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"Flight by machines heavier than air is unpractical and insignificant, if not utterly impossible."
Simon Newcomb, astronomer ; Said in 1902, less than two years before the first flight at Kitty Hawk
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| Number | Title | Issue Date |
| 8188488 | Power surface mount light emitting die package A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a moun... | 05/29/2012 |
| 8158988 | Interlevel conductive light shield A CMOS image sensor pixel includes a conductive light shield, which is located between a first dielectric layer and a second dielectric layer. At least one via extends from a top surface of the second dielectric layer to a bottom surface of the first dielectric laye... | 04/17/2012 |
| 8154030 | Integrated diode in a silicon chip scale package An optical component with integrated back monitor photodiode. The optical component includes a substrate doped with a first type dopant, such as an n-type dopant. The substrate has a trench with sloped walls. An optical source is disposed in the trench. An implant o... | 04/10/2012 |
| 8148736 | Flip chip type light-emitting element In a flip chip type light-emitting element of the present invention, an n type contact electrode 14 is formed on an n layer 11 exposed in a comb-tooth shape, a light transmission electrode 15 made of an ITO is formed over the entire surface of a... | 04/03/2012 |
| 8148737 | Light emitting device, light emitting device package and lighting system Disclosed are a light emitting device, a light emitting device package and a lighting system. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, an active layer over the first conductive ... | 04/03/2012 |
| 8148735 | Optical communication module An infrared data communication module (A1) includes a substrate (1) consisting of a first layer (1A) and a second layer (1B), where the first layer is formed with a recess (11) open at its obverse surface, and includes the opening ... | 04/03/2012 |
| 8138507 | Package for light emitting device A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a s... | 03/20/2012 |
| 8134161 | Package for light emitting device A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the p... | 03/13/2012 |
| 8120043 | Surface mount device The disclosed subject matter is directed to a reliable surface mount device using a ceramic package, and includes LED devices that are simply composed and incorporate the use of the surface mount device. The surface mount device can include a ceramic package, a semi... | 02/21/2012 |
| 8110837 | Sensing module A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically conn... | 02/07/2012 |
| 8106406 | Die package including substrate with molded device A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a sec... | 01/31/2012 |
| 8106407 | Light-emitting device and display device Although an organic resin substrate is highly effective at reducing the weight and improving the shock resistance of a display device, it is required to improve the moisture resistance of the organic resin substrate for the sake of maintaining the reliability of an ... | 01/31/2012 |
| 8106408 | Optical semiconductor device with flexible substrate A metal pattern for a high frequency signal is patterned on a flexile substrate, and the flexile substrate is bent in such a way as to form a substantially right angle at a spot corresponding to an end of the metal pattern for the signal. And an end of the metal pat... | 01/31/2012 |
| 8101955 | PLCC package with a reflector cup surrounded by an encapsulant In an embodiment, the invention provides a PLCC package comprising first and second lead frames, a plastic structural body, a light source, an encapsulant, and an optical lens. The first lead frame comprises two tongues and a reflector cup. The first and second lead... | 01/24/2012 |
| 8101956 | Light emitting device package and light unit having the same Discussed is a semiconductor LED package. The semiconductor LED package includes a packet body having a cavity, a semiconductor light emitting device in the cavity of the package body; and a plurality of reflective frames, each of the reflective frames having a bott... | 01/24/2012 |
| 8097888 | Package carrier for effectively blocking optical signal transmission between light emitting device and light receiving device A package carrier suitable for carrying at least one light emitting device and at least one light receiving device includes a carrier substrate and a metal sheet. The carrier substrate includes a first carrying area and a second carrying area. The light emitting dev... | 01/17/2012 |
| 8089075 | LFCC package with a reflector cup surrounded by a single encapsulant In an embodiment, the invention provides a LFCC package comprising first, second and third lead frames, a light source, and an encapsulant. The first lead frame comprises two tongues and a reflector cup. The first, second and third lead frames are attached to the en... | 01/03/2012 |
| 8071987 | Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component A housing for an optoelectronic component is disclosed, having a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body, wherein the plastic base body is formed from at least one first plastic ... | 12/06/2011 |
