Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
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| Number | Title | Issue Date |
| 8188503 | Cuttable illuminated panel An illumination apparatus is provided having a panel including a plurality of circuit units on a dielectric surface. The circuit units include electrically conductive traces and at least one light emitting diode (LED). At least some of the circuit units have contact... | 05/29/2012 |
| 8188506 | Semiconductor light emitting device A semiconductor light emitting device and corresponding method of manufacture, where the semiconductor light emitting device includes a light emitting structure, a second electrode layer, an insulating layer, and a protrusion. The light emitting structure comprises ... | 05/29/2012 |
| 8188507 | Light emitting device package and method for fabricating the same Provided are a light emitting device package and a method for fabricating the same. The light emitting device package comprises a substrate; a light emitting device on the substrate; a zener diode comprising a first conductive type impurity region and two second con... | 05/29/2012 |
| 8188505 | Light-emitting device A light-emitting device comprises a substrate, an epitaxial structure formed on the substrate including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer formed between the first semiconductor layer and the second semiconductor la... | 05/29/2012 |
| 8188508 | Semiconductor light emitting device with a contact formed on a textured surface A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure includes an n-contact region and a p-contact region. A cross section of the n-contact region comprises a ... | 05/29/2012 |
| RE43412 | LED with self aligned bond pad A method is disclosed for attaching a bonding pad to the ohmic contact of a diode while reducing the complexity of the photolithography steps. The method includes the steps of forming a blanket passivation layer over the epitaxial layers and ohmic contacts of a diod... | 05/29/2012 |
| 8188504 | Light-emitting device and method for manufacturing the same including a light-emitting device and a protection device electrically connected by a connecting line Provided are a light-emitting device and a method for manufacturing the same. The light-emitting device includes a substrate, a light-emitting device, a protection device, and a connecting line. The light-emitting device is formed on one part of the substrate, and i... | 05/29/2012 |
| 8183592 | Light emitting device having a pluralilty of light emitting cells and package mounting the same A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light e... | 05/22/2012 |
| 8183591 | Light-emitting devices Light-emitting devices are provided, the light-emitting devices include a light-emitting structure layer having a first conductive layer, a light-emitting layer and a second conductive layer sequentially stacked on a first of a substrate, a plurality of seed layer p... | 05/22/2012 |
| 8183590 | Image display apparatus having raised parts disposed on a substrate An image display apparatus displaying an image by selectively emitting light from a plurality of semiconductor light emitting elements being regularly arranged, includes a substrate; a first conductive wiring layer being formed on the substrate and supplying a first... | 05/22/2012 |
| 8178892 | LED chip having micro-lens structure A light-emitting diode (LED) chip having a micro-lens structure includes a light-emitting structure and a light guide lens. The light-emitting structure emits a light from a light-emitting surface upon being applied with a current, and the light guide lens is stacke... | 05/15/2012 |
| 8178893 | Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent, for example, a light emitting element such as a semiconductor laser f... | 05/15/2012 |
| 8178895 | Semiconductor light-emiting device and method A semiconductor light-emitting device can include a submount on which a semiconductor light-emitting element is mounted. The device can have a high light utilization efficiency with high reliability and can achieve a reduction in manufacturing cost as well as a decr... | 05/15/2012 |
| 8178894 | Light emitting device package and method of fabricating the same A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting ... | 05/15/2012 |
| 8174043 | Light emitting apparatus In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead frame is sealed with a sealed portion formed by a silicone resin. An ... | 05/08/2012 |
| 8174044 | Light emitting diode package and method for forming the same A light emitting diode package is provided, which includes a semiconductor substrate having a first surface and a second surface; at least a through-hole passing through the semiconductor substrate; a thermal via formed extending from the second surface toward the f... | 05/08/2012 |
| 8168997 | Light emitting diode package Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electricall... | 05/01/2012 |
| 8168996 | Semiconductor light emitting device An excellent light emitting element capable of improving problems caused by a material having high light-reflectivity and susceptible to electromigration, especially Al used for the electrode. FIG. 2A depicts semiconductor light emitting element having a firs... | 05/01/2012 |
