Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7989951 | Die assemblies An embodiment of a die assembly includes a flange, lip walls, and leads for electrical contact with one or more die mounted on the flange. The flange has first and second opposed flange surfaces and flange sidewalls extending between the surfaces. The lip walls have... | 08/02/2011 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semic... | 06/14/2011 |
| 7898080 | Power semiconductor device comprising a semiconductor chip stack and method for producing the same A power semiconductor device has a power field effect transistors connected in a bridge circuit (16), parallel circuit or series circuit (18), the power semiconductor device (30) having a base power semiconductor chip (1) with large-area ... | 03/01/2011 |
| 7723846 | Power semiconductor module and method of manufacturing the same A power semiconductor module and a method of manufacture thereof includes a lead frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using b... | 05/25/2010 |
| 7679185 | Microcircuit package having ductile layer A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device.... | 03/16/2010 |
| 7582964 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 09/01/2009 |
| 7518238 | Mounting flexible circuits onto integrated circuit substrates A substrate may receive an integrated circuit and a flex circuit on the same side in the same vertical direction. In addition, in some embodiments, a flex circuit adapter and the integrated circuit may be surface mounted in one operation. ... | 04/14/2009 |
| 7425758 | Metal core foldover package structures Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a re... | 09/16/2008 |
| 7416332 | Flexible circuit temperature sensor assembly for flanged mounted electronic devices A temperature sensing system for a flange mounted device is provided. The temperature sensing system (100) can be comprised of a flexible wiring board (102). The temperature sensing system can be further comprised of a temperature sensing device (12... | 08/26/2008 |
| 7368815 | Semiconductor device which prevents light from entering therein A CSP type semiconductor device protects a circuit from the influences exerted by an external light on a circuit. In the CSP type semiconductor device, a light-shielding material, such as a silicone-based resin, an epoxy-based resin, or a metal, is deposited onto a ... | 05/06/2008 |
| 7365981 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and... | 04/29/2008 |
| 7361880 | Digital camera module for detachably mounting with flex printed circuit board A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip pack... | 04/22/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7329947 | Heat treatment jig for semiconductor substrate When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that... | 02/12/2008 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7282793 | Multiple die stack apparatus employing T-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 10/16/2007 |
| 7253520 | CSP semiconductor device having signal and radiation bump groups A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a co... | 08/07/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7224057 | Thermal enhance package with universal heat spreader A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat sprea... | 05/29/2007 |
| 7215022 | Multi-die module A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die... | 05/08/2007 |
| 7138713 | Chip-type solid electrolytic capacitor and method of producing the same A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a s... | 11/21/2006 |
| 7109589 | Integrated circuit with substantially perpendicular wire bonds An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for at least one of the circuit elements. At least one wire bond in a firs... | 09/19/2006 |
| 7102228 | Semiconductor device A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate, an inner annular stiffener provided on the substrate in an outer side of the semiconductor element, and an outer annular stiffener provided on the substrate in an outer ... | 09/05/2006 |
| 7101736 | Method of assembling a semiconductor component and apparatus therefor A method of assembling a semiconductor component includes providing a pedestal, placing a first piece on the curved pedestal, wherein the first piece comprises a semiconductor die, placing a second piece over the first piece, and providing an adhesive between the fi... | 09/05/2006 |
| 7095098 | Electrically isolated and thermally conductive double-sided pre-packaged component An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper mat... | 08/22/2006 |
| 7061101 | Carrier module Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplement... | 06/13/2006 |
| 7053299 | Flange for integrated circuit package A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groo... | 05/30/2006 |
| 7030477 | Optical semiconductor device A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front surface of a polyimide film. The lead terminal of the can package and one e... | 04/18/2006 |
| 7012331 | Device for mounting a semiconductor package on a support plate via a base A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to ... | 03/14/2006 |
| 7005741 | Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligne... | 02/28/2006 |
| 6995467 | Semiconductor component A semiconductor component contains two semiconductor bodies, which are spatially separated from one another and electrically interconnected. A compensation MOS field effect transistor is provided as the first semiconductor body, and a silicon carbide Schottky diode ... | 02/07/2006 |
| 6992375 | Anchor for device package An anchor to hold getter materials in place within a micromechanical device package substrate. First and second cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. The getter anchor may be form... | 01/31/2006 |
| 6962338 | Hermetic seal and a method of making such a hermetic seal The invention provides a hermetic seal and a method of making a hermetic seal having the steps of providing a first member of a first material having a flange thereon, providing a second member of a second material having a slot thereon for accommodating the flange ... | 11/08/2005 |
| 6911723 | Multiple die stack apparatus employing T-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 06/28/2005 |
| 6909182 | Spherical semiconductor device and method for fabricating the same A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical... | 06/21/2005 |
| 6891259 | Semiconductor package having dam and method for fabricating the same A semiconductor package including a dam and a method for fabricating the same are provided. The semiconductor package comprises a package substrate, a semiconductor chip attached to the substrate, a TIM formed on the semiconductor chip, a dam that substantially surr... | 05/10/2005 |
| 6882040 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 04/19/2005 |
| 6879033 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 04/12/2005 |
| 6878875 | Small form factor optical transceiver with extended transmission range A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conduct... | 04/12/2005 |
| 6864573 | Two piece heat sink and device package A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opp... | 03/08/2005 |
