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| Number | Title | Issue Date |
| 8138597 | Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inwar... | 03/20/2012 |
| 8134231 | Semiconductor chip and semiconductor device A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least on... | 03/13/2012 |
| 8125075 | Carbon nanotube micro-chimney and thermo siphon die-level cooling A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die. ... | 02/28/2012 |
| 8115301 | Methods for manufacturing thermally enhanced flip-chip ball grid arrays Methods for fabricating flip-chips are disclosed. In an exemplary method, a flip-chip is mounted, active-surface downward, onto a substrate such that a back-side of the flip-chip is facing upward and electrical connections are made between the chip and an upward-fac... | 02/14/2012 |
| 8093713 | Module with silicon-based layer The invention concerns a module comprising a carrier element, a semiconductor device mounted on said carrier element and a silicon-based insulating layer. The silicon-based insulating layer is arranged on the side of the carrier element opposite to the semiconductor... | 01/10/2012 |
| 8084856 | Thermal spacer for stacked die package thermal management In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated... | 12/27/2011 |
| 8076772 | Printed circuit board, memory module having the same and fabrication method thereof A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal l... | 12/13/2011 |
| 8049328 | Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support A semiconductor device has a first interconnect structure formed over a first side of a substrate. A semiconductor die is mounted to the first interconnect structure. An encapsulant is deposited over the semiconductor die and first interconnect structure for structu... | 11/01/2011 |
| 8039951 | Thermally enhanced semiconductor package and method of producing the same This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufact... | 10/18/2011 |
| 8030757 | Forming a semiconductor package including a thermal interface material In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed... | 10/04/2011 |
| 8030756 | Plastic ball grid array package with integral heatsink A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to the substrate or in which any supporting arm that is affixed to the su... | 10/04/2011 |
| 8030755 | Integrated circuit package system with a heat sink An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure. ... | 10/04/2011 |
| 8022531 | Integrated circuit package system using heat slug An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug,... | 09/20/2011 |
| 8013436 | Heat dissipation package structure and method for fabricating the same A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipatio... | 09/06/2011 |
| RE42653 | Semiconductor package with heat dissipating structure A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a su... | 08/30/2011 |
| 7999371 | Heat spreader package and method A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an inactive surface mounted to the first surface of the substrate. The electronic component further includes a... | 08/16/2011 |
| 7989947 | Semiconductor device and method of manufacturing the same A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the semiconductor element 1 and at least a part of... | 08/02/2011 |
| 7956455 | RF power transistor package An RF power transistor package with a rectangular ceramic base can house one or more dies affixed to an upper surface of the ceramic base. Source leads attached to the ceramic base extend from at least opposite sides of the rectangular base beneath a periphery of a ... | 06/07/2011 |
| 7944044 | Semiconductor package structure having enhanced thermal dissipation characteristics In one embodiment, a packaged semiconductor device having enhanced thermal dissipation characteristics includes a lead frame structure and a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that t... | 05/17/2011 |
| 7928559 | Semiconductor device, electronic component module, and method for manufacturing semiconductor device A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element is bonded to a heat sink with the conductive material disposed thereb... | 04/19/2011 |
| 7919853 | Semiconductor package and fabrication method thereof A semiconductor package and method of manufacture has a substrate having an aperture. A semiconductor die is positioned in the aperture of the substrate and attached to a heat spreader by a first adhesive and electrically coupled to the substrate by at least one con... | 04/05/2011 |
| 7919852 | Semiconductor device and insulating substrate utilizing a second conductor with a non-joint area A semiconductor device including: an insulating substrate including a ceramic substrate having first and second principal surfaces, a first metallic conductor fixed on the first principal surface, and a second metallic conductor fixed on the second principal surface... | 04/05/2011 |
| 7915728 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled theret... | 03/29/2011 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melti... | 03/01/2011 |
| 7888792 | Method for direct heat sink attachment A system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink's mechanical motion while simultaneously allowing for thermal expansion of the heat sink. ... | 02/15/2011 |
| 7880298 | Semiconductor device thermal connection A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins... | 02/01/2011 |
| 7875970 | Integrated circuit package having a castellated heatspreader In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a po... | 01/25/2011 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and e... | 01/04/2011 |
| 7863731 | Heat-dissipating structure and heat-dissipating semiconductor package having the same A heat-dissipating structure and a heat-dissipating semiconductor package having the same are disclosed in the present invention. The heat-dissipating semiconductor package includes a chip carrier, a flip chip semiconductor chip attached and electrically connected t... | 01/04/2011 |
| 7863732 | Ball grid array package system A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting a substrate around the integrated circuit die, and coupling an electr... | 01/04/2011 |
| 7851904 | Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure A semiconductor device of the present invention includes: a wiring board 4 in which a conductive wiring 6 is formed on an insulating substrate 5 having an opening 5a; a semiconductor element 2 that has a circuit forming regi... | 12/14/2010 |
| 7847394 | Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed thereon. Then, a porous layer is formed on the metal layer. A barrier la... | 12/07/2010 |
| 7838985 | Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inwar... | 11/23/2010 |
| 7834444 | Heatplates for heatsink attachment for semiconductor chips An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive... | 11/16/2010 |
| 7834445 | Heat sink with thermally compliant beams A heat dissipating structure includes: a heat spreader; and a plurality of compliant beams attached to the heat spreader. The beams are formed of a high-conductive material such that a maximum stress of each beam is less than a fatigue stress of the high-conductive ... | 11/16/2010 |
| 7830000 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending the... | 11/09/2010 |
| 7821123 | LED array cooling system A LED array cooling system including a LED array and a substrate attached to the LED array wherein the LED array includes a plurality of walls that at least in part define a plurality of passages through the LED array. ... | 10/26/2010 |
| 7821124 | Thin, thermally enhanced flip chip in a leaded molded package Semiconductor die packages and methods of making them are disclosed. An exemplary package comprises a leadframe having a source lead and a gate lead, and a semiconductor die coupled to the source and gate leads at a first surface of the leadframe. The source lead ha... | 10/26/2010 |
| 7817409 | Electronic apparatus An electronic apparatus includes: a case having a first cover and a second cover, which form an internal space of the case in combination; a circuit substrate loaded with an electronic circuit and disposed in the internal space of the case; and a board member extend... | 10/19/2010 |
| 7812443 | Power semiconductor module for inverter circuit system A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insula... | 10/12/2010 |
