Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7755189 | Metal cap with ringed projection to be welded to stem and ringed groove provided immediately inside of ringed projection and optical device having the same An optical device with a CAN package is disclosed, where the cap is resistance-welded to the stem without causing failures due to fragments by the welding flying within the package. The cap of the invention has a flange portion to be welded to the stem. The flange p... | 07/13/2010 |
| 7656031 | Stackable semiconductor package having metal pin within through hole of package The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder... | 02/02/2010 |
| 7605467 | Package and electronic apparatus using the same An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of up... | 10/20/2009 |
| 7582965 | Electronic device and method for bonding an electronic device An electronic device (1) has a base plate (2) and an electronics housing (3) connected thereto, with a bonding contact terminal (5). The latter is supported relative to the base plate (2) via a supporting body (6) in such a ... | 09/01/2009 |
| 7416332 | Flexible circuit temperature sensor assembly for flanged mounted electronic devices A temperature sensing system for a flange mounted device is provided. The temperature sensing system (100) can be comprised of a flexible wiring board (102). The temperature sensing system can be further comprised of a temperature sensing device (12... | 08/26/2008 |
| 7274093 | Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulatio... | 09/25/2007 |
| 7271034 | Semiconductor device with a high thermal dissipation efficiency Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting str... | 09/18/2007 |
| 7272015 | Electronic unit with EMC shielding To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and elect... | 09/18/2007 |
| 7256493 | Ball grid array housing having a cooling foil A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one se... | 08/14/2007 |
| 7247942 | Techniques for joining an opto-electronic module to a semiconductor package The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using... | 07/24/2007 |
| 7183647 | Wiring substrate and electronic parts packaging structure In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support... | 02/27/2007 |
| 7164196 | Semiconductor device A semiconductor device includes a base, a semiconductor element having a plurality of electrodes, a plurality of conductive lines connected to the electrodes of the semiconductor element, plating stubs attached to the conductive lines, and a plurality of wiring laye... | 01/16/2007 |
| 7102228 | Semiconductor device A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate, an inner annular stiffener provided on the substrate in an outer side of the semiconductor element, and an outer annular stiffener provided on the substrate in an outer ... | 09/05/2006 |
| 7091582 | Electronic package with snap-on perimeter wall A semiconductor device package comprises a perimeter wall snap fitted to a base having a semiconductor die mounted on the base. A lead is mounted on the opposite side of the die, and the die and a portion of the lead are protected by an encapsulant disposed within t... | 08/15/2006 |
| 7091592 | Stacked package for electronic elements and packaging method thereof A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and ele... | 08/15/2006 |
| 7030477 | Optical semiconductor device A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front surface of a polyimide film. The lead terminal of the can package and one e... | 04/18/2006 |
| 7026709 | Stacked chip-packaging structure A stacked chip-packaging structure consisting of a plurality of chip-packaging units is provided. Each of the chip-packaging units includes a substrate, a chip, a plurality of wires, a molding compound, and a plurality of solder balls. The chip-packaging units are, ... | 04/11/2006 |
| 6870261 | Discrete circuit component having an up-right circuit die with lateral electrical connections A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one ele... | 03/22/2005 |
| 6822318 | Stress isolating die attach structure and method A method and structure for isolating a die from thermally induced or pressure induced differential stresses between a die and a package includes providing an intermediate layer having therein a plurality of relief channels arranged to provide a flexure for absorbing... | 11/23/2004 |
| 6762491 | Power semiconductor device The present invention is to provide a power semiconductor device including a heat radiator having a principal surface and an insulating substrate bonded on the principal surface of the heat radiator via a first solder layer. The power semiconductor device also inclu... | 07/13/2004 |
| 6750551 | Direct BGA attachment without solder reflow A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the microelectronic component and the carrier with solder balls attached to either... | 06/15/2004 |
