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| Number | Title | Issue Date |
| 7679203 | Methods of forming thermoelectric devices using islands of thermoelectric material and related structures A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are ... | 03/16/2010 |
| 7440449 | High speed switching module comprised of stacked layers incorporating t-connect structures A compact multi-stage switching network (100), and a router (510) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports (110) to selected ones of a ... | 10/21/2008 |
| 7351996 | Method of increasing efficiency of thermotunnel devices The present invention comprises a tunneling device in which the collector electrode is modified so that tunneling of higher energy electrons from the emitter electrode to the collector electrode is enhanced. In one embodiment, the collector electrode is contacted wi... | 04/01/2008 |
| 7321157 | CoSb-based thermoelectric device fabrication method A method of fabricating a CoSb3-based thermoelectric device is disclosed. The method includes providing a high-temperature electrode, providing a buffer layer on the high-temperature electrode, forming composite n-type and p-type layers, attaching the buf... | 01/22/2008 |
| 7301233 | Semiconductor chip package with thermoelectric cooler The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-ty... | 11/27/2007 |
| 7282798 | Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation A method and structure for heat transport, cooling, sensing and power generation is described. A photonic bandgap structure (3) is employed to enhance emissive heat transport from heat sources such as integrated circuits (2) to heat spreaders (4... | 10/16/2007 |
| 7224059 | Method and apparatus for thermo-electric cooling Embodiments of the present invention provide a method, apparatus and system for absorbing heat from an active side of a die by a plurality of cold conductive elements embedded in said die, and releasing said absorbed heat by a plurality of hot conductive elements em... | 05/29/2007 |
| 7218523 | Liquid cooling system Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat... | 05/15/2007 |
| 7211891 | Electronic heat pump device, laser component, optical pickup and electronic equipment There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically a... | 05/01/2007 |
| 7205675 | Micro-fabricated device with thermoelectric device and method of making A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to th... | 04/17/2007 |
| 7157801 | Device and a method for thermal sensing A device for thermal sensing is disclosed based on one thermopile. The cold junctions of the thermopile are coupled thermally to a first channel comprising a first substance while the hot junctions of the thermopile are coupled thermally to a second channel comprisi... | 01/02/2007 |
| 7095042 | Electrode structure, semiconductor light-emitting device having the same and method of manufacturing the same A semiconductor light emitting device including a p-type electrode structure and having a low contact resistance and high reflectance is provided. The semiconductor light emitting device includes a transparent substrate, an electron injection layer having first and ... | 08/22/2006 |
| 7081677 | Thermoelectric module A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an ... | 07/25/2006 |
| 7067913 | Semiconductor cooling system and process for manufacturing the same A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer sp... | 06/27/2006 |
| 7038234 | Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs A super-lattice thermoelectric device. The device includes p-legs and n-legs, each leg having a large number of alternating layers of two materials with differing electron band gaps. The n-legs in the device are comprised of alternating layers of silicon and silicon... | 05/02/2006 |
| 7022553 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The... | 04/04/2006 |
| 6969907 | Cooling structure for multichip module A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation p... | 11/29/2005 |
| 6919630 | Semiconductor package with heat spreader A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with a heat spreader, and which is characterized by the provision of a plu... | 07/19/2005 |
| 6891278 | Semiconductor component A semiconductor component has at least one Peltier element and at least one thermogenerator element that are thermally coupled to one another via a coupling device. By virtue of the thermal coupling of the Peltier element and the thermogenerator element through the ... | 05/10/2005 |
| 6858154 | Thermoelectric material and method of manufacturing the same A thermoelectric material having large thermoelectric figure of merit is provided. A thin film comprising nanometer-sized particles having their diameters distributing within the range of 0.5 nm though 100 nm both inclusive is formed by depositing the nanometer-size... | 02/22/2005 |
| 6829237 | High speed multi-stage switching network formed from stacked switching layers A compact multi-stage switching network (100), and a router (510) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports (110) to selected ones of a ... | 12/07/2004 |
