Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
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| Number | Title | Issue Date |
| 8183581 | LED arrangement An LED arrangement (light emitting diode) has a plurality of adjacent radiating LEDs that are nearly identically aligned for forming an extended area light source. The LEDs are attached to a metallic multi-film support having sandwich-like insulating intermediate la... | 05/22/2012 |
| 8178885 | Aromatic amine compound, and light emitting element, light emitting device, and electronic device using aromatic amine compound An object is to provide an aromatic amine compound with excellent heat resistance. Another object is to provide a light emitting element, a light emitting device, and an electronic device with excellent heat resistance. An aromatic amine compound represented by Gene... | 05/15/2012 |
| 8174031 | Light-emitting element chip, exposure device and image forming apparatus The light-emitting element chip includes: a substrate; a light-emitting portion including plural light-emitting elements each having a first semiconductor layer that has a first conductivity type and that is stacked on the substrate, a second semiconductor layer tha... | 05/08/2012 |
| 8124987 | Light-emitting element chip, exposure device and image forming apparatus The light-emitting element chip includes: a substrate; a light-emitting portion including plural light-emitting elements each having a first semiconductor layer that has a first conductivity type and that is stacked on the substrate, a second semiconductor layer tha... | 02/28/2012 |
| 8120044 | Multi-chips with an optical interconnection unit A multi-chip having an optical interconnection unit is provided. The multi-chip having an optical interconnection unit includes a plurality of silicon chips sequentially stacked, a plurality of optical device arrays on a side of each of the plurality of the silicon ... | 02/21/2012 |
| 8076678 | Package for photoelectric wiring and lead frame A package for a photoelectric wiring in which a pair of light emitting and receiving devices are mounted as optical devices on a lead frame having an optical waveguide in which an optical waveguide having a plurality of core portions disposed in parallel and surroun... | 12/13/2011 |
| 8053789 | Light emitting device and fabrication method thereof There is provided a method of fabricating a vertical light emitting diode. The method comprises the steps of: growing a low doped first conductive semiconductor layer on a sacrificial substrate; forming an aluminum layer on the low doped first conductive semiconduct... | 11/08/2011 |
| 7994518 | Light-emitting diode An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervio... | 08/09/2011 |
| 7994517 | Organic light-emitting display device and method for fabricating the same An organic light emitting display device includes a substrate, a thin film transistor having a gate insulating layer and an inter-insulating layer, an organic light emitting diode electrically connected with the thin film transistor, and a photo sensor, wherein the ... | 08/09/2011 |
| 7982227 | Light emitting diode package A base apparatus includes a base and two finger devices. The base has a first surface and two opposite sides. The finger devices are respectively mounted on the sides of the base, are made of conductive material, and each of the finger devices has multiple fingers. ... | 07/19/2011 |
| 7960741 | Light emitting diode with phosphor material and reflective layer and method for making same A light emitting diode includes: a first semiconductor layer; a second semiconductor layer formed on the first semiconductor layer; a light-converting pattern of a phosphor material formed on the second semiconductor layer; and a reflective layer of a metallic mater... | 06/14/2011 |
| 7919781 | Galvanic isolator having improved high voltage common mode transient immunity A galvanic isolator having a transmitter die, a receiver die, and a lead frame is disclosed. The transmitter die includes an LED having first and second contacts for powering the LED, and the receiver die includes a photodetector. The lead frame includes first and s... | 04/05/2011 |
| 7910934 | Self-assembled heterogeneous integrated optical analysis system Optical analysis system fluidically self-assembled using shape-coded freestanding optoelectronic components and a template having shape-coded recessed binding sites connected by an embedded interconnect network. Also includes methods of manufacture and use for optic... | 03/22/2011 |
| 7902560 | Tunable white point light source using a wavelength converting element A uniform high brightness light source is provided using a plurality of light emitting diode (LED) chips with slightly different pump wavelengths with a wavelength converting element that includes at least two different wavelength converting materials that convert t... | 03/08/2011 |
| 7880179 | Process for making contact with and housing integrated circuits A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface regi... | 02/01/2011 |
| 7880178 | Semiconductor device and method of manufacturing the same The present invention provides a semiconductor device realizing reduced occurrence of a defect such as a crack at the time of adhering elements to each other. The semiconductor device includes a first element and a second element adhered to each other. At least one ... | 02/01/2011 |
| 7847301 | Electronic microcircuit having internal light enhancement By adding light reflective and/or transparent and/or translucent material within a micro-electronic circuit housing, improved light transfer is achieved between a light generation source and a light utilization device. In one embodiment, the reflective material is p... | 12/07/2010 |
| 7842957 | Optical transceiver with reduced height A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface whi... | 11/30/2010 |
| 7834364 | AC light emitting diode and method for fabricating the same The present invention relates to an AC light emitting diode. An object of the present invention is to provide an AC light emitting diode wherein various designs for enhancement of the intensity of light, prevention of flickering of light or the like become possible,... | 11/16/2010 |
| 7834363 | Light-emitting element having PNPN-structure and light-emitting element array A light-emitting element including a light-emitting thyristor and a Schottky barrier diode is provided. A Schottky barrier diode is formed by contacting a metal terminal to a gate layer of a three-terminal light-emitting thyristor consisting of a PNPN-structure. A s... | 11/16/2010 |
