Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 8058736 | Semiconductor device having heat spreader with center opening The present invention provides a semiconductor device including: a semiconductor chip mounted on a substrate; a heat spreader provided above the semiconductor chip; and a sealing resin interposed between the semiconductor chip and the heat spreader and covering the ... | 11/15/2011 |
| 8035237 | Integrated circuit package system with heat slug An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulatin... | 10/11/2011 |
| 7868472 | Thermal dissipation in integrated circuit systems Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has a top side and a bottom side. The top side supports an electrical sign... | 01/11/2011 |
| 7821141 | Semiconductor device A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greate... | 10/26/2010 |
| 7812464 | Semiconductor device and a method of manufacturing for high output MOSFET A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET (70) has a connecting portion for electrically connecting a surface electrode of a semiconductor pellet and a p... | 10/12/2010 |
| 7554210 | Semiconductor device with semiconductor chip mounted in package A semiconductor device including a semiconductor chip having first and second principal surfaces is disclosed. The semiconductor chip includes a first electrode formed on the first principal surface and a second electrode formed on the second principal surface. A fi... | 06/30/2009 |
| 7504736 | Semiconductor packaging mold and method of manufacturing semiconductor package using the same A semiconductor packaging mold includes first and second mold bodies, a cavity defined by the first and second mold bodies to provide a space for molding a semiconductor package, and a resin bleed preventing formation on a cavity surface of one of the first and seco... | 03/17/2009 |
| 7495346 | Semiconductor package There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stif... | 02/24/2009 |
| 7405107 | Semiconductor device, method and apparatus for fabricating the same A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the ... | 07/29/2008 |
| 7400049 | Integrated circuit package system with heat sink An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, t... | 07/15/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7378731 | Heat spreader and package structure utilizing the same A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest ... | 05/27/2008 |
| 7371617 | Method for fabricating semiconductor package with heat sink A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip car... | 05/13/2008 |
| 7372146 | Semiconductor module A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by flip chip bonding on or above the package substrate while letting the... | 05/13/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7365420 | Semiconductor packages and methods for making and using same A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361985 | Thermally enhanced molded package for semiconductors An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit. ... | 04/22/2008 |
| 7358606 | Apparatus to compensate for stress between heat spreader and thermal interface material A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the ide... | 04/15/2008 |
| 7359201 | Heat-generating electronic part cover and cover mounting method A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, op... | 04/15/2008 |
| 7355289 | Packaged integrated circuit with enhanced thermal dissipation A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors... | 04/08/2008 |
| 7348662 | Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and... | 03/25/2008 |
| 7342298 | Metal lid with improved adhesion to package substrate A metal lid for packaging semiconductor chips is stamped to form a sloped sidewall with a set-back from the edge of a package substrate. After the metal lid is placed over the semiconductor chip, molding compound is formed around portions of the exposed perimeter of... | 03/11/2008 |
| 7342304 | Semiconductor package with heat dissipating structure A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a su... | 03/11/2008 |
| 7335982 | Chip package structure and chip packaging process A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the ca... | 02/26/2008 |
| 7323770 | Hybrid integrated circuit device, and method for fabricating the same, and electronic device A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid... | 01/29/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7315077 | Molded leadless package having a partially exposed lead frame pad Provided are a molded leadless package, and a sawing type molded leadless package and method of manufacturing same. The molded leadless package includes a lead frame pad having first and second surfaces opposite to each other. A semiconductor chip is adhered to the ... | 01/01/2008 |
| 7315455 | Surface-mounted electronic component module and method for manufacturing the same More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns f... | 01/01/2008 |
| 7312525 | Thermally enhanced package for an integrated circuit A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channe... | 12/25/2007 |
| RE39957 | Method of making semiconductor package with heat spreader A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is... | 12/25/2007 |
| 7304372 | Semiconductor package A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration. ... | 12/04/2007 |
| 7304379 | Semiconductor device with pipe for passing refrigerant liquid A semiconductor device includes 1) a conductive pipe including an inner surface forming an inner space shaping a path of an insulative cooling refrigerant liquid and an outer surface including a plane potion partially formed thereof, 2) a power semiconductor element... | 12/04/2007 |
| 7301242 | Programmable system in package Some embodiments of the invention provide a programmable system in package (“PSiP”). The PSiP includes a single IC housing, a substrate and several IC's that are arranged within the single IC housing. At least one of the IC's is a configurable IC. In some embodi... | 11/27/2007 |
| 7294530 | Method for encapsulating multiple integrated circuits A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first e... | 11/13/2007 |
| 7294790 | Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used ... | 11/13/2007 |
| 7288839 | Apparatus and methods for cooling semiconductor integrated circuit package structures Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power densit... | 10/30/2007 |
