Did You Know...
...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8129838 | Housed active microstructures with direct contacting to a substrate A microstructured component with microsensors or other active microcomponent is provided. The microstructured component includes a substrate and at least one housing arranged on the substrate with one or more active microstructures situated on it. ... | 03/06/2012 |
| 8120168 | Methods and materials useful for chip stacking, chip and wafer bonding Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues. ... | 02/21/2012 |
| 8053887 | Semiconductor assembly A semiconductor assembly includes a substrate with at least a CMOS region and a seal ring region and an optional micro electro mechanical system (MEMS) region, a shallow trench isolation disposed in the CMOS region of the substrate, an optional micro electro mechani... | 11/08/2011 |
| 8018052 | Integrated circuit package system with side substrate having a top layer An integrated circuit package system comprising: providing a package substrate; attaching an integrated circuit over the package substrate; and attaching a side substrate adjacent the integrated circuit over the package substrate. ... | 09/13/2011 |
| 7994636 | Flip chip interconnection structure A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a bump on an integrated circuit chip, includes a soft, deformable material with a low yield strength and high... | 08/09/2011 |
| 7825507 | Semiconductor assembly and method for forming seal ring A method for forming a seal ring is disclosed. First, a substrate including a MEMS region, a logic region and a seal ring region is provided. Second, a trench is formed in the MEMS region and multiple recesses are formed in the seal ring region. An oxide fills the t... | 11/02/2010 |
| 7791189 | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same An integrated circuit (IC) device package is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a first stiffener surface. An IC die is mount... | 09/07/2010 |
| 7768122 | Semiconductor package A semiconductor package has a substrate having a first heat transfer path for transferring heat from an optical functional element to a back surface of the substrate, a first heat dissipation unit dissipating the transferred heat therefrom, a second heat transfer pa... | 08/03/2010 |
| 7728425 | Seal of fluid port One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component, a lid sealed to the base, the lid including a fillport, and the fillport hermetically sealed by light irradiation. ... | 06/01/2010 |
| 7692292 | Packaged electronic element and method of producing electronic element package A first container member (9, 109, 212) mounting an electronic device (71, 171, 261) thereon and a second container member (2, 102, 202) are bonded with an adhesive (3, 103) or a metal layer (103, 251). Thus an inner space (90, 1... | 04/06/2010 |
| 7692293 | Semiconductor switching module A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base layer, a copper layer, and at least one power semiconductor chip that i... | 04/06/2010 |
| 7649254 | Conductive stiffener for a flexible substrate A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate ... | 01/19/2010 |
| 7576427 | Cold weld hermetic MEMS package and method of manufacture A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral d... | 08/18/2009 |
| 7576426 | Wafer level package including a device wafer integrated with a passive component According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package inc... | 08/18/2009 |
| 7566965 | Semiconductor module An image sensor module is composed of a base, a CCD image sensor, a glass plate, and a frame-shaped moisture permeable member. The base has a depressed chip chamber, in which the CCD image sensor is contained. Top and under surfaces of the moisture permeable member ... | 07/28/2009 |
| 7528482 | Embedded chip package with improved heat dissipation performance and method of making the same A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a second metal foil laminated on a second side of the dielectric interpos... | 05/05/2009 |
| 7518234 | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments Methods of bulk manufacturing high temperature sensor sub-assembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound s... | 04/14/2009 |
| 7511373 | Cap package for micro electro-mechanical system A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material havin... | 03/31/2009 |
| 7482686 | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same A die-up array integrated circuit (IC) device package and method of making the same is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a f... | 01/27/2009 |
| 7456499 | Power light emitting die package with reflecting lens and the method of making the same A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a ... | 11/25/2008 |
| 7446411 | Semiconductor structure and method of assembly A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical ... | 11/04/2008 |
| 7443024 | Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an... | 10/28/2008 |
| 7439617 | Capillary underflow integral heat spreader A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of t... | 10/21/2008 |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7429501 | Lid and method of employing a lid on an integrated circuit A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses may be a castellation comprising a collection of semi-circular cuts int... | 09/30/2008 |
| 7414310 | Waferscale package system A waferscale package system is provided forming a protection structure comprises forming a wafer, fabricating a device element on the wafer, forming a waferscale spacer around the device element, and attaching a waferscale cap to the waferscale spacer to cover the d... | 08/19/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7394153 | Encapsulation of electronic devices An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of... | 07/01/2008 |
| 7387902 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/17/2008 |
| 7388282 | Micro-electro-mechanical system (MEMS) package having hydrophobic layer A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base su... | 06/17/2008 |
| 7382046 | Semiconductor device protection cover, and semiconductor device unit including the cover A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the... | 06/03/2008 |
| 7378748 | Solid-state imaging device and method for manufacturing the same A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal spac... | 05/27/2008 |
| 7378294 | Wafer-level sealed microdevice having trench isolation and methods for making the same A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60 | 05/27/2008 |
| 7372700 | Plasma display device A plasma display device which has improved performance of heat dissipation and noise/vibration insulation is disclosed. In one embodiment, the plasma display device includes a plasma display panel, a first base member coupled with the plasma display panel, a second ... | 05/13/2008 |
| 7368816 | Micro-electro-mechanical system (MEMS) package having metal sealing member A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid t... | 05/06/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7365981 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and... | 04/29/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7348663 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/25/2008 |
