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An aircraft having vertical takeoff and landing capability provided with at least first and second laterally extending paddle wheels rotatable on a central axis perpendicular to the longitudinal axis of the aircraft fuselage and between its nose and tail.
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| Number | Title | Issue Date |
| 8030754 | Chip cooling channels formed in wafer bonding gap One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The g... | 10/04/2011 |
| 7923833 | Semiconductor module A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear... | 04/12/2011 |
| 7659614 | High temperature, stable SiC device interconnects and packages having low thermal resistance A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixt... | 02/09/2010 |
| 7432591 | Thermal enhanced plastic ball grid array with heat sink attachment option A thermal enhanced structure comprising a packaged electronic device and a heat sink that is removably attached thereto. The thermal enhanced structure includes a plastic ball grid array (PGBA) with an electronic chip, a plastic mold cover, and a heat spreader with ... | 10/07/2008 |
| 7429789 | Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such di... | 09/30/2008 |
| 7375412 | iTFC with optimized C(T) A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic m... | 05/20/2008 |
| 7372700 | Plasma display device A plasma display device which has improved performance of heat dissipation and noise/vibration insulation is disclosed. In one embodiment, the plasma display device includes a plasma display panel, a first base member coupled with the plasma display panel, a second ... | 05/13/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7342215 | Digital camera module package fabrication method A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322... | 03/11/2008 |
| 7339204 | Backside contact for touchchip A contact is formed within an active region of a substrate at the edge of a die, preferably within the first metallization level in the active region of the substrate. An opening having sloped sidewalls is then etched into the back side of the substrate, exposing a ... | 03/04/2008 |
| 7321098 | Laminate ceramic circuit board and process therefor A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second c... | 01/22/2008 |
| 7315083 | Circuit device and manufacturing method thereof A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing m... | 01/01/2008 |
| 7315455 | Surface-mounted electronic component module and method for manufacturing the same More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns f... | 01/01/2008 |
| 7297988 | Flip chip type nitride semiconductor light emitting device The present invention relates to a flip chip type nitride semiconductor light emitting device having p-type and n-type nitride semiconductor layers, and an active layer in between. The invention also has an ohmic contact layer formed on the p-type nitride semiconduc... | 11/20/2007 |
| 7294925 | Optical scanner package having heating dam An optical scanner package having a heating dam is provided. The optical scanner package having a heating dam includes: an optical scanner on which a mirror surface is formed; a ceramic package in which the optical scanner is installed at the bottom of a cavity ther... | 11/13/2007 |
| 7276803 | Semiconductor component and method for fabricating Semiconductor components having a semiconductor body which includes a semiconductor base surface have to be sealed with a molding compound in order to protect against moisture or heat. Mechanical interlocking of the molding compound to the semiconductor base surface... | 10/02/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7250323 | Methods of making energy conversion devices with a substantially contiguous depletion regions A method of making an energy conversion device includes forming a plurality of pores within a substrate and forming a junction region within each of the plurality of pores. Each of the junction regions has a depletion region and each of the plurality of pores define... | 07/31/2007 |
| 7230320 | Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe... | 06/12/2007 |
| 7229855 | Process for assembling a double-sided circuit component A process for producing a circuit component having a double-sided circuit device between a pair of substrates. The process entails depositing a solder material on contact areas on surfaces of the substrates, placing a first of the substrates within a cavity in a rec... | 06/12/2007 |
| 7224047 | Semiconductor device package with reduced leakage A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at... | 05/29/2007 |
| 7224057 | Thermal enhance package with universal heat spreader A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat sprea... | 05/29/2007 |
| 7221048 | Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage s... | 05/22/2007 |
| 7215010 | Device for packing electronic components using injection molding technology A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3... | 05/08/2007 |
| 7211891 | Electronic heat pump device, laser component, optical pickup and electronic equipment There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically a... | 05/01/2007 |
| 7208829 | Semiconductor component A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control ... | 04/24/2007 |
| 7205650 | Composite devices of laminate type and processes In a composite device of the laminate type having a laminate structure of a composite ceramic layer and a dielectric ceramic layer, the composite ceramic layer including a layer portion having the same composition as the dielectric ceramic layer and a plurality of p... | 04/17/2007 |
| 7197221 | Optical waveguide film, and light transmission and reception module An optical waveguide film that can supply power at extremely low cost, and a light transmission and reception module using this film are provided. A macromolecular optical waveguide film is composed of a square-shaped waveguide core which extends in a film le... | 03/27/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
| 7173328 | Integrated circuit package and method having wire-bonded intra-die electrical connections A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The bond pads commonly being formed above active circuit components. The ... | 02/06/2007 |
| 7166914 | Semiconductor package with heat sink A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the c... | 01/23/2007 |
| 7164199 | Device packages with low stress assembly process A microelectromechanical device package and a low-stress inducing method for packaging a microelectromechanical device are disclosed in this invention. The microelectromechanical device is accommodated within a cavity comprised by a first package substrate and a sec... | 01/16/2007 |
| 7144757 | Circuit suitable for vertical integration and method of producing same This invention relates to a vertically integratable circuit and a method for producing same. Unlike known methods for producing vertical electric connections, the present method uses process steps in the production of the vertically integratable circuit itsel... | 12/05/2006 |
| 7135768 | Hermetic seal Ultrasonically formed seals, their use in semiconductor packages, and methods of fabricating semiconductor packages. A brittle center member (such as glass) has a molded edge member. That edge member is ultrasonically welded to a body. The molded edge member and bod... | 11/14/2006 |
| 7135747 | Semiconductor devices having thermal spacers A high power, high frequency semiconductor device has a plurality of unit cells connected in parallel. The unit cells each having a controlling electrode and first and second controlled electrodes. A thermal spacer divides at least one of the unit cells into a first... | 11/14/2006 |
| 7119447 | Direct fet device for high frequency application A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second majo... | 10/10/2006 |
| 7105920 | Substrate design to improve chip package reliability A substrate design to improve chip package reliability is provided. The chip package includes a substrate having a ceramic layer formed in a recess. A die is attached to the substrate on the ceramic layer. The substrate may be attached to a printed circuit board. Th... | 09/12/2006 |
| 7098079 | Electronic assembly with high capacity thermal interface and methods of manufacture To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through ... | 08/29/2006 |
| 7067439 | ALD metal oxide deposition process using direct oxidation Methods of forming metal compounds such as metal oxides or metal nitrides by sequentially introducing and then reacting metal organic compounds with ozone or with oxygen radicals or nitrogen radicals formed in a remote plasma chamber. The metal compounds have surpri... | 06/27/2006 |
| 7067903 | Heat spreader and semiconductor device and package using the same A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat... | 06/27/2006 |