| 7791084 | Package with overlapping devices A die package is disclosed. The die package includes a substrate, a first device attached to the substrate, and a leadframe structure attached to the substrate. The leadframe structure includes a portion disposed over the first device, and a second device is attache... | 09/07/2010 |
| 7763896 | Light emitting diode with auxiliary electric component An exemplary LED includes a substrate, an LED chip, a light pervious encapsulation, and an auxiliary electric component. The substrate includes a first surface, an opposite second surface, and an accommodating space defined therein between the first surface and the ... | 07/27/2010 |
| 7745836 | High-power, broad-band, superluminescent diode and method of fabricating the same Provided are a superluminescent diode with a high optical power and a broad wavelength band, and a method of fabricating the same. The superluminescent diode includes: at least one high optical confinement factor (HOCF) region; and at least one low optical confineme... | 06/29/2010 |
| 7700957 | Process for making contact with and housing integrated circuits The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least part... | 04/20/2010 |
| 7649208 | Light emitting diode package including monitoring photodiode The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receivi... | 01/19/2010 |
| 7633094 | Electroluminescence display panel, image display, and method for manufacturing them The present invention provides the following methods and displays. A method for manufacturing an EL display panel, having the step of forming a light-emitting layer by irradiating light on a photothermal conversion layer through a transparent base member while a dye... | 12/15/2009 |
| 7626207 | Integrated optocoupler with organic light emitter and inorganic photodetector An optocoupler has an organic light emitter and an inorganic photodetector with a detector area, the detector area being optically coupled to the organic light emitter. The organic light emitter converts an electrical input signal into a light signal and the inorgan... | 12/01/2009 |
| 7595510 | Semiconductor laser module improved in high frequency response The present invention reduces the radiation noise and the degradation of the optical waveform appeared in the output of the laser module. The laser module of the present invention comprises the laser diode, the photodiode, and the resistor, which are mounted on the ... | 09/29/2009 |
| 7592632 | Light emitting device and display device using the same A small-sized and high-efficiency light emitting device capable of easily emitting green light includes a resonator including a photonic crystal having a refractive-index periodic structure and a point defect member formed in the photonic crystal to disturb the refr... | 09/22/2009 |
| 7557382 | Display device and manufacturing method of the same A display device according to the present invention comprises an insulating substrate; a switching thin film transistor formed on the insulating substrate for receiving a data voltage has a first semiconductor layer comprising amorphous silicon; a driving thin film ... | 07/07/2009 |
| 7541619 | Electro-optical device, image forming apparatus, and image reader An electro-optical device includes a substrate, a plurality of self-emitting elements formed in the substrate, a sealing member attached to the substrate so as to seal the self-emitting elements in cooperation with the substrate, and a circuit that is disposed to ov... | 06/02/2009 |
| 7518152 | Light-emitting element having PNPN-structure and light-emitting element array A light-emitting element including a light-emitting thyristor and a Schottky barrier diode is provided. A Schottky barrier diode is formed by contacting a metal terminal to a gate layer of a three-terminal light-emitting thyristor consisting of a PNPN-structure. A s... | 04/14/2009 |
| 7504665 | Semiconductor optical devices A semiconductor optical device (e.g. a resonant cavity device in this form of an LED or a laser) comprises a single substrate arranged for emitting light (O) for incidence on a sample or other element and also responsive to light (D), e.g. of a different wavelenght,... | 03/17/2009 |
| 7501661 | Receiving optical subassembly with an improved high frequency performance The present invention provides a receiving optical subassembly (ROSA) with a co-axial shape and a stem for mounting semiconductor devices thereon that improves the high frequency performance of the ROSA. The ROSA mounts a photodiode (PD) and a pre-amplifier on a ste... | 03/10/2009 |
| 7476905 | Securing a transistor outline can within an optical component The present invention relates to affixing components of optical packages. The optical packages can include an optical component, such as a TO-Can. The TO-Can can house an optical transmitter and/or an optical receiver. Another optical component of the optical packag... | 01/13/2009 |
| 7459726 | Semiconductor device comprising a light emitting element and a light receiving element A semiconductor device which has a high performance integrated circuit formed of an inexpensive glass substrate and capable of processing a large amount of information and operating at higher data rates. The semiconductor device includes semiconductor elements stack... | 12/02/2008 |
| 7456434 | Micro optical bench structure A micro optical bench structure and a method of manufacturing a micro optical bench structure are provided. The micro optical bench structure includes: a lower substrate; an upper substrate which is bonded to the lower substrate, and has a through-hole for exposing ... | 11/25/2008 |
| 7439547 | Micro electro mechanical system apparatus A MEMS (micro electro mechanical system) apparatus is equipped with a light-emitting circuit, having a light-emitting device, to emit light; a light-receiving circuit having a series circuit of series-connected light-receiving devices that receive the emitted light ... | 10/21/2008 |
| 7435994 | Semiconductor device and method for fabricating the same A spacer layer is formed on a single-crystal substrate and an epitaxially grown layer composed of a group III-V compound semiconductor layer containing a nitride or the like is further formed on the spacer layer. The epitaxially grown layer is adhered to a recipient... | 10/14/2008 |
| 7427523 | Method of making light emitting device with silicon-containing encapsulant A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a pho... | 09/23/2008 |
