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| Number | Title | Issue Date |
| 8138614 | Semiconductor device having an antenna with anisotropic conductive adhesive It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit, a conductive layer... | 03/20/2012 |
| 8120189 | Wiring terminal-connecting adhesive A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles. ... | 02/21/2012 |
| 8115322 | Adhesive, method of connecting wiring terminals and wiring structure This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure whic... | 02/14/2012 |
| 8106521 | Semiconductor device mounted structure with an underfill sealing-bonding resin with voids In a semiconductor device mounted structure in which device electrodes of a semiconductor device and board electrodes of a board are connected to each other via bump electrodes, respectively, and in which a sealing-bonding resin is placed between the semiconductor d... | 01/31/2012 |
| 8106522 | Adhesive sheet for a stealth dicing and a production method of a semiconductor wafer device An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's ... | 01/31/2012 |
| 8102060 | Electrically conducting connection with insulating connection medium A device comprising a first component (5) having a first surface (6), a second component (8) having a second surface (9) and a connection layer (7) between the first surface (6) of the first component (5) and the seco... | 01/24/2012 |
| 8008783 | Dicing tape and die attach adhesive with patterned backing Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device f... | 08/30/2011 |
| 8004093 | Integrated circuit package stacking system An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking ... | 08/23/2011 |
| 7999396 | Adhesive tape and semiconductor package using the same Provided is an adhesive tape which adheres two members to each other and decreases problems that may occur due to contraction and expansion of the adhered members when the temperature of the adhered two members changes. The adhesive tape includes: a base film having... | 08/16/2011 |
| 7994645 | Integrated circuit package system with wire-in-film isolation barrier An integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhes... | 08/09/2011 |
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2)... | 06/21/2011 |
| 7948092 | Electronic component and method for manufacturing the same A method of manufacturing an electronic component includes the steps of: a) forming via holes penetrating through a first semiconductor substrate and a second semiconductor substrate which are bonded together by way of a connection layer; b) pattern-etching the seco... | 05/24/2011 |
| 7948091 | Mounting structure for semiconductor element A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semicondu... | 05/24/2011 |
| 7948090 | Capillary-flow underfill compositions, packages containing same, and systems containing same An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer ... | 05/24/2011 |
| 7936075 | Semiconductor device and semiconductor device manufacturing method The present invention provides a semiconductor device for which thermal stress at mounting is reduced and a reduction in reliability with regard to moisture absorption is prevented. The semiconductor device includes a uppermost metal layer 12, a solder bump | 05/03/2011 |
| 7932614 | Method of thinning a semiconductor substrate A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate. A carrier substrate is thereafter attached to the laser-ablative adhesive layer. The back side of the semiconductor substrate is thinned by polishing or grin... | 04/26/2011 |
| 7919875 | Semiconductor device with recess portion over pad electrode A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area o... | 04/05/2011 |
| 7915743 | Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable ... | 03/29/2011 |
| 7911067 | Semiconductor package system with die support pad A semiconductor package system includes: providing a lead frame with a lead; making a die support pad separately from the lead frame; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the lead... | 03/22/2011 |
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package A molded integrated circuit package is described. The molded integrated circuit package comprises a substrate having a plurality of contacts on a first surface; a die having a plurality of solder bumps on a first surface, the plurality of solder bumps being coupled ... | 03/15/2011 |
| 7902682 | Ultraviolet energy curable tape and method of making a semiconductor chip using the tape There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using... | 03/08/2011 |
| 7880316 | Dicing die-bonding film and process for producing semiconductor device The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesi... | 02/01/2011 |
| 7868467 | Semiconductor device A semiconductor device includes a first substrate, a plurality of cell transistors and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface. The plurality of cell transistors is formed extending on the first ... | 01/11/2011 |
| 7868465 | Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive l... | 01/11/2011 |
| 7868466 | Semiconductor device and method of manufacture thereof, circuit board and electronic instrument A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material between a substrate and a semiconductor chip; a second step in which pressure and heat are applied between the semiconductor chip ... | 01/11/2011 |
| 7863758 | Adhesive film composition, associated dicing die bonding film, and die package An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or... | 01/04/2011 |
| 7830023 | Resin molded semiconductor device A semiconductor device includes a circuit board, a wiring part, a protective coating glass, and a resin part. The circuit board has an approximately rectangular shape. The protective coating glass is disposed on the circuit board and is arranged on an inside of the ... | 11/09/2010 |
| 7800241 | Semiconductor device with semiconductor device components embedded in a plastics composition A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic compounds are used for producing an adhesion promoter layer. The adhesion promoter layer on the surfaces ... | 09/21/2010 |
| 7786602 | Patterned die attach and packaging method using the same A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches... | 08/31/2010 |
| 7781896 | Semiconductor device and process for fabrication thereof A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not m... | 08/24/2010 |
| 7732934 | Semiconductor device having conductive adhesive layer and method of fabricating the same In a semiconductor device, a semiconductor substrate may include a plurality of first conductive pads. An insulating isolation layer may be on the semiconductor substrate so as to separate the first conductive pads. A package substrate may include a plurality of sec... | 06/08/2010 |
| 7705472 | Semiconductor device with semiconductor device components embedded in a plastic housing composition A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed... | 04/27/2010 |
| 7701071 | Method for fabricating flip-attached and underfilled semiconductor devices A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is space... | 04/20/2010 |
| 7687923 | Semiconductor device package having a back side protective scheme The present invention provides a semiconductor device package, comprising a die having a back surface and an active surface formed thereon; an adhesive layer formed on the back surface of the die; a protection substrate formed on the adhesive layer; and a plurality ... | 03/30/2010 |
| 7667337 | Semiconductor device with conductive die attach material A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material. ... | 02/23/2010 |
| 7633169 | Chip package structure A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps is formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to ... | 12/15/2009 |
| 7615872 | Semiconductor device A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted... | 11/10/2009 |
| 7615871 | Method and apparatus for attaching microelectronic substrates and support members A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surf... | 11/10/2009 |
| 7592708 | Package board, semiconductor package, and fabricating method thereof With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board and having at least one bump attached to at least a portion of the c... | 09/22/2009 |
| 7582974 | Semiconductor device and method of manufacturing same A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted; a bonding agent for bonding the semiconductor chip to the die pad; a ... | 09/01/2009 |
