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| Number | Title | Issue Date |
| 7652373 | Power delivery using an integrated heat spreader An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by... | 01/26/2010 |
| 7586190 | Optoelectronic component and a module based thereon An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External e... | 09/08/2009 |
| 7545034 | Thermal energy removal structure and method An electrical structure including a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical component of the plurality of electrical components, a first thermally con... | 06/09/2009 |
| 7470983 | Semiconductor device reducing warping due to heat production A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between thermal expansion of the semiconductor element and thermal expansion o... | 12/30/2008 |
| 7453145 | Electronics unit An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a... | 11/18/2008 |
| 7443023 | High capacity thin module system Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry ... | 10/28/2008 |
| 7439614 | Circuit device with dummy elements In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring... | 10/21/2008 |
| 7436060 | Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connection... | 10/14/2008 |
| 7431071 | Fluid circuit heat transfer device for plural heat sources A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive ... | 10/07/2008 |
| 7427566 | Method of making an electronic device cooling system A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrific... | 09/23/2008 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7417312 | Use of solder paste for heat dissipation A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of binder particles and filler particles, or a solder paste. As an example... | 08/26/2008 |
| 7400506 | Method and apparatus for cooling a memory device A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is op... | 07/15/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7382618 | Heat dissipating apparatus for computer add-on cards A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the... | 06/03/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7372151 | Ball grid array package and process for manufacturing same A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conducti... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7365418 | Multi-chip structure A multi-chip structure at least including a first chip, a second chip and a first thermal-conductive layer is provided. The first chip has a first surface and a plurality of first pads disposed on the first surface. The second chip has a second surface facing the fi... | 04/29/2008 |
| 7362578 | Heat sink fastening system A heat sink assembly for removing heat from an electronic component includes a retention clip having a central body and a securing member extending from the central member. The central member has an opening there through, and the securing member is configured to sec... | 04/22/2008 |
| 7362582 | Cooling structure using rigid movable elements A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for ... | 04/22/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7358605 | Heat dissipation structure for electronic device A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside... | 04/15/2008 |
| 7359201 | Heat-generating electronic part cover and cover mounting method A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, op... | 04/15/2008 |
| 7355276 | Thermally-enhanced circuit assembly A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conduct... | 04/08/2008 |
| 7355855 | Compliant thermal interface structure utilizing spring elements A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a ... | 04/08/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
| 7342294 | SOI bipolar transistors with reduced self heating A bipolar transistor includes a collector located over a substrate; and a heat conductive path connecting the substrate to the collector. The heat conductive path is filled with a heat conductive material such as metal or polysilicon. In one embodiment the heat cond... | 03/11/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7342304 | Semiconductor package with heat dissipating structure A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a su... | 03/11/2008 |
| 7339264 | Semiconductor chip with external connecting terminal A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring b... | 03/04/2008 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of t... | 02/19/2008 |
| 7330355 | Fixed pillar with heat loss A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body. The plurality of grooves is respectively set on two sides of the metal... | 02/12/2008 |
| 7327027 | Thermal interface structure with integrated liquid cooling and methods A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are... | 02/05/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer ... | 01/01/2008 |