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| Number | Title | Issue Date |
| 8169090 | Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at most 5 gf/5 mmφ, and the melt viscosity at 130° C. is at least 0.01 P... | 05/01/2012 |
| 8148831 | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are ... | 04/03/2012 |
| 8106523 | Liquid resin composition, semi-conductor device, and process of fabricating the same A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a... | 01/31/2012 |
| 8013456 | Molded beam for optoelectronic sensor chip substrate A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the s... | 09/06/2011 |
| 7994647 | Method of reducing memory card edge roughness by edge coating A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts thr... | 08/09/2011 |
| 7898094 | Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy re... | 03/01/2011 |
| 7795744 | Cationically curable epoxy resin composition The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good... | 09/14/2010 |
| 7692318 | Liquid epoxy resin composition and semiconductor device Better semiconductor encapsulation is achieved with a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent containing at least 5 wt % of an aromatic amine compound, (C) a microencapsulated catalyst containing a phenolic hydroxy-bear... | 04/06/2010 |
| 7667339 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoqui... | 02/23/2010 |
| 7642661 | Liquid epoxy resin composition A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (... | 01/05/2010 |
| 7442729 | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 10/28/2008 |
| 7432603 | Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Tab... | 10/07/2008 |
| 7431990 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this inve... | 10/07/2008 |
| 7429800 | Molding composition and method, and molded article A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica... | 09/30/2008 |
| 7408264 | SMT passive device noflow underfill methodology and structure An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. T... | 08/05/2008 |
| 7408259 | Sheet to form a protective film for chips A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder ... | 08/05/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.... | 07/08/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7378721 | Chip on lead frame for small package speed sensor A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical compone... | 05/27/2008 |
| 7372200 | Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment The present invention uses plastic film in vacuum sealing an OLED. Inorganic insulating films which can prevent oxygen or water from being penetrated therein and an organic insulating film which has a smaller internal stress than that of the inorganic insulating fil... | 05/13/2008 |
| 7356894 | Method of producing a micro-actuator In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the sec... | 04/15/2008 |
| 7358857 | Global positioning systems applications A global positioning system includes a fixed base unit of known position and at least one mobile unit, the base unit and the mobile unit each including a GPS receiver. This system further includes means for comparing the simultaneous GPS identified positions of the ... | 04/15/2008 |
| 7345368 | Semiconductor device and the manufacturing method for the same A semiconductor device has a semiconductor substrate having first and second surface, a first resin film formed on the first surface of the semiconductor substrate and a second resin film formed on the second surface of the semiconductor substrate. A projection elec... | 03/18/2008 |
| 7345102 | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D): (A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and na... | 03/18/2008 |
| 7332822 | Flip chip system with organic/inorganic hybrid underfill composition A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixtur... | 02/19/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7317258 | Thermal interface apparatus, systems, and fabrication methods An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material. ... | 01/08/2008 |
| 7314820 | Carrier-free semiconductor package and fabrication method thereof A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically co... | 01/01/2008 |
| 7315083 | Circuit device and manufacturing method thereof A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing m... | 01/01/2008 |
| 7312106 | Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to k... | 12/25/2007 |
| 7312536 | Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight ... | 12/25/2007 |
| 7307128 | Epoxy compound, preparation method thereof, and use thereof The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanica... | 12/11/2007 |
| 7304391 | Modified chip attach process and apparatus A method of packaging a die includes reflowing the solder to electrically connect the die to a substrate at a first temperature, cooling the die and substrate to a second temperature, and placing a heated epoxy in contact with the die and the substrate. The method a... | 12/04/2007 |
| 7304120 | Epoxy compound, preparation method thereof, and use thereof An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 eac... | 12/04/2007 |
| 7291684 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin cont... | 11/06/2007 |
| 7288838 | Circuit board for mounting a semiconductor chip and manufacturing method thereof It is an object of the invention to provide a circuit board for mounting a semiconductor chip and a manufacturing method thereof that prevent post-reflow warping and prevent peeling of the semiconductor chip and breakage resulting from thermal stress. In the circuit... | 10/30/2007 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where... | 10/23/2007 |
| 7285728 | Electronic parts packaging structure and method of manufacturing the same An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mou... | 10/23/2007 |
| 7279781 | Two-stage transfer molding device to encapsulate MMC module A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion... | 10/09/2007 |
