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| Number | Title | Issue Date |
| 8188490 | Organic light emitting diode and manufacturing method thereof The present invention discloses an organic light emitting diode and a manufacturing method thereof. The OLED comprises a first electrode, a first hole-transporting layer disposed on the first electrode, a second hole-transporting layer disposed on the first hole-tra... | 05/29/2012 |
| 8188489 | Light emitting diode for AC operation The present invention discloses a light emitting diode (LED) including a plurality of light emitting cells arranged on a substrate. The LED includes half-wave light emitting units each including at least one light emitting cell, each half-wave light emitting unit in... | 05/29/2012 |
| 8188491 | Light emitting device Light-emitting elements have a problem that their light-extraction efficiency is low due to scattered light or reflected light inside the light-emitting elements. The light-extraction efficiency of the light-emitting elements needs to be enhanced by a new method. Ac... | 05/29/2012 |
| 8183582 | Bare die semiconductor device configured for lamination A bare die semiconductor device, e.g., a bare die LED, includes a substrate having a bottom face and a bottom die electrode. There is also a top face having a top face edge, a top face area, a top face periphery and a top die electrode. A semiconductor material prov... | 05/22/2012 |
| 8178886 | Multi-layered LED epitaxial structure with light emitting unit A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light emitting unit, on the temporary substrate, wherein a first surface of the l... | 05/15/2012 |
| 8174032 | Semiconductor white light sources Semiconductor white light sources presented herein include special combinations of a blue source and a yellow source where these light fields are substantially overlapped. The source of blue light includes a blue emitting semiconductor operating in a conventional ma... | 05/08/2012 |
| 8174033 | Light emission device including semiconductor light emitting elements A light emission device includes a plurality of semiconductor light emitting elements and a supporting substrate on which the plurality of semiconductor light emitting elements are flip-chip mounted. Each of the plurality of semiconductor light emitting elements has... | 05/08/2012 |
| 8168990 | Apparatus for dissipating thermal energy generated by current flow in semiconductor circuits A thermal energy dissipating arrangement includes a semiconductor device and a thermally conductive medium. The semiconductor device includes a semiconductor circuit defining a semiconductor junction and encapsulating material in physical contact with and surroundin... | 05/01/2012 |
| 8168989 | LED light source and method of manufacturing the same After the LEDs 2 (red LEDs (R), green LEDs (G) and blue LEDs (B), or white LEDs (W)) are mounted on the frame 3, without dicing the frame 3 for dividing the LEDs 2 into pieces, the tie bar is punched off to form an electric circuit. Thus,... | 05/01/2012 |
| 8164102 | Semiconductor light emitting device A semiconductor light emitting device may include a first lead; a second lead; a first semiconductor light emitting element mounted on the first lead, being configured to emit a light having an optical emission spectrum no more than 400 nm from a light extraction su... | 04/24/2012 |
| 8158992 | Self-light-emitting device and method of manufacturing the same Failure light emission of an EL element due to failure film formation of an organic EL material in an electrode hole 46 is improved. By forming the organic EL material after embedding an insulator in an electrode hole 46 on a pixel electrode and formin... | 04/17/2012 |
| 8154032 | Electrooptical device, electronic apparatus, and method for producing electrooptical device An electrooptical device having a plurality of light-emitting regions includes a substrate, a bank disposed in a region other than the light-emitting regions on the substrate so as to surround the light-emitting regions, and a functional layer disposed in openings s... | 04/10/2012 |
| 8154031 | Module comprising radiation-emitting semiconductor bodies A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted between two adjacent radiation-emitting semiconduc... | 04/10/2012 |
| 8148739 | LED package structure An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. ... | 04/03/2012 |
| 8143631 | Layered structure for use with high power light emitting diode systems A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexib... | 03/27/2012 |
| 8138508 | LED chip package structure with different LED spacings and a method for making the same An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LEDs are separated from e... | 03/20/2012 |
| 8138509 | Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A lumine... | 03/20/2012 |
| 8134164 | Semiconductor device, optical print head and image forming apparatus A semiconductor device and an optical print head, an image forming apparatus that has the semiconductor device are supplied capable of reduce occurrence probability of defect. The semiconductor device is formed by using semiconductor thin film bonded on the substrat... | 03/13/2012 |
| 8134163 | Light-emitting diodes on concave texture substrate A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the s... | 03/13/2012 |
| 8129730 | Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates ... | 03/06/2012 |
