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| Number | Title | Issue Date |
| 8174113 | Methods of fabricating robust integrated heat spreader designs and structures formed thereby Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves th... | 05/08/2012 |
| 8164182 | Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second... | 04/24/2012 |
| 8148812 | Thermal resistor, semiconductor device using the same, and electric device A thermal resistor is a metal body having a contact surface to be partially in contact to form a void and is electrically conductive as a whole. The thermal body may be a layered body having a plurality of metal bodies layered so as to be partially in contact with o... | 04/03/2012 |
| 8125076 | Semiconductor package system with substrate heat sink A semiconductor package system is provided including: providing a substrate having substrate wiring and a cavity provided therein with a heat sink foil closing off the cavity; attaching a semiconductor die in the cavity to the heat sink foil; and bonding the semicon... | 02/28/2012 |
| 8125077 | Package with heat transfer A semiconductor package includes an encapsulant, a semiconductor device within the encapsulant, and one or more terminals for electrically coupling the semiconductor device to a node exterior to the package. The package further includes bonding means coupling the se... | 02/28/2012 |
| 8089146 | Semiconductor device and heat radiation member A semiconductor device includes a semiconductor element mounted on a substrate; at least one electronic part arranged around the semiconductor element; and a heat radiation member bonded to a backside of the semiconductor element by a bonding material. The heat radi... | 01/03/2012 |
| 8080870 | Die-warpage compensation structures for thinned-die devices, and methods of assembling same A back-side lamination (BSL) is applied after thinning a microelectronic die. The BSL is configured to be a thermal-expansion complementary structure to a metal wiring interconnect layout that is disposed on the active side of the microelectronic die. ... | 12/20/2011 |
| 8058724 | Holistic thermal management system for a semiconductor chip Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to ... | 11/15/2011 |
| 8030758 | Semiconductor module and method for fabricating semiconductor module A semiconductor module (10) includes a heat sink (1), an electronic component (2), a semiconductor device (3), and a thermally-conductive sheet member (4). The thermally-conductive sheet member (4) covers a part of the semic... | 10/04/2011 |
| 8030759 | Heat conductive plate structure A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer disposed above the coupling layer around the seating portion to defi... | 10/04/2011 |
| 8022532 | Interposer and semiconductor device An interposer and a semiconductor device including the interposer, which can prevent thermal warpage of an insulative substrate. The interposer is provided with a semiconductor chip in a semiconductor device and may be disposed between the semiconductor chip and a m... | 09/20/2011 |
| 8018051 | Thermally enhanced semiconductor package Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spr... | 09/13/2011 |
| 8013437 | Package with heat transfer A semiconductor package includes an encapsulant, a semiconductor die within the encapsulant, and a terminal for electrically coupling the semiconductor die to a node exterior to the package. The package further includes solder coupling the semiconductor die to the t... | 09/06/2011 |
| 8013438 | Semiconductor package with a stiffening member supporting a thermal heat spreader A semiconductor package includes a substrate board and a semiconductor die attached to a top surface of that substrate board. A heat spreader is provided over the semiconductor die. A stiffening ring is positioned surrounding the semiconductor die, the stiffening ri... | 09/06/2011 |
| 8004079 | Chip package structure and manufacturing method thereof A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias elect... | 08/23/2011 |
| 7999372 | Organic light emitting display device and method of fabricating the same Provided is an organic light emitting display device. An organic light emitting display device according to one embodiment of the present invention comprises a first substrate; a second substrate comprising an interior surface opposing the first substrate; an array ... | 08/16/2011 |
| 7994635 | Power semiconductor module To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. A power semiconductor module includes a module casing fitted with a radiator, and a common unit retained by the module casing. The common unit has: a ceramic subst... | 08/09/2011 |
| 7968999 | Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive A method of grounding a heat spreader/stiffener to a flip chip package comprising the steps of attaching an adhesive film to a substrate and attaching a stiffener to the adhesive film. The adhesive film may have a number of first holes corresponding with a number of... | 06/28/2011 |
| 7956456 | Thermal interface material design for enhanced thermal performance and improved package structural integrity An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat condu... | 06/07/2011 |
| 7948076 | Semiconductor chip assembly with post/base heat spreader and vertical signal routing A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a bas... | 05/24/2011 |
