Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 7365423 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 04/29/2008 |
| 7352583 | Flexible lead for a pressfit diode bridge An improvement to a bridge rectifier assembly of the type used to convert alternating current produced by an motor vehicle alternator into direct current. The bridge rectifier assembly of this type comprises a heat sink, a plurality of pressfit diodes installed in t... | 04/01/2008 |
| 7332802 | Package for semiconductor light emitting element and semiconductor light emitting device A package for semiconductor light emitting element is described. The package includes a first metal substrate having a cup shaped recess portion, an insulating member having a first cup shaped opening, provided on the first metal substrate, and a second metal substr... | 02/19/2008 |
| 7329957 | Circuit device and manufacturing method thereof A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin fi... | 02/12/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7279023 | High thermal conductivity metal matrix composites Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded int... | 10/09/2007 |
| 7276788 | Hydrophobic foamed insulators for high density circuits A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive s... | 10/02/2007 |
| 7265977 | Active liquid metal thermal spreader The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is dis... | 09/04/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7255837 | Electronic device and thermal type flow meter on vehicle An airtight configuration for keeping down the permeation of corrosive gas from silicone adhesive, and for preventing corrosive gas from entering the case. An electronic device mounted on vehicle. The electronic device has at least one of a portion connecting... | 08/14/2007 |
| 7242028 | Light emitting diode light source A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is util... | 07/10/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7238549 | Surface-mounting semiconductor device and method of making the same A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface 113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a... | 07/03/2007 |
| 7235877 | Redistributed solder pads using etched lead frame A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the ... | 06/26/2007 |
| 7231707 | Method of manufacturing planar inductors Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and ... | 06/19/2007 |
| 7230320 | Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe... | 06/12/2007 |
| 7221048 | Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage s... | 05/22/2007 |
| 7205652 | Electronic assembly including multiple substrates An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having ... | 04/17/2007 |
| 7179742 | Interconnect circuitry, multichip module, and methods for making them Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker metallic layer can be deposited on top of the resulting layer by electrop... | 02/20/2007 |
| 7170171 | Support ring for use with a contact pad and semiconductor device components including the same Dielectric rings are configured to be disposed around contact pads on a surface of a semiconductor device or another substrate. The rings may be fabricated or otherwise disposed around the contact pads of a semiconductor device or other substrate before or after con... | 01/30/2007 |
| 7164585 | Thermal interface apparatus, systems, and methods An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the surface. A heat dissipating element may be coupled to the primary material.... | 01/16/2007 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower ... | 12/26/2006 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal packag... | 12/05/2006 |
| 7112881 | Semiconductor device A semiconductor device allowing simplification of a fabrication process is provided. This semiconductor device comprises a first insulator film, consisting of a single material, formed to be in contact with the upper surface of a semiconductor chip including a circu... | 09/26/2006 |
| 7098533 | Printed circuit board with a heat dissipation element and package comprising the printed circuit board A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip and reduces a printed circuit board height. The PCB includes a heat sin... | 08/29/2006 |
| 7087937 | Light emitting diode (LED) packaging A light emitting diode (LED) packaging comprising a stacked substrate, a main body, and an LED die is provided. The stacked substrate includes a heat spreader and a first circuit board. The first circuit board is stacked on the heat spreader. Two channels penetrate ... | 08/08/2006 |
| 7081661 | High-frequency module and method for manufacturing the same In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the s... | 07/25/2006 |
| 7071551 | Device used to produce or examine semiconductors A semiconductor-producing/examining device that can maintain a preferable connection state for a predetermined period of time and that can easily remove a ceramic substrate from a supporting case. The semiconductor producing/examining device includes a ceramic subst... | 07/04/2006 |
| 7049695 | Method and device for heat dissipation in semiconductor modules A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader (typically Si). A plurality of openings are formed through this first laye... | 05/23/2006 |
| 7049696 | IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device A connection structure including an IC chip, a substrate disposed with a conductive layer, and a heat-radiating mechanism that is mounted on the substrate, disposed between the IC chip and the substrate, and dissipates heat of the IC chip, wherein terminals of the I... | 05/23/2006 |
| 7020958 | Methods forming an integrated circuit package with a split cavity wall Methods of assembling an electronic package including forming a housing with a first bond pad on a top surface of a bond shelf, forming a conductive strip along a side surface or edge of the bond shelf, and removing a portion of the conductive strip to form a pair o... | 04/04/2006 |
| 7012192 | Feedthrough terminal assembly with lead wire bonding pad for human implant applications A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device. ... | 03/14/2006 |
| 6992382 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon A method and apparatus for cooling an electronics chip with a cooling plate having integrated micro channels and manifold/plenum made in separate single-crystal silicon or low-cost polycrystalline silicon. Forming the microchannels in the cooling plate is more econo... | 01/31/2006 |
| 6977431 | Stackable semiconductor package and manufacturing method thereof A stackable semiconductor package is disclosed that includes a semiconductor die coupled to a metal leadframe. The semiconductor die is coupled to a die pad and is electrically coupled to leads of the leadframe. The semiconductor die, the die pad, and an inner lead ... | 12/20/2005 |
| 6963130 | Heatsinking and packaging of integrated circuit chips A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surfac... | 11/08/2005 |
| 6956167 | Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame A lid-member holder is used to define envelopers encapsulating electronic components in production of hollow-package type electronic products. A plurality of lid members are temporarily held by the holder body. The lid members are arranged so as to be consistent wit... | 10/18/2005 |
| 6882040 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 04/19/2005 |
| 6879033 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 04/12/2005 |