| 8129731 | Light emitting diode lighting device The present invention relates to a light emitting diode (LED) lighting device (10). The lighting device comprises a light guide plate (12), and a plurality of LEDs (16) accommodated in holes (14) arranged in the plane of the light guide. ... | 03/06/2012 |
| 8129729 | Light emitting device having light emitting elements and an air bridge line A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED array... | 03/06/2012 |
| 8129732 | Nitride semiconductor light-emitting device and method for fabrication thereof An adhesion layer of a hexagonal crystal is laid on a facet an optical resonator of a nitride semiconductor laser bar having a nitride-based III-V group compound semiconductor layer, and a facet coat is laid on the adhesion layer. In this way, a structure in which t... | 03/06/2012 |
| 8124988 | Light emitting diode lamp package structure and assembly thereof The present invention provides a light emitting diode (LED) lamp package structure characterized in which a plurality of light emitting diodes, a control integrated circuit, a circuit board and four electric conductivity supports are encapsulated inside a package bo... | 02/28/2012 |
| 8120045 | Metal-based photonic device package module A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a ... | 02/21/2012 |
| 8115217 | Systems and methods for packaging light-emitting diode devices Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can ... | 02/14/2012 |
| 8115216 | Optoelectronic display and method of manufacturing the same An optoelectronic display comprising a plurality of pixels, each pixel comprising a plurality of sub-pixels, wherein the optoelectronic display comprises a colour-forming layer which is patterned providing a plurality of discrete colour-forming regions in a two-dime... | 02/14/2012 |
| 8115214 | Light emitting diode package and method of manufacturing the same Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light ... | 02/14/2012 |
| 8115215 | Array substrate and method for manufacturing the same An array substrate is disclosed. The array substrate comprises a substrate, a gate metal layer, a gate insulation layer, a semiconductor layer, a patterned metal layer, a flat layer, and a pixel electrode. The patterned metal layer is disposed on the surface of the ... | 02/14/2012 |
| 8106410 | Method of manufacturing display device and display device A method of manufacturing a display device including the steps of: forming drive elements on a substrate; forming a planarization film in a position corresponding to each of the drive elements; forming a bottom electrode corresponding to each of the plurality of org... | 01/31/2012 |
| 8106409 | Thin film transistor array panel A thin film transistor array panel is provided, which includes a substrate; a plurality of semiconductor islands formed on the substrate, the plurality of semiconductor islands including a plurality of first and second extrinsic regions, and a plurality of intrinsic... | 01/31/2012 |
| 8097889 | Light emitting device having light emitting elements with a shared electrode A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED array... | 01/17/2012 |
| 8093601 | Active matrix substrate In an active matrix substrate (100) of the present invention, a gate bus line (105) and a gate electrode (166) extend in the first direction (the x direction). At a contact portion (168) for electrically connecting the gate bus line (1... | 01/10/2012 |
| 8093602 | Stacked organic light-emitting device and imaging apparatus and image display apparatus having the same A stacked organic light-emitting device having a first organic compound layer and a second organic compound layer stacked on a substrate includes: a first light-emitting device in which the first organic compound layer is sandwiched between a first electrode and a s... | 01/10/2012 |
| 8093603 | Organic light emitting diode display An organic light emitting diode display includes a substrate, a pixel electrode, a pixel defining film, a light absorbing layer pattern, an organic light emitting layer and a common electrode. The pixel electrode is formed on the substrate, and the pixel defining fi... | 01/10/2012 |
| 8089078 | Light emitting device A light emitting device includes: a first semiconductor region; a second semiconductor region and third semiconductor region which are provided in the first semiconductor region; a first semiconductor light emitting element of which first electrode is electrically c... | 01/03/2012 |
| 8089077 | Light-emitting element array with micro-lenses and optical writing head A light-emitting element array with the improvement of the light-emitting efficiency and the improvement of the uneven amount of light is provided. A light-emitting element array comprises a light-emitting portion array consisting of a plurality of light-emit... | 01/03/2012 |
| 8084774 | Light emitting device having light emitting elements A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED array... | 12/27/2011 |
| 8076680 | LED package having an array of light emitting cells coupled in series Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Si... | 12/13/2011 |
| 8076679 | Nitride-based semiconductor light-emitting diode and illuminating device A plurality of semiconductor layers including a light-emitting layer (14) are formed on the main surface of a substrate (10) which is composed of a group III-V nitride semiconductor. A first n-type semiconductor layer (12) containing indium is f... | 12/13/2011 |
