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| Number | Title | Issue Date |
| 8178982 | Dual molded multi-chip package system A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the ... | 05/15/2012 |
| 8169089 | Semiconductor device including semiconductor chip and sealing material A semiconductor device includes at least bonding wires between electrode pads on a main surface of a semiconductor chip and connection pads on a wiring board. The wires form loop shapes from the electrode pads of the semiconductor chip. The semiconductor device also... | 05/01/2012 |
| 8148828 | Semiconductor packaging device A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located betw... | 04/03/2012 |
| 8134242 | Integrated circuit package system with concave terminal An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation. ... | 03/13/2012 |
| 8129849 | Method of making semiconductor package with adhering portion Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range... | 03/06/2012 |
| 8110933 | Semiconductor device mounted structure and semiconductor device mounted method A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding resin partially inside the recess portion. Thereby, increases of a placement area for a fillet portion (foot spread... | 02/07/2012 |
| 8097965 | Semiconductor device and method of manufacturing the same In the manufacture of semiconductor devices, cracking of a resin member caused during cutting and defects in the external appearance are prevented. ... | 01/17/2012 |
| 8089166 | Integrated circuit package with top pad An integrated circuit package system includes a bottom pad with a bottom tie bar, attaching an integrated circuit die over the bottom pad, attaching a top pad with a top tie bar, over the integrated circuit die, and applying an encapsulant wherein the top tie bar in... | 01/03/2012 |
| 8080885 | Integrated circuit packaging system with multi level contact and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a first level contact on a first external connection level; forming a second level contact on a second external connection level next to the first external connection level; attachin... | 12/20/2011 |
| 8072085 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic p... | 12/06/2011 |
| 8039975 | Device comprising a semiconductor component, and a manufacturing method A device having at least one semiconductor component, which is covered by a protective material on its outer surface. The invention provides for the outer surface to be provided with a surface structure so as to enlarge the heat transfer area to the protective mater... | 10/18/2011 |
| 8035235 | Integrated circuit packaging system with package-on-package and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing an encapsulation system having a mold chase with a buffer layer attached thereto; forming a base integrated circuit package including: providing a base substrate, connecting an exp... | 10/11/2011 |
| 8026618 | Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer i... | 09/27/2011 |
| 8008787 | Integrated circuit package system with delamination prevention structure An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die. | 08/30/2011 |
| 8004095 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on t... | 08/23/2011 |
| 7986049 | Semiconductor device having multiple-layer hard mask with opposite stresses and method for fabricating the same A semiconductor device includes a hard mask including a first layer and a second layer in contact with each other and having opposite stress types, wherein a difference between initial stresses of the first layer and the second layer is increased so that after a the... | 07/26/2011 |
| 7986048 | Package-on-package system with through vias and method of manufacture thereof A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surfac... | 07/26/2011 |
| 7969026 | Flexible carrier for high volume electronic package fabrication An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate and having two surfaces; a nonstick coating disposed on one surface o... | 06/28/2011 |
| 7956475 | Step cavity for enhanced drop test performance in ball grid array package A ball grid array (BGA) package includes a substrate layer having first and second sides. A semiconductor chip is attached to the first side of the substrate layer by a dielectric adhesive layer. A plurality of solder balls are attached to the second side of the sub... | 06/07/2011 |
| 7944062 | Air cavity package for a semiconductor die and methods of forming the air cavity package A die package (72) for a semiconductor die (20). A plurality of the die packages (72) are formed on a single carrier (10) by applying a body (55) of molding compound across a carrier (10) with an air cavity (70) defin... | 05/17/2011 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vert... | 05/17/2011 |
| 7932617 | Semiconductor package and manufacturing method thereof and encapsulating method thereof A semiconductor package, a manufacturing method thereof and an encapsulating method thereof are provided. The semiconductor package includes a substrate, a flip chip, a plurality of conductive parts and a sealant. The substrate has a substrate upper surface. The fli... | 04/26/2011 |
| 7923852 | Semiconductor package structure with protection bar A semiconductor package structure includes a carrier, a chip or multi-chips mounted on a top surface of the carrier, a molding compound encapsulating the top surface and the chips, a plurality of solder balls distributed on a bottom surface of the carrier, and a pro... | 04/12/2011 |
| 7911070 | Integrated circuit packaging system having planar interconnect An integrated circuit package system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; c... | 03/22/2011 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. Th... | 03/01/2011 |
| 7893548 | SiP substrate Disclosed in this specification is a system-in-a-package substrate that includes an interconnect substrate for permitting finely pitched connections to be made to an integrated circuit. The interconnect substrate includes a central region on its upper surface for re... | 02/22/2011 |
| 7893547 | Semiconductor package with a support structure and fabrication method thereof A semiconductor package with a support structure and a fabrication method thereof are provided. With a chip being electrically connected to electrical contacts formed on a carrier, a molding process is performed. A plurality of recessed portions formed on the carrie... | 02/22/2011 |
| 7880317 | Semiconductor device and method of manufacturing semiconductor device A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for ... | 02/01/2011 |
| 7872360 | Semiconductor device and method of manufacturing the same A semiconductor device is disclosed that includes a wiring board having a via formed therein; a semiconductor element provided on the wiring board; a resist layer covering a surface of the wiring board, the resist layer having an opening in a part thereof positioned... | 01/18/2011 |
| 7863760 | Roll-to-roll fabricated encapsulated semiconductor circuit devices An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements h... | 01/04/2011 |
| 7863761 | Integrated circuit package system with molding vents An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circu... | 01/04/2011 |
| 7863762 | Method of packaging and interconnection of integrated circuits A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly ... | 01/04/2011 |
| 7851930 | Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties An adhesive composition having thermal conductivity as well as excellent dispensability properties is provided. The adhesive composition includes a curable resin component, a curing agent for the curable resin component, and a conductive filler material. The filler ... | 12/14/2010 |
| 7839004 | Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame To provide a semiconductor device and a semiconductor module in which breakage of a semiconductor element due to a pressing force given from the outside is prevented. A semiconductor device according to the present invention has a configuration mainly including an i... | 11/23/2010 |
| 7834467 | Layer between interfaces of different components in semiconductor devices A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding co... | 11/16/2010 |
| 7781899 | Leadframe having mold lock vent A leadframe for supporting a semiconductor chip, the leadframe including a die pad having a first major surface and an opposing second major surface defining a thickness and having at least one perimeter edge, and an opening spaced from the at least one perimeter ed... | 08/24/2010 |
| 7777354 | Integrated circuit package system with leaded package An integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads parti... | 08/17/2010 |
| 7772709 | Resin sealed semiconductor device and manufacturing method therefor A resin sealed semiconductor device includes a first semiconductor switching device having a first emitter terminal and a first collector terminal bonded to its top and bottom surfaces respectively, a second semiconductor switching device having a second emitter ter... | 08/10/2010 |
| 7768139 | Power semiconductor module A power semiconductor module is disclosed with a housing that includes a hardenable plastic casting compound and a base plate, wherein electric power semiconductor components are arranged on a section of the surface of the base plate that faces the housing via an in... | 08/03/2010 |
| 7759806 | Integrated circuit package system with multiple device units An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device un... | 07/20/2010 |
