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| Number | Title | Issue Date |
| 8178983 | Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same It is an object of the present invention to provide a water repellant composition for a substrate to be exposed which inhibits the back side of a substrate to be exposed from being contaminated by an immersion liquid, can improve adhesion between a film to be proces... | 05/15/2012 |
| 8164201 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front s... | 04/24/2012 |
| 8148829 | Self repairing IC package design An integrated circuit package comprises a molding compound covering a semiconductor die. A healing substance is on the surface of the semiconductor die at an interface of the molding compound and the semiconductor die. The healing compound comprises a catalyst and a... | 04/03/2012 |
| 8067841 | Semiconductor devices having a resin with warpage compensated surfaces A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the maj... | 11/29/2011 |
| 8044524 | Adhesive for connection of circuit member and semiconductor device using the same An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing ... | 10/25/2011 |
| 8035236 | Semiconductor device comprising high performance encapsulation resins A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4th and/or 13th group elements of the periodic table. The cured polyorganosiloxane composites may be catal... | 10/11/2011 |
| 7960847 | Packaging structure of SIP and a manufacturing method thereof A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a c... | 06/14/2011 |
| 7928590 | Integrated circuit package with a heat dissipation device Integrated circuit assembly including a die stack assembly having a heat dissipation device thermally coupled to a lateral of surface the die stack assembly. The die stack assembly includes a plurality integrated circuits placed on each other. In another embodiment ... | 04/19/2011 |
| 7906859 | Semiconductor device A semiconductor device includes a molding resin layer and a semiconductor element encapsulated with the molding resin layer. The molding resin layer has an opening. A surface of the semiconductor element is partially exposed outside the molding resin layer through t... | 03/15/2011 |
| 7834468 | Passivated nanoparticles, method of fabrication thereof, and devices incorporating nanoparticles A plurality of semiconductor nanoparticles having an elementally passivated surface are provided. These nanoparticles are capable of being suspended in water without substantial agglomeration and substantial precipitation on container surfaces for at least 30 days. ... | 11/16/2010 |
| 7560821 | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same An area mount type semiconductor device having high reliability when a semiconductor element is mounted on a surface with the use of a lead-free solder, and a die bonding resin composition and encapsulating resin composition used for the area mount type semiconducto... | 07/14/2009 |
| 7560820 | Integrated getter for vacuum or inert gas packaged LEDs A technique for controlling an atmosphere within an enclosure involves providing a getter within the atmosphere of the enclosure. An LED manufactured according to the technique may include a getter within an enclosed volume of the LED device. ... | 07/14/2009 |
| 7550859 | System and method for hermetically sealing a package A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic s... | 06/23/2009 |
| 7547978 | Underfill and encapsulation of semiconductor assemblies with materials having differing properties Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physi... | 06/16/2009 |
| 7474009 | Optoelectronic molding compound that transmits visible light and blocks infrared light A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy composition, a linear polyol, a dye that absorbs in the region of above... | 01/06/2009 |
| 7436076 | Micromechanical component having an anodically bonded cap and a manufacturing method A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the fun... | 10/14/2008 |
| 7436075 | Ion beam irradiation apparatus and ion beam irradiation method The ion beam irradiation apparatus has a vacuum chamber 10, an ion source 2, a substrate driving mechanism 30, rotation shafts 14, arms 12, and a motor. The ion source 2 is disposed inside the vacuum chamber 10, and e... | 10/14/2008 |
| 7436002 | Surface-mountable radiation-emitting component A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip. ... | 10/14/2008 |
| 7425731 | Light emitting diode package A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a r... | 09/16/2008 |
| 7397140 | Chip module A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. ... | 07/08/2008 |
| 7391102 | Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces Disclosed is a semiconductor apparatus including: a first molded resin portion; a plate-shaped lead frame closely attached to the first molded resin portion; a second molded resin portion attached facing the first molded resin portion and the lead frame; and one or ... | 06/24/2008 |
| 7382059 | Semiconductor package structure and method of manufacture In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating ma... | 06/03/2008 |
| 7382060 | Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 06/03/2008 |
| 7374969 | Semiconductor package with conductive molding compound and manufacturing method thereof The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effec... | 05/20/2008 |
| 7371618 | Method of manufacturing wafer-level chip-size package and molding apparatus used in the method Provided are a method of manufacturing wafer-level chip-size packages and a molding apparatus suitable for practicing the method whereby a semiconductor wafer having a plurality of semiconductor chips formed thereon may be encapsulated. The semiconductor wafer, typi... | 05/13/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7355278 | Mold die for a semiconductor device A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a ... | 04/08/2008 |
| 7352071 | Method of fabricating anti-warp package An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location undern... | 04/01/2008 |
| 7348660 | Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package A leadframe includes a multiplicity of leads. The leads have a board level contact portion, an intermediate portion and a chip level contact portion. The intermediate portion is disposed between the board level contact portion and the chip level contact portion. The... | 03/25/2008 |
| 7335982 | Chip package structure and chip packaging process A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the ca... | 02/26/2008 |
| 7332797 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating po... | 02/19/2008 |
| 7329598 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device has: preparing a semiconductor wafer having electrode pads formed on the main surface; forming contact portions, which connect to the electrode pads, on the main surface; forming a sealing resin over the main surface;... | 02/12/2008 |
| 7327019 | Semiconductor device of a charge storage type According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. ... | 02/05/2008 |
| 7317258 | Thermal interface apparatus, systems, and fabrication methods An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material. ... | 01/08/2008 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7312106 | Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to k... | 12/25/2007 |
| 7312536 | Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight ... | 12/25/2007 |
| 7294530 | Method for encapsulating multiple integrated circuits A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first e... | 11/13/2007 |
| 7294929 | Solder ball pad structure An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The ... | 11/13/2007 |
| 7291905 | Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device A lead frame of the present invention includes a plurality of tie bars including tie bars each having deformable portions that protect opposite outside frames from deformation. The outside frames each are formed with positioning holes. Element loading portions to be... | 11/06/2007 |
