Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 8164202 | Optical semiconductor device encapsulated with silicone resin An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone... | 04/24/2012 |
| 8004096 | Semiconductor device and a manufacturing method thereof A semiconductor device and a manufacturing method of the device are disclosed. The semiconductor device includes a substrate that mounts a semiconductor element, a first stiffener, a reinforcement resin member, and a second stiffener for reinforcing the reinforcemen... | 08/23/2011 |
| 7786606 | Resin-sealed electronic device and method of manufacturing the same A resin-sealed semiconductor device includes a metal frame, an electronic substrate, an adhesive agent, a molded resin, and a bonding agent. The electronic substrate includes a first surface having a circuit element wiring part, a second surface facing the metal fra... | 08/31/2010 |
| 7777356 | Modified polyaluminosiloxane A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl... | 08/17/2010 |
| 7579698 | Photodetector sealing resin is a boride or an oxide of micro particles A semiconductor photodetector which can achieve spectral sensitivity characteristics close to relative luminous characteristics at low cost while using a light receiving element of a semiconductor made from such as silicon, has a semiconductor light receiving elemen... | 08/25/2009 |
| 7521813 | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO2 units, R3nR4pSiO0.5 | 04/21/2009 |
| 7449789 | Light-emitting device, planar light source and direct type backlight module A light-emitting device (12) includes a base (14) and two red light-emitting chips (22), two green light-emitting chips (24) and a blue light-emitting chip (26) arranged on the base red, green, blue, green, red in a left-to-right o... | 11/11/2008 |
| 7442653 | Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass An exemplary manufacturing method of an inter-metal dielectric of a semiconductor device according to an embodiment of the present invention includes forming a first silicon-rich oxide (SRO) layer on a silicon substrate provided with or otherwise having a copper lin... | 10/28/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7378616 | Heating apparatus and method for semiconductor devices A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over... | 05/27/2008 |
| 7365628 | Semiconductor apparatus A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first el... | 04/29/2008 |
| 7358618 | Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s... | 04/15/2008 |
| 7332822 | Flip chip system with organic/inorganic hybrid underfill composition A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixtur... | 02/19/2008 |
| 7329949 | Packaged microelectronic devices and methods for packaging microelectronic devices Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second ... | 02/12/2008 |
| 7317258 | Thermal interface apparatus, systems, and fabrication methods An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material. ... | 01/08/2008 |
| 7294933 | Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the redistribution layer, a second resin layer which is formed over the first resin ... | 11/13/2007 |
| 7288489 | Process for thinning a semiconductor workpiece The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a... | 10/30/2007 |
| 7288847 | Assembly including a circuit and an encapsulation frame, and method of making the same An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall t... | 10/30/2007 |
| 7285443 | Stacked semiconductor module The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically co... | 10/23/2007 |
| 7274110 | Semiconductor component having a CSP housing The invention relates to a semiconductor component for mounting on a printed circuit board. The semiconductor component includes a housing that at least partially surrounds at least one flat semiconductor chip. Electrical contacts are assigned to the semiconductor c... | 09/25/2007 |
| 7262510 | Chip package structure A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active surface. Then, a polymer material including flux is placed on the surfa... | 08/28/2007 |
| 7260284 | Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical... | 08/21/2007 |
| 7247518 | Semiconductor device and method for manufacturing same There is provided a semiconductor device of a chip-on-chip structure having a support semiconductor chip, first and second chip blocks supported and connected on one surface of the support semiconductor chip and an insulator arranged between the first and second chi... | 07/24/2007 |
| 7217993 | Stacked-type semiconductor device A stacked-type semiconductor device includes a first wiring substrate on which a semiconductor device element is mounted, a second wiring substrate stacked on the first wiring substrate through a plurality of electrode terminals which are electrically connected with... | 05/15/2007 |
| 7211472 | Method for producing a multichip module and multichip module A method for producing a multi-chip module having application of at least one contact elevation onto a substrate, application and patterning of a rewiring device onto the substrate and the at least one contact elevation with provision of a contact device on the at l... | 05/01/2007 |
| 7211900 | Thin semiconductor package including stacked dies A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The cir... | 05/01/2007 |
| 7186591 | Method of encapsulating an assembly with a low temperature silicone rubber compound A method for encapsulating an assembly with a methyl phenyl silicone rubber compound is provided. In various embodiments, the method can include exposing the assembly to a solvent, plasma etching the assembly, and producing a potting mixture, wherein the potting mix... | 03/06/2007 |
| 7180165 | Stackable electronic assembly On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked arch... | 02/20/2007 |
| 7176572 | Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the redistribution layer, a second resin layer which is formed over the first resin ... | 02/13/2007 |
| 7173322 | COF flexible printed wiring board and method of producing the wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF fl... | 02/06/2007 |
| 7170757 | Field changeable graphics system for a computing device One embodiment of a field changeable graphics system for a computing device includes a graphics card and an interface assembly. The interface assembly is adapted to interface the graphics card with the motherboard of a computing device, without directly mounting the... | 01/30/2007 |
| 7148560 | IC chip package structure and underfill process A novel integrated circuit (IC) chip package structure and underfill process which reduces stress applied to corners of a flip chip in an IC package structure during the application of an adhesive material between the flip chip and a carrier substrate is disclosed. ... | 12/12/2006 |
| 7144763 | Epoxy resin compositions, solid state devices encapsulated therewith and method Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal st... | 12/05/2006 |
| 7115989 | Adhesive sheet for producing a semiconductor device An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of sealing a semiconductor element connected to an electric conductor with ... | 10/03/2006 |
| 7112469 | Method of fabricating a semiconductor package utilizing a thermosetting resin base member A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a semiconductor substrate and a plurality of external connecting elect... | 09/26/2006 |
| 7109591 | Integrated circuit device An integrated circuit device having a semiconductor device and an encapsulating material on at least a portion of the semiconductor device and a method for encapsulating an integrated circuit device is disclosed. The encapsulating material includes a plurality of na... | 09/19/2006 |
| 7101730 | Method of manufacturing a stackable ball grid array A method of manufacturing a stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a preformed packages which have alignment features to allow for the stacking of the ball grid arrays. The... | 09/05/2006 |
| 7098545 | Semiconductor device and method of enveloping an integrated circuit A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is r... | 08/29/2006 |
| 7095124 | Semiconductor device A semiconductor device comprises a semiconductor chip in which a multilayer interconnection structure having an interlayer insulation film with a low relative dielectric constant is formed on a silicon substrate and a sealing resin layer which coats the semiconducto... | 08/22/2006 |
| 7075187 | Coating material over electrodes to support organic synthesis There is disclosed a coating material formulation for layering a plurality of electrodes to provide a substrate for the electrochemical synthesis of organic oligomers. Specifically, there is disclosed a coating layer of from about 0.5 to about 100 microns thick and ... | 07/11/2006 |
