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| Number | Title | Issue Date |
| 7435993 | High temperature, high voltage SiC void-less electronic package An electronic package designed to package silicon carbide discrete components for silicon carbide chips. The electronic package allows thousands of power cycles and/or temperature cycles between −55° C. to 300° C. The present invention can also tolerate continuo... | 10/14/2008 |
| 7432604 | Semiconductor component and system having thinned, encapsulated dice A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 10/07/2008 |
| 7417325 | Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 08/26/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.... | 07/08/2008 |
| 7382060 | Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 06/03/2008 |
| 7361284 | Method for wafer-level package A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and bonded to a transparent wafer, and a portion of the cap wafer correspo... | 04/22/2008 |
| 7345368 | Semiconductor device and the manufacturing method for the same A semiconductor device has a semiconductor substrate having first and second surface, a first resin film formed on the first surface of the semiconductor substrate and a second resin film formed on the second surface of the semiconductor substrate. A projection elec... | 03/18/2008 |
| 7335970 | Semiconductor device having a chip-size package Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided i... | 02/26/2008 |
| 7332822 | Flip chip system with organic/inorganic hybrid underfill composition A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixtur... | 02/19/2008 |
| 7327022 | Assembly, contact and coupling interconnection for optoelectronics A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip ... | 02/05/2008 |
| RE39957 | Method of making semiconductor package with heat spreader A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is... | 12/25/2007 |
| 7288489 | Process for thinning a semiconductor workpiece The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a... | 10/30/2007 |
| 7285867 | Wiring structure on semiconductor substrate and method of fabricating the same A semiconductor device includes a semiconductor substrate having a plurality of connecting pads on one surface, an insulating film formed on one surface of the semiconductor substrate. The insulating film has holes each corresponding to one of the connecting pads, a... | 10/23/2007 |
| 7285446 | Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device The present invention provides a mounting structure of a semiconductor chip (3) onto an insulated substrate (2). The insulated substrate (2) is made of a polyimide resin, at least side surfaces (3c) of the semiconductor chip (3 | 10/23/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7239030 | Flexible wiring board for tape carrier package having improved flame resistance A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiri... | 07/03/2007 |
| 7239022 | Sensor device A sensor device includes a circuit chip and a sensor chip. The circuit chip has a bonding portion. The sensor chip is stacked on the bonding portion of the circuit chip. The circuit chip and the sensor chip are bonded by a film-type adhesive containing 91 ±3 weight... | 07/03/2007 |
| 7233059 | Semiconductor arrangement The invention relates to a vertical arrangement of at least two semiconductor components which are electrically insulated from one another by at least one passivation layer. The invention likewise relates to a method for fabricating such a semiconductor arrangement.... | 06/19/2007 |
| 7224050 | Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having ... | 05/29/2007 |
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ... | 05/01/2007 |
| 7173322 | COF flexible printed wiring board and method of producing the wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF fl... | 02/06/2007 |
| 7170184 | Treatment of a ground semiconductor die to improve adhesive bonding to a substrate Methods are provided to improve the adhesive bonding of a semiconductor die to a substrate through an adhesive paste by forming a layer of silicon dioxide on the back surface of the semiconductor die prior to applying the adhesive paste. Contacting the semiconductor... | 01/30/2007 |
| 7170153 | Semiconductor device and its manufacturing method In order to manufacture a thin and small semiconductor device at low cost, the semiconductor device and its manufacturing method are disclosed. The semiconductor device comprises: a film wiring substrate made of insulating resin; a semiconductor chip fixed to the ma... | 01/30/2007 |
| 7122910 | Packaged semiconductor device A semiconductor device in which moisture penetration into the package interior is suppressed, comprising a rewiring layer formed by plating, with improved reliability of electrical characteristics. On the main surface of a semiconductor chip comprising circuit eleme... | 10/17/2006 |
| 7115989 | Adhesive sheet for producing a semiconductor device An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of sealing a semiconductor element connected to an electric conductor with ... | 10/03/2006 |
| 7109572 | Quad flat no lead (QFN) grid array package A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on th... | 09/19/2006 |
| 7109055 | Methods and apparatus having wafer level chip scale package for sensing elements Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the ... | 09/19/2006 |
| 7109591 | Integrated circuit device An integrated circuit device having a semiconductor device and an encapsulating material on at least a portion of the semiconductor device and a method for encapsulating an integrated circuit device is disclosed. The encapsulating material includes a plurality of na... | 09/19/2006 |
| 7098545 | Semiconductor device and method of enveloping an integrated circuit A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is r... | 08/29/2006 |
| 7098544 | Edge seal for integrated circuit chips A structure for a chip or chip package is disclosed, with final passivation and terminal metallurgy which are mechanically decoupled but electrically coupled to the multilayer on-chip interconnects. This decoupling allows the chip to survive packaging stresses in th... | 08/29/2006 |
| 7095124 | Semiconductor device A semiconductor device comprises a semiconductor chip in which a multilayer interconnection structure having an interlayer insulation film with a low relative dielectric constant is formed on a silicon substrate and a sealing resin layer which coats the semiconducto... | 08/22/2006 |
| 7091606 | Circuit device and manufacturing method of circuit device and semiconductor module After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the... | 08/15/2006 |
| 7091605 | Highly moisture-sensitive electronic device element and method for fabrication A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulati... | 08/15/2006 |
| 7088010 | Chip packaging compositions, packages and systems made therewith, and methods of making same A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system include... | 08/08/2006 |
| 7075187 | Coating material over electrodes to support organic synthesis There is disclosed a coating material formulation for layering a plurality of electrodes to provide a substrate for the electrochemical synthesis of organic oligomers. Specifically, there is disclosed a coating layer of from about 0.5 to about 100 microns thick and ... | 07/11/2006 |
| 7068125 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 06/27/2006 |
| 7067930 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition is provided comprising (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) acrylic submicron particles of core-shell structure formed of polymers or copolymers comprising... | 06/27/2006 |
| 7030496 | Semiconductor device having aluminum and metal electrodes and method for manufacturing the same A semiconductor device includes a semiconductor substrate; an aluminum electrode disposed on the substrate; a protection film disposed on the aluminum electrode; an opening disposed on the protection film for exposing the aluminum electrode; and a metal electrode di... | 04/18/2006 |
| 7018268 | Protection of work piece during surface processing The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the pa... | 03/28/2006 |
