Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7986039 | Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface A wafer assembly comprises a wafer having a MEMS layer formed on a frontside and a polymer coating covering the MEMS layer. A holding means is releasably attached to the polymer coating so that the wafer assembly facilitates performance of backside operations on a b... | 07/26/2011 |
| 7663228 | Electronic component and electronic component module An electronic component includes an electronic element, a conductive first base portion, a conductive second base portion, an insulator and a terminal. An electronic element is to be mounted on the electronic element mounting portion. The electronic element mounting... | 02/16/2010 |
| 7622804 | Semiconductor device and method of manufacturing the same Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being uncovered, and is made of a dielectric material having a low dielectric... | 11/24/2009 |
| 7429790 | Semiconductor structure and method of manufacture A semiconductor structure (100) includes a substrate (110) having a first surface (111) with a mold lock feature (101). The semiconductor structure also includes a semiconductor chip (120) located over the first surface of the subs... | 09/30/2008 |
| 7368322 | Method for mounting a chip on a base and arrangement produced by this method An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnect... | 05/06/2008 |
| 7365423 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 04/29/2008 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding proc... | 04/08/2008 |
| RE39957 | Method of making semiconductor package with heat spreader A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is... | 12/25/2007 |
| 7276788 | Hydrophobic foamed insulators for high density circuits A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive s... | 10/02/2007 |
| 7273765 | Solid-state imaging device and method for producing the same A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting e... | 09/25/2007 |
| 7262491 | Die pad for semiconductor packages and methods of making and using same A semiconductor device package comprising a semiconductor device and an electrically conductive lead frame at least partially covered by a molding compound. The electrically conductive lead frame includes a plurality of leads disposed proximate a perimeter of the pa... | 08/28/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7256491 | Thermal interconnect systems methods of production and uses thereof A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder mate... | 08/14/2007 |
| 7247509 | Method for manufacturing solid-state imaging devices A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiri... | 07/24/2007 |
| 7235877 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 06/26/2007 |
| 7235431 | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conduc... | 06/26/2007 |
| 7179682 | Packaged device and method of forming same A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatt... | 02/20/2007 |
| 7173332 | Placement tool for wafer scale caps A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient of thermal expansion which is about the same as that of the wafer. T... | 02/06/2007 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal packag... | 12/05/2006 |
| 7135768 | Hermetic seal Ultrasonically formed seals, their use in semiconductor packages, and methods of fabricating semiconductor packages. A brittle center member (such as glass) has a molded edge member. That edge member is ultrasonically welded to a body. The molded edge member and bod... | 11/14/2006 |
| 7133705 | Portable power amplifier A portable power amplifier includes portable encapsulating cases, a printed board incorporated in those encapsulating cases, and a power amplifying device mounted on this printed board. An antenna switch and an antenna are provided near the power amplifying device, ... | 11/07/2006 |
| 7088010 | Chip packaging compositions, packages and systems made therewith, and methods of making same A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system include... | 08/08/2006 |
| 7078730 | Semiconductor light-emitting device and method of manufacturing the same and mounting plate To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip hav... | 07/18/2006 |
| 7067922 | Semiconductor device Disclosed is a semiconductor device including: a semiconductor substrate; at least one layer of a first insulating film formed above the semiconductor substrate and having a relative dielectric constant of 3.8 or less, an entire layer of the first insulating film be... | 06/27/2006 |
| 7067903 | Heat spreader and semiconductor device and package using the same A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat... | 06/27/2006 |
| 7053481 | High capacitance package substrate A high capacitance substrate. The substrate includes a core tolerant to sintering thereon of a high k material to provide increased capacitance. The core may be non-ceramic. The material sintered thereon may have a dielectric constant in excess of about 4. The subst... | 05/30/2006 |
| 7049695 | Method and device for heat dissipation in semiconductor modules A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader (typically Si). A plurality of openings are formed through this first laye... | 05/23/2006 |
| 7045868 | Wafer-level sealed microdevice having trench isolation and methods for making the same A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60 | 05/16/2006 |
| 7033927 | Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the therma... | 04/25/2006 |
| 6992380 | Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area A semiconductor device 39. The device includes an interposer 31 having two major surfaces. The first surface 311 includes patterned metal conductors and bond pads 351, and the second surface includes an array of solder balls 33. Th... | 01/31/2006 |
| 6967401 | Semiconductor device, semiconductor module and hard disk A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface o... | 11/22/2005 |
| 6963130 | Heatsinking and packaging of integrated circuit chips A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surfac... | 11/08/2005 |
| 6949825 | Laminates for encapsulating devices An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic... | 09/27/2005 |
| 6911721 | Semiconductor device, method for manufacturing semiconductor device and electronic equipment A semiconductor device includes a base substrate provided with a base wiring. A first substrate includes a first wiring to be electrically connected to the base wiring and is provided above the base substrate. A first semiconductor element includes a first electrode... | 06/28/2005 |
| 6858942 | Semiconductor package with improved thermal cycling performance, and method of forming same A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconduc... | 02/22/2005 |
| 6856013 | Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit The present invention includes integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit. One aspect of the present invention provides an integrated circuit package including a substrate having opposing f... | 02/15/2005 |
| 6853068 | Heatsinking and packaging of integrated circuit chips A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surfac... | 02/08/2005 |
| 6812561 | Thin high-frequency module having integrated circuit chip with little breakage A high-frequency module of the invention includes an insulating substrate including a plurality of ceramic thin plates stacked in layers, and an insulating layer formed on the top surface of the insulating substrate. In the high-frequency module, a thin-film circuit... | 11/02/2004 |
| 6809929 | Heat sink assembly with retaining device A heat sink assembly having a retaining device includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores ( | 10/26/2004 |
| 6798061 | Multiple semiconductor chip (multi-chip) module for use in power applications A multiple semiconductor chip (multi-chip) module for use in power applications includes at least a power semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The power semiconductor chip may be a Silicon-On-Insulator ... | 09/28/2004 |
