Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 8174131 | Semiconductor device having a filled trench structure and methods for fabricating the same Methods are provided for packaging a semiconductor die having a first surface. In accordance with an exemplary embodiment, a method comprises the steps of forming a trench in the first surface of the die, electrically and physically coupling the die to a packaging s... | 05/08/2012 |
| 8148830 | Environmental protection coating system and method A circuit board assembly includes a circuit board having an outer surface configured with a plurality of discrete electrical components. The assembly includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying th... | 04/03/2012 |
| 8143730 | Semiconductor device and method of manufacturing the same In a semiconductor device, corner portions of a inner insulating film are chamfered, and hence a damage is less likely to reach the corner portion of the inner insulating film, though the corner portion of an outer insulating film is damaged. Therefore, a hermeticit... | 03/27/2012 |
| 8115326 | Flexible substrates having a thin-film barrier Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexi... | 02/14/2012 |
| 8093730 | Underfilled semiconductor die assemblies and methods of forming the same An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with... | 01/10/2012 |
| 8018077 | Electromechanical system having a controlled atmosphere, and method of fabricating same There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments.... | 09/13/2011 |
| 7986050 | Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): (A) an epoxy resin represented by the following str... | 07/26/2011 |
| 7948095 | Semiconductor package and method of making the same The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabricati... | 05/24/2011 |
| 7915746 | Semiconductor wafer, and semiconductor device formed therefrom A semiconductor wafer has a substrate, and a plurality of active areas formed on the substrate. Integrated circuits are formed in the active areas. The semiconductor wafer also has dicing areas formed between the adjacent active areas. A seal ring is formed along th... | 03/29/2011 |
| 7906860 | Semiconductor device A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second... | 03/15/2011 |
| 7888809 | Semiconductor device and method of manufacturing the same A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a secon... | 02/15/2011 |
| 7868471 | Integrated circuit package-in-package system with leads An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the ... | 01/11/2011 |
| 7834469 | Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper... | 11/16/2010 |
| 7834470 | Semiconductor device and programming method The present invention include a semiconductor device and a method therefore, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a res... | 11/16/2010 |
| 7816794 | Electronic device and method of fabricating the same An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including... | 10/19/2010 |
| 7812463 | Packaging integrated circuits for high stress environments One aspect of the invention pertains to a semiconductor package suitable for use in high stress environments, such as ones involving high pressures, temperatures and/or corrosive substances. In this aspect, a die and leadframe are fully encapsulated in a first plast... | 10/12/2010 |
| 7768141 | Dicing die attachment film and method for packaging semiconductor using same A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between ... | 08/03/2010 |
| 7768140 | Semiconductor device A semiconductor device has a semiconductor chip bonded to external connection pads or external connection terminals by flip-chip bonding and an underfill resin, and provides a semiconductor device which enables to lessen the warpage attributable to the underfill wit... | 08/03/2010 |
| 7759807 | Semiconductor package having structure for warpage prevention A semiconductor package includes a substrate having a plurality of connection pads and a plurality of ball lands; a semiconductor chip attached to one surface of the substrate and having a plurality of bonding pads that are connected to the respective connection pad... | 07/20/2010 |
| 7741726 | Integrated circuit underfill package system An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die ... | 06/22/2010 |
| 7728445 | Semiconductor device production method and semiconductor device A semiconductor device production method which includes steps of: preparing a wafer on which multiple integrated circuits are formed on a principal face; forming a rewiring which is electrically connected to the integrated circuits via a pad electrode; and dicing th... | 06/01/2010 |
| 7675186 | IC package with a protective encapsulant and a stiffening encapsulant An IC package mainly includes a substrate having slot(s), a chip, a protective encapsulant, a stiffening encapsulant, and a plurality of external terminals. The Young's modulus of the stiffening encapsulant is greater than the one of the protective encapsulant and t... | 03/09/2010 |
| 7663254 | Semiconductor apparatus and method of manufacturing the same There is provided a semiconductor apparatus which includes a substrate, a semiconductor chip mounted above the substrate, a first resin filled between the substrate and the semiconductor chip, and a second resin formed on the substrate and extending from a side surf... | 02/16/2010 |
| 7652384 | Fabricating tall micro structures A micro structure includes a seed electrode layer on a substrate and a plurality of conductive layers on the seed electrode layer. The combined thickness of the seed electrode layer and the plurality of conductive layers can be more than 0.1 mm and the lateral dimen... | 01/26/2010 |
| 7652385 | Semiconductor device and method of manufacturing the same Aiming at providing a semiconductor device advanced in performance of transistors, and improved in reliability, a semiconductor device of the present invention has a semiconductor element, a frame component provided over the semiconductor element, while forming a ca... | 01/26/2010 |
| 7649270 | Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c... | 01/19/2010 |
| 7566978 | Semiconductor device and programming method The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resi... | 07/28/2009 |
| 7492048 | CMOS sensors having charge pushing regions Structures and method for forming the same. The semiconductor structure comprises a photo diode that includes a first semiconductor region and a second semiconductor region. The first and second semiconductor regions are doped with a first and second doping polariti... | 02/17/2009 |
| 7482702 | Semiconductor component sealed on five sides by polymer sealing layer A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 01/27/2009 |
| 7435625 | Semiconductor device with reduced package cross-talk and loss Structure and method are provided for plastic encapsulated semiconductor devices having reduced package cross-talk and loss. Semiconductor die are first coated with a buffer region having a lower dielectric constant ε and/or lower loss tangent δ than the plastic e... | 10/14/2008 |
| 7432604 | Semiconductor component and system having thinned, encapsulated dice A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 10/07/2008 |
| 7427813 | Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectiv... | 09/23/2008 |
| 7417330 | Semiconductor device packaged into chip size and manufacturing method thereof A semiconductor device includes a semiconductor substrate having an integrated circuit and at least one connection pad, and at least one external connection electrode electrically connected with the connection pad. A first sealing material is provided on the semicon... | 08/26/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7405656 | Device and method for encapsulation and mounting of RFID devices This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmissi... | 07/29/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7391101 | Semiconductor pressure sensor A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a... | 06/24/2008 |
| 7388297 | Semiconductor device with reduced thickness of the semiconductor substrate A semiconductor device includes a silicon substrate having first and second surfaces, in which a wiring pattern is formed on the first surface; a first resin layer formed over the first surface of the silicon substrate; and a second resin layer formed over the secon... | 06/17/2008 |
| 7382060 | Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 06/03/2008 |
| 7378745 | Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a singl... | 05/27/2008 |
