 | Material for forming a fine pattern and method for manufacturing a semiconductor device using the same A resist pattern, containing a material capable of generating an acid by exposure to light, is covered with a resist containing a material capable of crosslinkage in the presence of an acid. The acid is generated in the resist pattern by application of he... | 06/17/2003 |
| 6576536 | Ultra narrow lines for field effect transistors A method of fabricating an ultra narrow gate electrode for an FET and/or a conductive line in an integrated circuit by first forming a mask for the gate electrode and/or conductive line on a semiconductor substrate of minimal width dimension by optical li... | 06/10/2003 |
| 6548385 | Method for reducing pitch between conductive features, and structure formed using the method A method is described which may be used to reduce a pitch between conductive features. One embodiment of the method involves forming a structure including a substrate, a conductive layer on the substrate, multiple photoresist features arranged on the cond... | 04/15/2003 |
| 6426273 | Preprocessing method of metal film forming process A preprocessing method of a metal film formation process before formation of a BLM film on a resist film of a substrate to be processed, wherein the resist film of substrate to be processed is irradiated with plasma, utilizing a plasma processing apparatu... | 07/30/2002 |
| 6358793 | Method for localized masking for semiconductor structure development Container structures for use in integrated circuits and methods of their manufacture without the use of mechanical planarization such as chemical-mechanical planarization (CMP), thus eliminating CMP-induced defects and variations. The methods utilize loca... | 03/19/2002 |
| 6180528 | Method for forming a minute resist pattern and method for forming a gate electrode A method for forming a resist pattern includes the steps of: forming a dummy pattern on a semiconductor substrate using one type of a photosensitive resist; applying a resist mask on the semiconductor substrate so as to bury the dummy pattern using an opp... | 01/30/2001 |
| 6136661 | Method to fabricate capacitor structures with very narrow features using silyated photoresist A method of fabrication of a storage capacitors for DRAM memory cells using silylated photoresist is described. Partially completed DRAM memory cells comprising wordline transistor gates and bitline source and drain regions is provided. Conductive plugs a... | 10/24/2000 |
| 6121154 | Techniques for etching with a photoresist mask A method for improving profile control during an etch of a nitride layer disposed above a silicon substrate is disclosed. The nitride layer 106 is disposed below a photoresist mask 108A. The method includes positioning the substrate, including the nitride... | 09/19/2000 |
| 6103457 | Method for reducing faceting on a photoresist layer during an etch process Disclosed is a method for reducing faceting of a photoresist layer during an etch process. The method includes depositing a metallization layer on a semiconductor substrate, and forming a photoresist layer over at least a portion of the metallization laye... | 08/15/2000 |
| 6069077 | UV resist curing as an indirect means to increase SiN corner selectivity on self-aligned contact etching process A method of forming a self-aligned contact in the fabrication of an integrated circuit is described. Semiconductor device structures are formed on a semiconductor substrate wherein their top and side surfaces are covered by a silicon nitride layer. A diag... | 05/30/2000 |
| 6013580 | Preprocessing method of metal film forming process A preprocessing method of a metal film formation process before formation of a BLM film on a resist film of a substrate to be processed, wherein the resist film of substrate to be processed is irradiated with plasma, utilizing a plasma processing apparatu... | 01/11/2000 |
| 5907791 | Method of making semiconductor devices by patterning a wafer having a non-planar surface In accordance with a specific deposition/etching sequence, a multi-layer metallization system is formed on the non-planar top surface of a semiconductor wafer. In an electrophoretic deposition step, a conformal uniform-thickness layer of a resist material... | 05/25/1999 |
| 5903023 | Semiconductor device, method of fabricating the same, and sputtering apparatus A method of fabricating a semiconductor device comprises the steps of: (a) forming a mask layer over an upper surface of a semiconductor substrate such that the mask layer has an aperture penetrating the mask layer and having an inclined lateral wall so a... | 05/11/1999 |
| 5902704 | Process for forming photoresist mask over integrated circuit structures with critical dimension control A process for forming a photoresist mask over a patternable layer of an integrated circuit structure formed on a semiconductor substrate is described wherein the photoresist mask is initially formed with oversized lateral dimensions over a layer of patter... | 05/11/1999 |
| 5888845 | Method of making high sensitivity micro-machined pressure sensors and acoustic transducers A method of making a pressure sensor or acoustic transducer having high sensitivity and reduced size. A thin sensing diaphragm is produced by growing a single crystal, highly doped silicon layer on a substrate using a chemical vapor deposition process. Th... | 03/30/1999 |
| 5858620 | Semiconductor device and method for manufacturing the same A first resist pattern, which is capable of generating an acid, is formed on a semiconductor device layer. Over the first resist pattern, a layer of a second resist, which is capable of undergoing an cross-linking reaction in the presence of an acid, is f... | 01/12/1999 |
| 5763123 | Method for producing thin-film substrate The present invention relates to a method for producing a thin film substrate for forming a thin film circuit pattern on a substrate by repeating the lithography process using a photoresist and provides a method for producing a thin film having a high yie... | 06/09/1998 |
