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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 7939937 | Chip housing having reduced induced vibration A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structu... | 05/10/2011 |
| 7928560 | Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and... | 04/19/2011 |
| 7902663 | Semiconductor package having stepwise depression in substrate A semiconductor package with enhanced mobility of ball terminals is revealed. A chip is attached to the substrate by a die-attaching material where the substrate has at least a stepwise depression on the covered surface to make the substrate thickness be stepwise de... | 03/08/2011 |
| 7821125 | Semiconductor device The invention provides a heat radiating structure which reduces a mechanical stress applied to an electronic part mounted on a printed circuit board including a semiconductor package. The heat radiating structure is constructed by a semiconductor package mounted on ... | 10/26/2010 |
| 7745926 | Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and... | 06/29/2010 |
| 7671467 | Power semiconductor module A power semiconductor module having an integral circuit board with a metal substrate electrode, an insulation substrate and a heat sink joined is disclosed. A SiC semiconductor power device is joined to a top of the metal substrate electrode of the circuit board. A ... | 03/02/2010 |
| 7436077 | Semiconductor device and method of manufacturing the same A semiconductor device includes a first surface faced to a mounting board when the semiconductor device is placed over the mounting board and a second surface opposed to the first surface. The semiconductor device also includes a position reference portion which is ... | 10/14/2008 |
| 7423331 | Molded stiffener for thin substrates A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise ... | 09/09/2008 |
| 7423340 | Semiconductor package free of substrate and fabrication method thereof A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in t... | 09/09/2008 |
| 7388750 | Plasma display module A plasma display module, which can effectively dissipate heat, is disclosed. In one embodiment, the plasma display module includes i) a plasma display panel that displays images using gas discharge, ii) a chassis located on one surface of the plasma display panel to... | 06/17/2008 |
| 7365442 | Encapsulation of thin-film electronic devices One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an ... | 04/29/2008 |
| 7365424 | Microelectronic component assemblies with recessed wire bonds and methods of making same The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a subs... | 04/29/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7365423 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 04/29/2008 |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads... | 03/04/2008 |
| 7329957 | Circuit device and manufacturing method thereof A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin fi... | 02/12/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7298021 | Electronic device and method for manufacturing the same An electronic device is provided using wiring comprising aluminum to prevent hillock or whisker from generating, wherein the wiring contains oxygen atoms at a concentration of 8×1018 atoms·cm−3 or less, carbon atoms at a concentration of 5Ã... | 11/20/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7263883 | Gyro-sensor comprising a plurality of component units, and fabricating method thereof Provided are a gyro-sensor including a plurality of component units and a method of fabricating the gyro-sensor. The gyro-sensor includes: a substrate; a micro electro mechanical system structure including a surface including a predetermined area in which a cavity i... | 09/04/2007 |
| 7256491 | Thermal interconnect systems methods of production and uses thereof A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder mate... | 08/14/2007 |
| 7247948 | Semiconductor device and method for fabricating the semiconductor device A semiconductor device has a semiconductor substrate, at least a first and second rewiring device on a first surface of the semiconductor substrate for the provision of an electrical contact-connection of the semiconductor substrate, and a tapering, continuous openi... | 07/24/2007 |
| 7245009 | Hermetic cavity package A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers ... | 07/17/2007 |
| 7245500 | Ball grid array package with stepped stiffener layer Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted on a first surface of a stiffener. A first surface of a substrate is attached to a second surface of the stiffener that is opposed to the first surfa... | 07/17/2007 |
| 7238550 | Methods and apparatus for fabricating Chip-on-Board modules An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a pr... | 07/03/2007 |
| 7235877 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 06/26/2007 |
| 7230333 | Semiconductor package A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. ... | 06/12/2007 |
| 7211889 | Semiconductor package and method for manufacturing the same A semiconductor package includes a wiring board, a semiconductor chip flip-chip bonded to the wiring board, an adhesive coated on the wiring board, a stiffener ring attached to the wiring board, and a heat spreader attached to the stiffener ring and the semiconducto... | 05/01/2007 |
| 7205652 | Electronic assembly including multiple substrates An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having ... | 04/17/2007 |
| 7196414 | Semiconductor package with heat sink A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive mate... | 03/27/2007 |
| 7193328 | Semiconductor device Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and the wiring pattern. The semiconductor device of the present invention... | 03/20/2007 |
| 7173332 | Placement tool for wafer scale caps A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient of thermal expansion which is about the same as that of the wafer. T... | 02/06/2007 |
| 7170151 | Accurate alignment of an LED assembly An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and ar... | 01/30/2007 |
| 7166911 | Packaged microchip with premolded-type package A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. ... | 01/23/2007 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal packag... | 12/05/2006 |
| 7095109 | Optical fiber terminator package An optical fiber terminator package is provided. The package comprises: (a) a semiconductor chip having a top surface and a bottom surface; (b) at least one optical device positioned on or in the top surface; and (c) a first hollow cap bonded to the top surface and ... | 08/22/2006 |
| 7081645 | SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external h... | 07/25/2006 |
| 7075188 | Circuit device and method for manufacturing the same In order to provide a circuit device 10 where a second circuit element 15B is exposed from a sealing resin 16, a circuit device 10A comprises: an island 12 to whose top a first circuit element 15A is fixedly fitted; a plural... | 07/11/2006 |
| 7067908 | Semiconductor package having improved adhesiveness and ground bonding A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation m... | 06/27/2006 |
| 7068125 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 06/27/2006 |
