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| Number | Title | Issue Date |
| 8158990 | Light emitting device using GaN LED chip A light emitting device is constituted by flip-chip mounting a GaN-based LED chip. The GaN-based LED chip includes a light-transmissive substrate and a GaN-based semiconductor layer formed on the light-transmissive substrate, wherein the GaN-based semiconductor laye... | 04/17/2012 |
| 8148738 | Semiconductor device having an element mounted on a substrate and an electrical component connected to the element In a semiconductor device 100, a light emitting element 120 has been mounted on an upper plane of a semiconductor substrate 102. In an impurity diffusion region of the semiconductor substrate 102, a P conducting type of a layer 104... | 04/03/2012 |
| 8110838 | Spatial localization of light-generating portions in LEDs Light-emitting devices (e.g., LEDs) and methods associated with such devices are provided. In some embodiments, the device includes a distribution of light-generating portions (including active regions) that are spatially localized and separated (e.g., horizontally ... | 02/07/2012 |
| 8101957 | Optical semiconductor device, laser chip and laser module An optical semiconductor device has a semiconductor substrate, an optical semiconductor region and a heater. The optical semiconductor region is provided on the semiconductor substrate and has a width smaller than that of the semiconductor substrate. The heater is p... | 01/24/2012 |
| 8058658 | High-speed optical interconnection device Provided is a high-speed optical interconnection device. The high-speed optical interconnection device includes a first semiconductor chip, light emitters, optical detectors, and a second semiconductor chip, which are disposed on a silicon-on-insulator (SOI) substra... | 11/15/2011 |
| 8022417 | Method of assembling semiconductor devices with LEDS Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one... | 09/20/2011 |
| 8022416 | Functional blocks for assembly A functional block for assembly includes at least one element and a patterned magnetic film comprising at least one magnetic region attached to the element. A wafer includes a host substrate comprising a number of elements. The wafer further includes a patterned mag... | 09/20/2011 |
| 7999269 | Light emitting apparatus and electronic device A light emitting apparatus includes a light emitting element formed on a surface of a substrate and a light receiving element formed on an area other than an area overlapping the light emitting element on the surface of the substrate, the light receiving element det... | 08/16/2011 |
| 7851810 | Method of manufacturing semiconductor light emitting device A semiconductor light emitting device includes a multi-layered semiconductor layer having at least a first conductive type cladding layer, an active layer, a second conductive type first cladding layer, an etching stop layer, and a second conductive type second clad... | 12/14/2010 |
| 7851811 | Stackable optoelectronics chip-to-chip interconnects and method of manufacturing An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to... | 12/14/2010 |
| 7812356 | Method of assembling semiconductor devices with LEDS Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one... | 10/12/2010 |
| 7791085 | Semiconductor light emitting apparatus Disclosed herein is a semiconductor light emitting apparatus that includes: a semiconductor light emitting device having a first semiconductor laminate structure including a light emitting region, and a light outgoing window permitting the light emitted from the lig... | 09/07/2010 |
| 7791086 | Device for defeating reverse engineering of integrated circuits by optical means An integrated circuit and method are provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the integrated circuit. The method prevents, in an integrated circuit, a pattern of light ... | 09/07/2010 |
| 7791087 | Device for defeating reverse engineering of integrated circuits by optical means An integrated circuit and method are provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the integrated circuit. The method prevents, in an integrated circuit, a pattern of light ... | 09/07/2010 |
| 7781781 | CMOS imager array with recessed dielectric A CMOS image sensor array and method of fabrication. The CMOS imager sensor array comprises a substrate; an array of light receiving pixel structures formed above the substrate, the array having formed therein “m” levels of conductive structures, each level form... | 08/24/2010 |
| 7781782 | Device for defeating reverse engineering of integrated circuits by optical means An integrated circuit and method are provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the integrated circuit. The method prevents, in an integrated circuit, a pattern of light ... | 08/24/2010 |
| 7772598 | Display device and manufacturing method therefor A display device, comprising an insulating substrate; a data conductor formed on the insulating substrate and comprising a conductive film; a thin film transistor having at least one source electrode electrically connected with the conductive film, and a drain elect... | 08/10/2010 |
| 7687811 | Vertical light emitting device having a photonic crystal structure A light emitting device having a vertical structure and a method for manufacturing the same, which are capable of increasing light extraction efficiency, are disclosed. The method includes forming a light extraction layer on a substrate, forming a plurality of semic... | 03/30/2010 |
| 7683383 | Light emitting device having circuit protection unit A light emitting device having a circuit protection unit is provided. The circuit protection unit has a low-resistance layer and a potential barrier layer, wherein a barrier potential exists at the interface between the low-resistance layer and the potential barrier... | 03/23/2010 |
| 7683384 | Ultra-thin alphanumeric display An alphanumeric display includes a substrate that has top and bottom surfaces, a plurality of electrical contacts on the top surface, a plurality of light-emitting electronic devices mounted on the top surface, and a plurality of electrical pads on the bottom surfac... | 03/23/2010 |