| 7923834 | Interposer and semiconductor device An interposer and a semiconductor device including the interposer, which can prevent thermal warpage of an insulative substrate. The interposer is provided with a semiconductor chip in a semiconductor device and may be disposed between the semiconductor chip and a m... | 04/12/2011 |
| 7906845 | Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor A semiconductor device has a substrate having a top and bottom surface and a plurality of metal layers. A first die is electrically coupled to the top surface of the substrate. A lid member is attached to a top surface of the die and to the top surface of the substr... | 03/15/2011 |
| 7906844 | Multiple integrated circuit die package with thermal performance A multi-die package comprises a heat spreader disposed on a printed circuit substrate, at least one integrated circuit die disposed on a top side of the heat spreader and at least one other integrated circuit die disposed on a bottom side of the heat spreader wherei... | 03/15/2011 |
| 7898077 | Adjustable threaded cores for LED thermal management Adjustable threaded cores for LED thermal management. The cores provide a direct thermal path between a LED and a heat sink while minimizing gaps and stresses between materials. The system includes a heat generating object, a first substrate housing containing a thr... | 03/01/2011 |
| 7875971 | Semiconductor device having improved heat sink The semiconductor device includes a substrate, a first semiconductor element, a second semiconductor element, a first heat sink and a second heat sink. The first and the second semiconductor elements are provided on the substrate. The maximum power consumption of th... | 01/25/2011 |
| 7859101 | Die-up ball grid array package with die-attached heat spreader An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second s... | 12/28/2010 |
| 7816784 | Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same Disclosed are PQFN semiconductor die packages for high-voltage, high-power applications, systems using the packages, and methods of making the packages. An exemplary package comprises a leadframe, a semiconductor die disposed on the leadframe, and a heat sink member... | 10/19/2010 |
| 7816785 | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a compos... | 10/19/2010 |
| 7808099 | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method A liquid thermal interface (LTI) including a mixture of a linearly structured polymer doped with crosslinked networks and related method are presented. The LTI exhibits reduced liquid polymer macromolecule mobility, and thus increased surface tension. An embodiment ... | 10/05/2010 |
| 7781882 | Low voltage drop and high thermal performance ball grid array package An integrated circuit (IC) package is provided. The IC package includes a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through the substrate to a plurality of solder ball pads on a second surface of the ... | 08/24/2010 |
| 7768121 | Apparatus and methods for cooling semiconductor integrated circuit package structures Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power densit... | 08/03/2010 |
| 7737549 | Circuit module with thermal casing systems Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both... | 06/15/2010 |
| 7732916 | Semiconductor package A semiconductor package is provided with a package main body including a base portion configured by joining thin plates integrally, and a semiconductor device accommodating portion provided on one surface of the base portion, electric terminals electrically connecte... | 06/08/2010 |
| 7723842 | Integrated circuit device To solve the problems caused by accumulation of heat generated from an integrated circuit. The integrated circuit device of the invention includes a substrate over one surface of which an integrated circuit is formed. The other surface of the substrate (a surface ov... | 05/25/2010 |
| 7723843 | Multi-package module and electronic device using the same A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrat... | 05/25/2010 |
| 7719110 | Flip chip package including a non-planar heat spreader and method of making the same A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more wa... | 05/18/2010 |
| 7692291 | Circuit board having a heating means and a hermetically sealed multi-chip package A circuit board having heating elements and a hermetically sealed multi-chip package. The multi-chip package includes a plurality of semiconductor chips, a substrate electrically coupled to the plurality of semiconductor chips, heat dissipation means, and a pluralit... | 04/06/2010 |
| 7671466 | Semiconductor package having heat dissipating device with cooling fluid A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening a... | 03/02/2010 |
| 7656024 | Chip module for complete power train A chip module is disclosed. It includes a circuit substrate, a semiconductor die comprising a power transistor mounted on the circuit substrate, and a passive electronic component. The passive electronic component is in electrical communication with the semiconducto... | 02/02/2010 |
| 7652371 | Semiconductor package A semiconductor package is provided with a package main body including a base portion configured by joining thin plates integrally, and a semiconductor device accommodating portion provided on one surface of the base portion, electric terminals electrically connecte... | 01/26/2010 |
