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| Number | Title | Issue Date |
| 7772692 | Semiconductor device with cooling member A semiconductor device comprises: a semiconductor element; a mounting substrate with the semiconductor element mounted thereon; a first high thermal conductivity member formed on a surface of the mounting substrate; and a first cooling member thermally connected to ... | 08/10/2010 |
| 7732918 | Vapor chamber heat sink having a carbon nanotube fluid interface An enhanced heat transposer comprised is of a vapor chamber. The surface of the vapor chamber that holds the fluid comprises an array of carbon nanotubes (CNTs) that are grown in a way that enables the fluid to come into maximum contact with the CNTs. The fluid evap... | 06/08/2010 |
| 7723845 | System and method of a heat transfer system with an evaporator and a condenser The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon ... | 05/25/2010 |
| 7714433 | Piezoelectric cooling of a semiconductor package In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan bla... | 05/11/2010 |
| 7564129 | Power semiconductor module, and power semiconductor device having the module mounted therein A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a pl... | 07/21/2009 |
| 7550841 | Methods of forming a diamond micro-channel structure and resulting devices A diamond micro-channel structure disposed on a die, as well as methods of forming the same, are disclosed. One or more walls of each channel may comprise diamond (or other diamond-like material). The micro-channel structure may form part of a fluid cooling system f... | 06/23/2009 |
| 7446412 | Heat sink design using clad metal Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Some aspects may also include a lower me... | 11/04/2008 |
| 7444041 | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity ... | 10/28/2008 |
| 7423877 | Heat dissipation device A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a mid... | 09/09/2008 |
| 7411290 | Integrated circuit chip and method for cooling an integrated circuit chip An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the su... | 08/12/2008 |
| 7391612 | Dual impeller push-pull axial fan sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/24/2008 |
| 7385816 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7385815 | Dual impeller push-pull axial fan A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7382047 | Heat dissipation device A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fi... | 06/03/2008 |
| 7372146 | Semiconductor module A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by flip chip bonding on or above the package substrate while letting the... | 05/13/2008 |
| 7359195 | Heatsink Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end contacting a heat source to absorb heat from the heat source and a heat-... | 04/15/2008 |
| 7359196 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 04/15/2008 |
| 7355856 | Method and apparatus for increasing natural convection efficiency in long heat sinks An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a diverter extending from the heat dissipation surface. The diverter disru... | 04/08/2008 |
| 7351918 | Surface-mount base for electronic element A surface-mount base for an electronic element includes: an insulative supporting member having a through hole; a plurality of lead terminals each having an element connecting terminal, a lead portion and a mounting terminal, the lead terminals being mounted to the ... | 04/01/2008 |
| 7347249 | Fixing device for a radiator A fixing device for a radiator provides a joining side projecting outward from a lateral side of each of the elastic strip members and has an engaging part at two inclining ends of the respective elastic strip member. The respective joining side is inserted into a l... | 03/25/2008 |
| 7342791 | Locking device for heat sink A locking device for securing a heat sink to a heat generating electronic device includes a retaining member attached to the heat sink and a plurality of fasteners positioned to the retaining member. The retaining member includes a frame and a plurality of fastening... | 03/11/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7339791 | CVD diamond enhanced microprocessor cooling system Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a... | 03/04/2008 |
| 7333336 | Heat radiating apparatus A heat radiating apparatus is provided which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat pipe having a portion connected to the heat sink and configured to trans... | 02/19/2008 |
| 7331377 | Diamond foam spray cooling system A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section... | 02/19/2008 |
| 7331183 | Personal portable environmental control system A personal portable environmental control system, which includes a thermoelectric device, two heat sinks, an exhaust fan for blowing ambient air across one heat sink and a blower for blowing ambient air across the other heat sink such that the blown air is condition... | 02/19/2008 |
| 7330352 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 02/12/2008 |
| 7327028 | Embedded heat spreader for folded stacked chip-scale package In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shape... | 02/05/2008 |
| 7324339 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 01/29/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature wit... | 01/15/2008 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
| 7310228 | Air shroud for dissipating heat from an electronic component A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second op... | 12/18/2007 |
| 7310226 | Modularized redundant heat sink for dissipating heat generated from chips A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit b... | 12/18/2007 |
| 7304376 | Microelectronic assemblies with springs A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding... | 12/04/2007 |
| 7304851 | Heat sink and its fabrication method A heat sink is disclosed to include a plurality of metal plate members arranged in a stack, each metal plate member having a rectangular body, a first sidewall and a second sidewall at two sides of the rectangular body, a T-shaped mounting hole in the rectangular bo... | 12/04/2007 |
| 7301769 | Fan holder A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending... | 11/27/2007 |
| 7289322 | Heat sink A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin pla... | 10/30/2007 |
| 7288805 | Double gate isolation A double-gated fin-type field effect transistor (FinFET) structure has electrically isolated gates. In a method for manufacturing the FinFET structure, a fin, having a gate dielectric on each sidewall corresponding to the central channel region, is formed over a bur... | 10/30/2007 |