| 7679091 | Photoelectric conversion element having a semiconductor and semiconductor device using the same A semiconductor device, particularly, a photoelectric conversion element having a semiconductor layer is demonstrated. The photoelectric conversion element of the present invention comprises, over a substrate, a photoelectric conversion layer and first and second el... | 03/16/2010 |
| 7675074 | Light emitting device including a lamination layer A light emitting device having a plastic substrate is capable of preventing the substrate from deterioration with the transmission of oxygen or moisture content can be obtained. The light emitting device has light emitting elements formed between a lamination layer ... | 03/09/2010 |
| 7646029 | LED package methods and systems Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may incl... | 01/12/2010 |
| 7612382 | Method for defeating reverse engineering of integrated circuits by optical means A method for an electronic device is provided for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in the electronic device. The method emits extraneous randomized light emissions in substanti... | 11/03/2009 |
| 7569860 | Integrated photonic devices A laser (22) and detector (24) integrated on corresponding epitaxial layers of a single chip (20) cooperate with on-chip and/or external optics (62) to couple light of a first wavelength emitted by the laser to a single external device su... | 08/04/2009 |
| 7550774 | Light emission device, method of manufacturing same, electro-optical device and electronic device An organic EL display unit is manufactured in an efficient manner. A light emission device (1000) is manufactured by bonding together a driving circuit substrate (100) formed with driving circuit constituted by thin film transistors 11, and a li... | 06/23/2009 |
| 7535027 | Amorphous-silicon thin film transistor and shift resister having the same An amorphous-silicon thin film transistor and a shift register shift having the amorphous-silicon TFT include a first conductive region, a second conductive region and a third conductive region. The first conductive region is formed on a first plane spaced apart fro... | 05/19/2009 |
| 7521721 | Surface-emitting type device and its manufacturing method A surface-emitting type device includes a substrate including a first face and a second face that is tilted with respect to the first face and has a plane index different from a plane index of the first face, an emission section formed above the first face, and a re... | 04/21/2009 |
| 7514719 | Display device The invention provides a display device including an insulating substrate, a photosensor formed on the insulating substrate and including a semiconductor layer, an input terminal and an output terminal electrically connected to the semiconductor layer, a first insul... | 04/07/2009 |
| 7485898 | Method of manufacturing semiconductor devices Subjected to obtain a crystalline TFT which simultaneously prevents increase of OFF current and deterioration of ON current. A gate electrode of a crystalline TFT is comprised of a first gate electrode and a second gate electrode formed in contact with the first gat... | 02/03/2009 |
| 7435995 | Phosphor, semiconductor light emitting device, and fabrication method thereof A phosphor that emits white light due to excitation by a light emitting diode capable of emitting blue or ultraviolet light includes: a substrate that allows transmission of visible light; and a semiconductor layer formed on the substrate. ... | 10/14/2008 |
| 7432533 | Encapsulation of electronic devices with shaped spacers An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an u... | 10/07/2008 |
| 7417251 | Active matrix organic EL display device and manufacturing method thereof An active matrix organic EL display device includes pixels each having an organic EL element (7a) and a pixel circuit (3) including a polysilicon TFT for controlling the organic EL element (7a) arranged adjacently in each of the re... | 08/26/2008 |
| 7414269 | Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a numbe... | 08/19/2008 |
| 7411215 | Display device and method of fabricating the same To achieve promotion of stability of operational function of display device and enlargement of design margin in circuit design, in a display device including a pixel portion having a semiconductor element and a plurality of pixels provided with pixel electrodes conn... | 08/12/2008 |
| 7405432 | Exposure device, exposure method and method of manufacturing semiconductor device The present invention provides a highly controllable device for exposure from the back side and an exposure method, and also provides a method of manufacturing a semiconductor device using the same. The present invention involves exposure with the use of the back si... | 07/29/2008 |
| 7400004 | Isolation structures for preventing photons and carriers from reaching active areas and methods of formation Regions of an integrated circuit are isolated by a structure that includes at least one isolating trench on the periphery of an active area. The trench is deep, extending at least about 0.5 μm into the substrate. The isolating structure prevents photons and electro... | 07/15/2008 |
| 7399992 | Device for defeating reverse engineering of integrated circuits by optical means An integrated circuit chip (IC) is equipped with a device for preventing reverse engineering by monitoring light emissions emitted from transistors and such electrically active devices in a circuit located in the IC. The device emits extraneous randomized light emis... | 07/15/2008 |
| 7397066 | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/... | 07/08/2008 |
| 7385255 | Field effect transistor and application device thereof The present invention provides a MOSFET having a low on-state resistance and a high withstand voltage as well as a small output capacitance (C(gd), etc.). The MOSFET has a p-type base layer 4 and a n-type source layer 5 selectively formed on the surfac... | 06/10/2008 |
