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| Number | Title | Issue Date |
| 8115302 | Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that ... | 02/14/2012 |
| 8110919 | Thermal interface with non-tacky surface A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow tempe... | 02/07/2012 |
| 8106505 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically con... | 01/31/2012 |
| 8102045 | Integrated circuit with galvanically bonded heat sink An integrated circuit includes a semiconductor substrate, a first electrical contact formed on the semiconductor substrate, and a first heat sink element bonded to the first electrical contact via a galvanic bond. ... | 01/24/2012 |
| 8102047 | Load driving device A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode ... | 01/24/2012 |
| 8102046 | Semiconductor device and method of manufacturing the same Through heat discharge only by wiring connected to a conventional semiconductor chip, sufficient heat discharge performance may not be achieved in a recent semiconductor device. A semiconductor device according to an aspect of the present invention includes: a flexi... | 01/24/2012 |
| 8093714 | Chip assembly with chip-scale packaging A chip assembly may comprise a substrate having a top surface and a bottom surface. The chip assembly may comprise a first die having a circuit surface and a connecting surface, the circuit surface comprising one or more integrated circuits. The chip assembly may co... | 01/10/2012 |
| 8076773 | Thermal interface with non-tacky surface A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum... | 12/13/2011 |
| 8035223 | Structure and process for electrical interconnect and thermal management A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one of the first and second substrates including at least one circuit ele... | 10/11/2011 |
| 8030761 | Mold design and semiconductor package A chip package includes a carrier having a first and a second major surface. The first major surface includes an active region surrounded by an inactive region. The chip package includes contact pads in the active region for mating with chip contacts of a chip. A su... | 10/04/2011 |
| 8013440 | Enhanced thermal dissipation ball grid array package In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active functional die and a thermal adhesive is used to bond an internal heat ... | 09/06/2011 |
| 8004080 | Edge mounted integrated circuits with heat sink A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a third edge and have optical circuits having ports on the first edge a... | 08/23/2011 |
| 7964959 | Semiconductor chip, method of fabricating the same and stacked package having the same A semiconductor chip, a method of fabricating the same and a stacked package having the same are disclosed. The semiconductor chip includes a wafer, a semiconductor device disposed on the wafer, an insulating layer covering the semiconductor device and disposed on t... | 06/21/2011 |
| 7952193 | Method and apparatus for deploying a liquid metal thermal interface for chip cooling In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includ... | 05/31/2011 |
| 7948077 | Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that ... | 05/24/2011 |
| 7944046 | Heat spreader for a multi-chip package Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a ... | 05/17/2011 |
| 7928563 | 3-D ICs with microfluidic interconnects and methods of constructing same Three dimensional integrated circuits with microfluidic interconnects and methods of constructing same are provided. According to some embodiments, and microfluidic integrated circuit system can comprise a plurality of semiconductor die wafers each having a top and ... | 04/19/2011 |
| 7928564 | Multichip module package and fabrication method A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically i... | 04/19/2011 |
| 7919855 | Topside thermal management of semiconductor devices using boron phosphide contacting a gate terminal A semiconductor device including at least one gate terminal in operational contact with an active layer or top surface of the semiconductor substrate includes a deposited layer of boron phosphide covering the gate terminal and at least a portion of the active layer ... | 04/05/2011 |
| 7907390 | Circuit device A circuit device includes a metal substrate; and a plurality of circuit elements, mounted on the metal substrate, which electrically connects to the metal substrate. The metal substrate is made of a copper plate of high thermal conductivity. The metal substrate is d... | 03/15/2011 |
| 7893529 | Thermoelectric 3D cooling The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from ... | 02/22/2011 |
| 7888794 | Semiconductor device and method A semiconductor device and method is disclosed. One embodiment provides an active region in a semiconductor substrate, including a first terminal region and a second terminal region. wherein the active region is interrupted by an inactive region, wherein an electric... | 02/15/2011 |
| 7851906 | Flexible circuit electronic package with standoffs A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexi... | 12/14/2010 |
| 7834447 | Compliant thermal contactor One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive,... | 11/16/2010 |
| 7709951 | Thermal pillow Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a fl... | 05/04/2010 |
| 7705447 | Input/output package architectures, and methods of using same A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be dispo... | 04/27/2010 |
| 7667319 | Electroosmotic pump using nanoporous dielectric frit An electroosmotic pump may be fabricated using semiconductor processing techniques with a nanoporous open cell dielectric frit. Such a frit may result in an electroosmotic pump with better pumping capabilities. ... | 02/23/2010 |
| 7659616 | On-chip cooling systems for integrated circuits Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. ... | 02/09/2010 |
| 7659615 | High power package with dual-sided heat sinking An assembly includes a semiconductor die disposed between an upper substrate and a lower substrate. A circuit board that defines a through hole is spaced axially below the upper substrate to define a gap between the upper substrate and the circuit board. An upper he... | 02/09/2010 |
| 7656027 | In-chip structures and methods for removing heat from integrated circuits An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of stru... | 02/02/2010 |
| 7638874 | Microelectronic package including temperature sensor connected to the package substrate and method of forming same A microelectronic package, a method of forming the package and a system incorporating the package. The package includes a substrate; a die bonded to the substrate; and a thermal sensor connected to the substrate. ... | 12/29/2009 |
| 7629683 | Thermal management of electronic devices Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The ... | 12/08/2009 |
| 7612448 | Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconducto... | 11/03/2009 |
| 7592696 | Power module having at least two substrates The invention relates to a power module 3 and a method for producing it. The power module 3 has a first substrate 1 having power semiconductor chips 4, and a second substrate 2 populated with signal semiconductor chips 5. Th... | 09/22/2009 |
| 7589417 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive inter... | 09/15/2009 |
| 7569931 | Cooling semiconductor device and manufacturing method thereof A semiconductor device includes a semiconductor substrate, a first diffusion region formed in the semiconductor substrate, a semiconductor element formed in the first diffusion region, and a channel formed in the first diffusion region to receive a cooling fluid. | 08/04/2009 |
| 7564128 | Fully testable surface mount die package configured for two-sided cooling A power semiconductor die is sandwiched between upper and lower heat conducting laminate structures to form a surface mount component that is configured for double-sided cooling. The upper heat conducting laminate structure electrically couples top-side die terminal... | 07/21/2009 |
| 7554194 | Thermally enhanced semiconductor package A semiconductor package has a substrate having a first surface, a second surface, and a through hole opening. A heat spreader has a first surface, a second surface, and a plurality of notches formed on the second surface. A semiconductor die is coupled to the first ... | 06/30/2009 |
| 7554193 | Semiconductor device A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without increasing the manufacturing cost is provided. In a semiconductor device havi... | 06/30/2009 |
| 7535099 | Sintered metallic thermal interface materials for microelectronic cooling assemblies A microelectronic cooling assembly and method for fabricating the same are described. In one example, a microelectronic cooling assembly includes a microelectronic device, a heat spreader, and a thermal interface material (TIM) that thermally joins the microelectron... | 05/19/2009 |