| 8053787 | Lamp seat for a light emitting diode and capable of heat dissipation, and method of manufacturing the same A lamp seat includes a metal substrate having opposite first and second surfaces, first and second conductive patterns formed on the first surface, and third and fourth conductive patterns formed on the second surface and connected respectively and integrally to the... | 11/08/2011 |
| 8053788 | Rod-shaped semiconductor device A rod-shaped semiconductor device having a light-receiving or light-emitting function is equipped with a rod-shaped substrate made of p-type or n-type semiconductor crystal, a separate conductive layer which is formed on a part of the surface of the substrate exclud... | 11/08/2011 |
| 8044412 | Package for a light emitting element A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material th... | 10/25/2011 |
| 8039848 | Semiconductor light emitting device substrate strips and packaged semiconductor light emitting devices Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semic... | 10/18/2011 |
| 8022415 | Light emitting device package and light unit having the same Discussed is an LED package The LED package includes a body having a cavity at one side thereof, at least one of lead frames having a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames. ... | 09/20/2011 |
| 8003997 | Package for light emitting device The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller th... | 08/23/2011 |
| 7994516 | LED module, and LED chain containing the same The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclos... | 08/09/2011 |
| 7985973 | Semiconductor light-emitting device and method of fabricating the same The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than o... | 07/26/2011 |
| 7977684 | Light emitting package having screen layer The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller th... | 07/12/2011 |
| 7973324 | Lamp type light emitting device for safety fuse A lamp type light emitting device for safety fuse, including a substrate, an electrode layer, a chip set, a wire set, two leads and an encapsulator. The electrode layer is arranged on the substrate and includes a first T-shaped electrode, a second T-shaped electrode... | 07/05/2011 |
| 7973323 | Semiconductor device and manufacturing method thereof, and camera module including the same A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A r... | 07/05/2011 |
| 7968894 | LED package frame and LED package having the same An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted ... | 06/28/2011 |
| 7960740 | Structure of light emitting diode and method to assemble thereof A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each cond... | 06/14/2011 |
| 7960739 | Optical module and production method therefor An optical transmitter includes a package including a cavity formed at an upper part thereof, a light transparent member disposed on the package, and a flexible substrate including a circuit pattern formed on at least one side thereof and being placed on a back surf... | 06/14/2011 |
| 7952108 | Reducing thermal expansion effects in semiconductor packages Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid l... | 05/31/2011 |
| 7939835 | Light emitting apparatus and method for manufacturing the same The purpose of the invention is to improve reliability of a light emitting apparatus comprising TFTs and organic light emitting elements. The light emitting apparatus according to the invention having thin film transistors and light emitting elements, comprises; a s... | 05/10/2011 |
| 7935971 | Light emitting diode module The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules. The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern lay... | 05/03/2011 |
| 7888689 | Light emitting package and light emitting package array Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for ref... | 02/15/2011 |
| 7884376 | Optoelectronic semiconductor device and manufacturing method thereof An embodiment of the invention discloses an optoelectronic semiconductor device comprising a semiconductor system capable of performing a conversion between light energy and electrical energy; an interfacial layer formed on at least two surfaces of the semiconductor... | 02/08/2011 |
| 7884377 | Light emitting device, method of manufacturing the same and monolithic light emitting diode array A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed ... | 02/08/2011 |
| 7875890 | Structures and methods to improve the crosstalk between adjacent pixels of back-illuminated photodiode arrays Structures and methods to improve the crosstalk between adjacent pixels of back-illuminated photodiode arrays on a substrate having first and second surfaces, including providing a first matrix of regions of a first conductivity type of a higher conductivity than th... | 01/25/2011 |
| 7868336 | Semiconductor device and method of manufacturing the same According to the present invention, protrusions 4 are formed on electrodes 3 of semiconductor elements 6, and an optical member 7 is secured on the semiconductor element 6 with an adhesive 8 so as to be pressed onto the prot... | 01/11/2011 |
