Class 257/777 - Chip mounted on chip

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein a semiconductor substrate of an active
No. of patents: 2503
Last issue date: 05/15/2012

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Number	Title	Issue Date
8178978	Support mounted electrically interconnected die assembly Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder. ...	05/15/2012
8174126	Stacked multi-chip A stacked multi-chip comprises a base layer, a first chip, a first stacked chip and at least one second stacked chip. The base layer comprises a mounting panel and a redistributed layer. The redistributed layer is mounted on the mounting panel. The first chip compri...	05/08/2012
8174127	Integrated circuit package system employing device stacking A method of manufacturing an integrated circuit packaging system includes: providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour; forming a bump contact, having a groove in and a mesa from the inner lead ...	05/08/2012
8169082	Semiconductor device and method for manufacturing the same A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. Th...	05/01/2012
8164199	Multi-die package A multi-die package has a plurality of leads and first and second semiconductor dies in superimposition and bonded together defining a die stack. The die stack has opposed first and second sides, with each of the first and second semiconductor dies having gate, drai...	04/24/2012
8164200	Stack semiconductor package and method for manufacturing the same A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first...	04/24/2012
8159076	Method of producing a via in a reconstituted substrate A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a fir...	04/17/2012
8159075	Semiconductor chip stack and manufacturing method thereof A semiconductor chip stack includes a first chip and a second chip. The first chip includes a first circuit formed in the first chip with a first integration density, and the second chip includes a second circuit in the second chip with a second integration density ...	04/17/2012
8148825	Integrated circuit package system with leadfinger An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and ...	04/03/2012
8143726	Semiconductor device and method of making semiconductor device A semiconductor device includes a semiconductor chip, and a micro-chip which is electrically connected to the chip, and includes a thickness which is less than a thickness of the chip. ...	03/27/2012
8143727	Adhesive on wire stacked semiconductor package A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is...	03/27/2012
8138610	Multi-chip package with interconnected stacked chips A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate a...	03/20/2012
8138611	Semiconductor device having shifted stacked chips A first semiconductor chip and a second semiconductor chip which form a stack are mounted on a module substrate by deflecting a center position of the semiconductor chips from the module substrate. In the side where the distance from the edge of the deflected semico...	03/20/2012
8134237	Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconduct...	03/13/2012
8134236	Electronic module with switching functions and method for producing the same An electronic module with switching functions includes integrated circuit chips arranged in a chip stack. The integrated circuit chips of the chip stack in each case includes a large-area contact on the top side and/or the rear side, the areal extent of the large-ar...	03/13/2012
8120187	Integrated circuit package system employing device stacking and method of manufacture thereof A method of manufacture of an integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and...	02/21/2012
8120186	Integrated circuit and method An integrated circuit and method of fabricating an integrated circuit. One embodiment includes a circuit chip, a contact pad, and a projecting top contact. A signal line couples the contact pad to the projecting top contact, the contact pad, the projecting top conta...	02/21/2012
8110928	Stacked-type chip package structure and method of fabricating the same A stacked-type chip package structure including a first package structure, a second package structure, and a first molding compound is provided. The first package structure includes a first substrate, and a first chip stacked thereon and electrically connected there...	02/07/2012
8110929	Semiconductor module A semiconductor module includes: a substrate having a wiring layer; a first rectangular-shaped semiconductor device mounted on one surface of the substrate; a second rectangular-shaped semiconductor device mounted on the other surface of the substrate. The first sem...	02/07/2012
8106520	Signal delivery in stacked device Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer...	01/31/2012
8097954	Adhesive layer forming a capacitor dielectric between semiconductor chips A semiconductor device of the invention includes a substrate in which a power-supply electrode and a ground electrode are provided. A first semiconductor chip is disposed over the substrate and has a first conductor layer formed on a surface facing a second semicond...	01/17/2012
8097955	Interconnect structures and methods Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material...	01/17/2012
8097956	Flexible packaging for chip-on-chip and package-on-package technologies In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ...	01/17/2012
8097957	Flash memory card A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer resul...	01/17/2012
8093727	Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device ...	01/10/2012
8093726	Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same A semiconductor package and methods for manufacturing the same are provided. The semiconductor package includes a substrate, first and second semiconductor chips stacked on the substrate. An interposer is disposed between the first and second semiconductor chips. Th...	01/10/2012
8084868	Semiconductor package with fast power-up cycle and method of making same In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including at least two electronic components which are provided in a stacked arrangement, and are each electrically connected to an underlying substrate throu...	12/27/2011
8072083	Stacked electronic component package having film-on-wire spacer A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic co...	12/06/2011
8072082	Pre-encapsulated cavity interposer A pre-encapsulated cavity interposer, a pre-encapsulated frame, for a semiconductor device. ...	12/06/2011
8067840	Power amplifier assembly The power amplifier module comprises a laminate substrate comprising thermal vias and terminals, as well as a platform device with an interconnection substrate of a semiconductor material. This substrate is provided with electrical interconnects at a first side, and...	11/29/2011
8063491	Stacked device conductive path connectivity Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack. ...	11/22/2011
8063493	Semiconductor device assemblies and packages A sacrificial substrate for fabricating semiconductor device assemblies and packages with edge contacts includes conductive elements on a surface thereof, which are located so as to align along a street between each adjacent pair of semiconductor devices on the devi...	11/22/2011
8063492	Multi-chip stacked package A multi-chip stacked package primarily comprises a chip carrier, a first chip disposed on the chip carrier, a plurality of die-attaching bars, a second chip stacked on the first chip by the adhesion of the die-attaching bars, and a plurality of bonding wires electri...	11/22/2011
8053903	Chip capacitive coupling A method of creating a semiconductor chip having a substrate, a doped semiconductor material abutting the substrate and a device pad at an outer side of the doped semiconductor material involves creating a via through at least a portion of the substrate, the via hav...	11/08/2011
8049340	Device for avoiding parasitic capacitance in an integrated circuit package An integrated circuit package substrate includes a first and an additional electrically conductive layer separated from each other by an electrically insulating layer, a contact pad formed in the first electrically conductive layer for making a direct connection bet...	11/01/2011
8049341	Semiconductor package and method for manufacturing the same A stacked semiconductor package and a method for manufacturing the same are presented which exhibit a reduced electrical resistance and an increased junction force. The semiconductor package includes at least two semiconductor chips stacked upon each other. Each sem...	11/01/2011
8049342	Semiconductor device and method of fabrication thereof A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or ...	11/01/2011
8044520	Semiconductor device A power supply capable of reducing loss of large current and high frequency. In an MCM for power supply in which a high-side power MOSFET chip, a low-side power MOSFET chip and a driver IC chip driving them are sealed in one sealing material (a capsulating insulatio...	10/25/2011
8039969	Semiconductor device A semiconductor device 1 includes a semiconductor chip 10 (first semiconductor chip), a semiconductor chip 20 (second semiconductor chip) and a seal ring 30. The semiconductor chip 20 is provided on a surface S1 of the semic...	10/18/2011
8039970	Stacked semiconductor device and method of manufacturing the same A stacked semiconductor device includes a first semiconductor element mounted on a circuit substrate and a second semiconductor element stacked on the first semiconductor element via a spacer layer. An electrode pad of the first semiconductor element is electrically...	10/18/2011

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Class 257/777 - Chip mounted on chip