| 6828579 | Thermoelectric device with Si/SiC superlattice N-legs A superlattice thermoelectric device. The device includes p-legs and n-legs, each leg includes a large number of at least two different very thin alternating layers of elements. The n-legs in the device includes alternating layers of silicon and silicon carbide. In ... | 12/07/2004 |
| 6812563 | Microcooling device A microcooling device is provided. The microcooling device includes a substrate, a microchannel array, and a condenser. A predetermined region of a lower surface of the substrate contacts a heat source. The microchannel array is placed on the substrate so that a coo... | 11/02/2004 |
| 6809392 | Micromachined device having electrically isolated components and a method for making the same A micromachined structure having electrically isolated components is formed by thermomigrating a dopant through a substrate to form a doped region within the substrate. The doped region separates two portions of the substrate. The dopant is selected such that the do... | 10/26/2004 |
| 6800933 | Integrated circuit cooling device Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor str... | 10/05/2004 |
| 6774298 | Thermoelectric module and method of producing the same A thermoelectric module which includes case 1, heat-radiation side insulating substrate 4a, heat-absorption side insulating substrate 4b, first soldering layer 5a formed of a first soldering agent to connect the heat-... | 08/10/2004 |
| 6770808 | Thermoelectric module and method of assembling the thermoelectric module in a radiating member A thermoelectric module includes plural thermoelectric semiconductor chips connected in series, first and second substrates, plural first and second electrodes formed on the first and second substrates, first solder through which the first and second electrodes are ... | 08/03/2004 |
| 6762938 | Apparatus and method for providing auxiliary cooling and thermal stability to an opto-electronic component Apparatus is disclosed for providing auxiliary cooling and thermal stability to a temperature sensitive opto-electronic component. The disclosed apparatus comprising a primary thermal control system having a first thermal connection with a primary structure supporti... | 07/13/2004 |
| 6762484 | Thermoelectric element The invention relates to a thermoelectric element comprising at least one n-type layer (1) and at least one p-type layer (2) of one or more doped semiconductors, whereby the n-type layer(s) (2) are arranged to form at least one pn-type junction ... | 07/13/2004 |
| 6743972 | Heat dissipating IC devices Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits. ... | 06/01/2004 |
| 6727422 | Heat sink/heat spreader structures and methods of manufacture A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also discl... | 04/27/2004 |
| 6727423 | Thermoelectric module and process for producing thermoelectric module A thermoelectric module includes a case, a insulating base plate for a exoergic side, a insulating base plate for endoergic side, a first soldering layer which joins the insulating base plate for the exoergic side to the case via a first soldering material, and a se... | 04/27/2004 |
| 6711018 | Heat-dissipating module In a heat-dissipating module for an electronic device, a heat-conducting unit is adapted to be disposed in close contact with a heat-generating component, and includes inner and outer tubes that cooperatively confine an enclosed chamber filled with a thermal superco... | 03/23/2004 |
| 6696635 | Thermoelectrically cooling electronic devices A thermoelectric cooler utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one.... | 02/24/2004 |
| 6697399 | Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip A bottom plate (4a) of a box-shaped package (4) is made of a metal. Portions of the package (4) (peripheral wall (4b) and cover plate (4c)) other than the bottom plate (4a) are made of a resin or a ceramic that is more economical than the metal. The mater... | 02/24/2004 |
| 6686532 | Heat sink/heat spreader structures and methods of manufacture A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is... | 02/03/2004 |
| 6667548 | Diamond heat spreading and cooling technique for integrated circuits A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which... | 12/23/2003 |
| 6639242 | Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits A method and structure for a semiconductor structure that includes a substrate having at least one integrated circuit heat generating structure is disclosed. The invention has at least one integrated circuit cooling device on the substrate adjacent the he... | 10/28/2003 |
| 6613602 | Method and system for forming a thermoelement for a thermoelectric cooler A method and system for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a substrate having a plurality of pointed tips covered by a metallic layer is formed. Portions of the metallic layer are covered by an insulator and... | 09/02/2003 |
| 6586835 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory... | 07/01/2003 |
