Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7999398 | Solid state device A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state com... | 08/16/2011 |
| 7470999 | Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700° C. or higher as normal maxi... | 12/30/2008 |
| 7436076 | Micromechanical component having an anodically bonded cap and a manufacturing method A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the fun... | 10/14/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.... | 07/08/2008 |
| 7372159 | Semiconductor device A glass-sealed type semiconductor device has Dumet electrodes, a glass sealing member, and a semiconductor element tightly sealed in a cavity constituted by the Dumet electrodes and the glass sealing member. The semiconductor element is constituted by a Schottky bar... | 05/13/2008 |
| 7335461 | Method of structuring of a subtrate The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymeri... | 02/26/2008 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7307286 | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same An epoxy resin composition for encapsulating an optical semiconductor element, which has small internal stress and also can obtain good light transmittance within a broad temperature range. An epoxy resin composition for encapsulating an optical semiconductor elemen... | 12/11/2007 |
| 7295433 | Electronics assembly having multiple side cooling and method An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device p... | 11/13/2007 |
| 7208351 | Electronic device and method of manufacture the same An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube. ... | 04/24/2007 |
| 7186629 | Protecting thin semiconductor wafers during back-grinding in high-volume production A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wa... | 03/06/2007 |
| 7179680 | Method for producing an optoelectronic component An optoelectronic component with an optoelectronic transducer is produced with the novel method. The optoelectronic component has a coupling region, which is formed in a radiation-transparent molding of the optoelectronic component. On the base of a clearance of the... | 02/20/2007 |
| 7115989 | Adhesive sheet for producing a semiconductor device An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of sealing a semiconductor element connected to an electric conductor with ... | 10/03/2006 |
| 7109591 | Integrated circuit device An integrated circuit device having a semiconductor device and an encapsulating material on at least a portion of the semiconductor device and a method for encapsulating an integrated circuit device is disclosed. The encapsulating material includes a plurality of na... | 09/19/2006 |
| 7102242 | Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same The lead-free glass tubing of the SiO2—B2O3—R2O—BaO—ZnO—TiO2 system has a composition, in percent by weight on an oxide basis, consisting essentially of: SiO2, 34 to 52; B2O3... | 09/05/2006 |
| 7098545 | Semiconductor device and method of enveloping an integrated circuit A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is r... | 08/29/2006 |
| 7095124 | Semiconductor device A semiconductor device comprises a semiconductor chip in which a multilayer interconnection structure having an interlayer insulation film with a low relative dielectric constant is formed on a silicon substrate and a sealing resin layer which coats the semiconducto... | 08/22/2006 |
| 7092890 | Method for manufacturing thin GaAs die with copper-back metal structures A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner ... | 08/15/2006 |
| 7075187 | Coating material over electrodes to support organic synthesis There is disclosed a coating material formulation for layering a plurality of electrodes to provide a substrate for the electrochemical synthesis of organic oligomers. Specifically, there is disclosed a coating layer of from about 0.5 to about 100 microns thick and ... | 07/11/2006 |
| 7002241 | Packaging of semiconductor device with a non-opaque cover Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in ... | 02/21/2006 |
| 6995691 | Bonded structure using reacted borosilicate mixture Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide inte... | 02/07/2006 |
| 6930398 | Package structure for optical image sensing integrated circuits A package structure for optical image sensing devices is disclosed. The package structure includes an image sensing integrated circuit chip having a light receiving side and a backside. The image sensing integrated circuit chip has a light sensing area on the light ... | 08/16/2005 |
| 6909175 | EL device sealing plate, multiple sealing plate-producing mother glass substrate, and EL device There is provided an EL device which has sufficient strength to external pressure and is capable of effectively preventing moisture and oxygen from infiltrating into the EL device, thereby having a prolonged life. An organic EL device 200 is comprised of a su... | 06/21/2005 |
| 6906403 | Sealed electronic device packages with transparent coverings The invention provides improved packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. Methods of assembly are also provided. In one embodiment of the invention, an image sensor package is ass... | 06/14/2005 |
| 6906405 | Electronic part and its manufacturing method An electronic part comprising: a functional element chip on which a functional element has been formed; a wiring member which is electrically connected to the functional element chip; and a protecting member for protecting the functional element chip, wherein the wi... | 06/14/2005 |
| 6873060 | Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of ... | 03/29/2005 |
| 6864197 | Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same The lead-free glass tubing of the SiO2—B2O3—R2O—BaO—ZnO—TiO2 system has a composition, in percent by weight on an oxide basis, consisting essentially of: SiO2, 34 to 52; B2O3... | 03/08/2005 |
| 6861683 | Optoelectronic component using two encapsulating materials and the method of making the same In an optoelectronic component assembly and a method for the production thereof, the optoelectronic component assembly includes an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in an inner a... | 03/01/2005 |
| 6841888 | Encapsulant for opto-electronic devices and method for making it An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 01/11/2005 |
| 6828674 | Hermetically sealed microstructure package A hermetically sealed wafer scale package for micro-electrical-mechanical systems devices. The package consists of a substrate wafer which contains a microstructure and a cap wafer which contains other circuitry and electrical connectors to connect to external appli... | 12/07/2004 |
| 6800949 | Embedded chip enclosure with solder-free interconnect A fused silica substrate is processed to a thickness that allows it to be easily flexed. An opening is etched in the substrate. A die having a patterned topside is processed to the thickness of the substrate by lapping the die. The thinned die is positioned within t... | 10/05/2004 |
| 6791164 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages A stereolithographically fabricated package that surrounds at least a portion of a semiconductor die so as to substantially hermetically seal the same. The package may be fabricated from thermoplastic glass, other types of glass, ceramics, or metals. Stereolithograp... | 09/14/2004 |
| 6774481 | Solid-state image pickup device A solid-state image pickup device in which no warp occurs in a solid-state image pickup element chip is provided. A solid-state image pickup device, including a solid-state image pickup element chip on which a plurality of solid-state image pickup elements are mount... | 08/10/2004 |
| 6770914 | III nitride semiconductor substrate for ELO A III nitride semiconductor substrate for ELO is provided for forming a III nitride film whose surface is controlled independent of the film's thickness. A III nitride underlayer including at least Al is directly formed on a base made of e.g. a sapphire single cryst... | 08/03/2004 |
| 6724093 | Semiconductor devices and their manufacture Thermal cycling can lead to damaging stress at the upper surface of a semiconductor device chip (10) encapsulated in synthetic resin material (100), particularly in the case of power devices that include an IC. The invention provides a thick ductile la... | 04/20/2004 |
| 6724094 | Glass and glass tube for encapsulating semiconductors Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106 | 04/20/2004 |
| 6663943 | Surface acoustic wave device and method for making the same A surface acoustic wave device includes a SAW element that is mounted on a substrate. Grooves are provided in the substrate at the outer periphery of the SAW element, and a flexible resin layer is provided at the inner portion of the grooves so as to cove... | 12/16/2003 |
| 6645643 | Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcin... | 11/11/2003 |
| 6642618 | Light-emitting device and production thereof A light-emitting device comprises a substrate, electrical terminals disposed on a top side of the substrate, and a light-emitting semiconductor device disposed above the substrate. The light-emitting semiconductor device has a bottom side oriented to face... | 11/04/2003 |