| 6713844 | Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the su... | 03/30/2004 |
| 6670698 | Integrated circuit package mounting A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated co... | 12/30/2003 |
| 6495914 | Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate A metal base substrate for mounting a plurality of bare semiconductor chip devices thereon has first and second main surfaces. The first main surface has formed thereon at least one projection, and at least two recesses in which the bare semiconductor chi... | 12/17/2002 |
| 6465883 | Capsule for at least one high power transistor chip for high frequencies The present invention relates to a capsule (1) for at least one high power transistor chip (17) for high frequencies, comprising an electrically and thermally conductive flange (10), at least two electrically insulating substrates (15), and at least two e... | 10/15/2002 |
| 6430052 | Techniques for cooling a circuit board component A circuit board assembly has (i) a circuit board including a section of circuit board material and a circuit board component mounted to the section of circuit board material, (ii) a support assembly that supports the circuit board, and (iii) a heatsink th... | 08/06/2002 |
| 6297548 | Stackable ceramic FBGA for high thermal applications An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.... | 10/02/2001 |
| 6208020 | Leadframe for use in manufacturing a resin-molded semiconductor device A resin-molded semiconductor device includes: signal leads; a die pad with a central portion elevated above a peripheral portion thereof; support leads, each including a raised portion higher in level than the other portions; and DB paste for use in die b... | 03/27/2001 |
| 6072235 | Terminal arrangement for an SMD-capable hybrid circuit Terminal pins with two lateral portions and a bridge-shaped elevated middle portion are provided. The terminal pin and perpendicularly rising hybrid circuit typically together have an inverted T shape. On the one hand, the hybrid circuit stands on its own... | 06/06/2000 |
| 6060780 | Surface mount type unit and transducer assembly using same A surface mount type semiconductor package is mounted on a printed board by bonding, by means of solder bumps signal electrodes, electrically connected to respective terminals of a semiconductor chip incorporated in the package, with lands provided on the... | 05/09/2000 |
| 6049464 | Electronic modules manufacturing In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum nozzle to pick and place the module. According to the prese... | 04/11/2000 |
| 5986342 | Liquid crystal display apparatus structure for mounting semiconductor device A liquid crystal display apparatus is provided which requires a small, thin and compact area for mounting semiconductor chips for driving liquid crystal and, accordingly, has a reduced cost. Semiconductor chips for driving liquid crystal are mounted on a ... | 11/16/1999 |
| 5770891 | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the s... | 06/23/1998 |
| 5736787 | Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices A package for relatively high power transistors including heat conducting mounting flange having a relatively large "footprint" relative to the area covered by at least one active chip supported thereby and comprised of a plurality of bipolar silicon-carb... | 04/07/1998 |
| 5677569 | Semiconductor multi-package stack A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to th... | 10/14/1997 |
| 5543659 | Package for power semiconductor device with snubber circuit A power semiconductor device package of the invention is used for a power conversion equipment. The package is formed of a casing containing a power chip therein, external main circuit terminals for direct-current input and alternating-current output, and... | 08/06/1996 |
| 5519253 | Coaxial switch module A low inductance coaxial semiconductor switching module and methods of operating the same. The module can contain high power, high frequency semiconductor switching devices, operated to provide high power at low inductance. The module incorporates composi... | 05/21/1996 |
| 5278728 | Diode mounting A mounting assembly for a plurality of bipolar electrical components connected between two generally parallel electrical supports, each bipolar electrical component having a lower base terminal fixedly mounted to the first electrical support and a general... | 01/11/1994 |
| 5260601 | Edge-mounted, surface-mount package for semiconductor integrated circuit devices A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an are... | 11/09/1993 |
| 5256902 | Metal heatsink attach system A heat-sink cooling apparatus and a method for attaching a heatsink to a ceramic integrated-circuit package are provided. An externally-threaded molybdenum stud is attached to and extends from a copper/tungsten slug, or attachment plate, which is brazed t... | 10/26/1993 |