| 8168994 | Light emitting diode comprising semiconductor nanocrystal complexes A light emitting diode (LED) formed by depositing an LED chip and coupling a stability layer to the LED chip. Semiconductor nanocrystals are placed in a first matrix material to form a nanocrystal complex layer. The nanocrystal complex layer is deposited on top of t... | 05/01/2012 |
| 8168995 | Nitride based semiconductor light emitting diode A nitride based semiconductor LED is provided. In the nitride based semiconductor LED, an n-type nitride semiconductor layer is formed on a substrate. The n-type nitride semiconductor layer has the top surface divided into a first region and a second region with a f... | 05/01/2012 |
| 8158999 | Reinforced chip package structure A reinforced chip package structure includes a light emitting element, a base, and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting element. The base deck and the bearing deck are interposed by an elev... | 04/17/2012 |
| 8159000 | LED package having an array of light emitting cells coupled in series Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Si... | 04/17/2012 |
| 8154046 | Semiconductor light emitting device including bonding layer and semiconductor light emitting device package A light emitting device is provided. The light emitting device comprises: a conductive support substrate; a bonding layer on the conductive support substrate; a reflective layer on the bonding layer; and a light emitting structure layer on the reflective layer. The ... | 04/10/2012 |
| 8154044 | Light emitting diode package structure and method for fabricating the same A light emitting diode and method for fabricating the same are provided. The light emitting diode comprises a lead frame. A first material body is formed on the lead frame, wherein the first material body comprises a tip, an inner surface and an outer surface. A sec... | 04/10/2012 |
| 8154045 | Semiconductor light-emitting device A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of th... | 04/10/2012 |
| 8148747 | Semiconductor chip assembly with post/base/cap heat spreader A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a ... | 04/03/2012 |
| 8148746 | Semiconductor light emitting device A semiconductor light emitting device (A1) includes a case (1) and a plurality of semiconductor light emitting elements (3) arranged in the case. The case (1) is formed with a plurality of reflectors (11) each in the form of a trun... | 04/03/2012 |
| 8148745 | Semiconductor light emitting module and method for manufacturing the same A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first direction contained in the plane of the first die bonding pad. The second le... | 04/03/2012 |
| 8143642 | Light emitting diode The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality... | 03/27/2012 |
| 8143641 | Integrated-type LED and manufacturing method thereof The present invention provides an integrated-type LED and method for manufacturing the same. This integrated-type LED comprises a base board which having a preplaced circuit and at least one LED chip. P electrode and N electrode of the LED chip are respectively conn... | 03/27/2012 |
| 8138518 | Light emitting diode, package structure and manufacturing method thereof A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semicon... | 03/20/2012 |
| 8138517 | Light-emitting diode package An LED package is provided. The LED package includes a leadframe having a pair of first electrodes and a pair of second electrodes, an LED chip disposed on the leadframe, and an encapsulant encapsulating a portion of the leadframe and the LED chip. The pair of first... | 03/20/2012 |
| 8134173 | Lighting device having light emitting element mounted in glass substrate A lighting device has a glass substrate and a lead frame embedded in the glass substrate. The glass substrate has a front surface, a side surface and a rear surface, the front surface having a recess portion with a bottom surface. The lead frame has a portion expose... | 03/13/2012 |
| 8134174 | Light-emitting diode A light-emitting diode and a method for manufacturing the same are described. The light-emitting diode includes a bonding substrate, a first conductivity type electrode, a bonding layer, an epitaxial structure, a second conductivity type electrode, a growth substrat... | 03/13/2012 |
| 8134172 | LED and fabrication method thereof A light emitting diode is provided. The diode includes: a substrate; a first nitride gallium layer disposed above the substrate; a first electrode provided at one portion of and above the first nitride gallium layer; an active layer provided above the first nitride ... | 03/13/2012 |
| 8129740 | Side view LED package and back light module comprising the same Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a hor... | 03/06/2012 |
| 8129739 | Semiconductor light emitting device and semiconductor light emitting device mounted board In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers, the occurrence of a faulty junction after mounting can be suppressed... | 03/06/2012 |
| 8129741 | Light emitting diode package The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity a... | 03/06/2012 |
| 8129742 | Semiconductor chip assembly with post/base heat spreader and plated through-hole A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is e... | 03/06/2012 |
| 8124998 | Light emitting device package A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be elec... | 02/28/2012 |
