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| Number | Title | Issue Date |
| 8174112 | Integrated circuit device with low capacitance and high thermal conductivity interface An integrated circuit device includes an integrated circuit formed in a semiconductor die and an integrated circuit package containing the semiconductor die. The integrated circuit package includes a thermal interface material substantially between the semiconductor... | 05/08/2012 |
| 8164181 | Semiconductor device packaging structure A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the sem... | 04/24/2012 |
| 8164179 | Chip scale package structure with can attachment A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the ... | 04/24/2012 |
| 8164180 | Functional element package and fabrication method therefor A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in... | 04/24/2012 |
| 8154115 | Package structure having MEMS element and fabrication method thereof A package structure having an MEMS element includes: a chip having at least an MEMS element and a plurality of first conductive pads; a lid disposed on the chip to cover the MEMS element and having a plurality of second conductive pads formed thereon; a plurality of... | 04/10/2012 |
| 8148811 | Semiconductor device and manufacturing method thereof This invention is directed to offer a semiconductor device in which a cavity space is easily provided in a specific region when a supporting member is bonded to a semiconductor substrate through an adhesive layer, and its manufacturing method. A resist layer is appl... | 04/03/2012 |
| 8080869 | Wafer level package structure and production method therefor A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, ... | 12/20/2011 |
| 8076771 | Semiconductor device having metal cap divided by slit In order to reduce a thermal stress applied by a metal cap to a semiconductor chip: a semiconductor chip (2) is bonded to a flat portion (11) of a metal cap (1); side wall portions of the metal cap (1) serve as external connection termina... | 12/13/2011 |
| 8067833 | Low noise high thermal conductivity mixed signal package An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semi... | 11/29/2011 |
| 8063482 | Heat spreader as mechanical reinforcement for ultra-thin die A technique to fabricate a package. A thin wafer supported by a wafer support substrate (WSS) is formed. The WSS-supported thin wafer layer is diced into a plurality of WSS-supported thin dice. A WSS-supported thin die is bonded to a first heat spreader (HS) to form... | 11/22/2011 |
| 8039950 | Solder material lining a cover wafer attached to wafer substrate The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular... | 10/18/2011 |
| 8035221 | Clip mount for integrated circuit leadframes A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using a copper clip that include a structural portion that is received within a recess-like “tub” that is formed in the leadframe contact which tub is shap... | 10/11/2011 |
| 8026594 | Sensor device and production method therefor A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable rel... | 09/27/2011 |
| 8026595 | Semiconductor device having hermitically sealed active area and electrodes A semiconductor device and a fabrication method of the semiconductor device, the semiconductor device including: a gate electrode, a source electrode, and a drain electrode which are placed on a first surface of a substrate, and have a plurality of fingers; a gate t... | 09/27/2011 |
| 8018049 | Silicon condenser microphone and manufacturing method A silicon condenser microphone package and method for manufacture are disclosed. The silicon condenser microphone package includes a silicon condenser microphone die, a substrate comprising a conductive layer, and a cover having a conductive layer, where the conduct... | 09/13/2011 |
| 8018050 | Integrated circuit package with integrated heat sink An IC package and methods for making the same are described. The IC package includes a die and a heat sink that is attached to the back surface of the die with a thermal interface material layer. The heat sink includes a base and a partition. The partition extends a... | 09/13/2011 |
| 8013435 | Semiconductor module A semiconductor module includes a base plate, at least one semiconductor chip mounted on the base plate, a case fixed to the base plate and surrounding the at least one semiconductor chip, an electrically insulating gel layer covering the at least one semiconductor ... | 09/06/2011 |
| 7986038 | Electronic device and lid The present invention can prevent a lid from tilting when the lid is attached to a substrate. An electronic device 200 includes: a substrate 202; an electronic component mounted on the substrate 202; and a lid 100 including a cover portio... | 07/26/2011 |
| 7960826 | Dielectric layer structure A dielectric layer structure includes an interlayer dielectric (ILD) layer covering at least a metal interconnect structure and a single tensile hydrophobic film. The ILD layer further includes a low-k dielectric layer, and the single tensile hydrophobic film is pos... | 06/14/2011 |
| 7952189 | Hermetic packaging and method of manufacture and use therefore An embodiment of the present invention provides a method of manufacturing hermetic packaging for devices on a substrate wafer, comprising forming a plurality of adhesive rings on a cap wafer or the substrate wafer, bonding the cap wafer to the substrate wafer with a... | 05/31/2011 |
| 7936062 | Wafer level chip packaging Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of expos... | 05/03/2011 |
| 7884467 | Package structure of a microphone A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is... | 02/08/2011 |
| 7851903 | Infrared detector with plurality of metallization between first and second container members An infrared detector comprises: first and second container members bonded to each other along an annular bonding portion to define a vacuum-sealed inner space, where the second container member has an infrared-transmissive property; an infrared detecting element dis... | 12/14/2010 |
| 7834443 | Semiconductor device with molten metal preventing member A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate h... | 11/16/2010 |
| 7834442 | Electronic package method and structure with cure-melt hierarchy Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a predetermined (i.e., repeatable) minimum thickness and is further register... | 11/16/2010 |
| 7795723 | Capped sensor A sensor element is capped by bonding or otherwise forming a cap on a sensor element. The sensor may be hermetically sealed by using a hermetic cap and hermetic bonding material or by applying a hermetic coating. The sensor may be filled with a gas at an elevated pr... | 09/14/2010 |
| 7763972 | Stacked package structure for reducing package volume of an acoustic micro-sensor A stacked package structure utilizes flip-chip technology to stack an acoustic micro-sensor on an integrated circuit (IC) device having a recess as a back chamber and cover the acoustic micro-sensor using a glass substrate or a planar substrate with an aperture. Wit... | 07/27/2010 |
| 7750462 | Microelectromechanical systems using thermocompression bonding Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS ... | 07/06/2010 |
| 7745925 | Multi-functional metal shield case and method for making the same A multi-functional metal shield case and a method for making the same are provided. The multi-functional metal shield case includes a metal main body and an electrically non-conductive and heat conductive silicon layer. The metal main body includes a base and sidewa... | 06/29/2010 |
| 7732915 | Semiconductor sensor device with sensor chip and method for producing the same A semiconductor sensor device includes a sensor chip. The sensor chip includes a sensor region and contact areas on its upper side and is further arranged in a cavity housing. The cavity housing includes side walls, a housing bottom, a cavity, external contacts on t... | 06/08/2010 |
| 7709949 | Densely packed metal segments patterned in a semiconductor die A method of patterning a metal layer in a semiconductor die comprises forming a mask on the metal layer to define an open region and a dense region. The method further comprises etching the metal layer at a first etch rate to form a number of metal segments in the o... | 05/04/2010 |
| 7709950 | Silicon wafer having through-wafer vias A method of manufacturing a semiconductor device includes providing a semiconductor substrate having first and second main surfaces opposite to each other. A trench is formed in the semiconductor substrate at the first main surface. The trench extends to a first dep... | 05/04/2010 |
| 7701053 | Electronic component and method for producing the same An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin ... | 04/20/2010 |
| 7692288 | MEMS packaging method for enhanced EMI immunity using flexible substrates A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure i... | 04/06/2010 |
| 7679181 | Semiconductor device A semiconductor device includes: a package case in which a semiconductor element is mounted, the package case having a bonding portion; a cap having a bonding portion bonded to the bonding portion of the package case so as to hermetically seal the semiconductor elem... | 03/16/2010 |
| 7675162 | Interconnect structure using through wafer vias and method of fabrication A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstruc... | 03/09/2010 |
| 7675163 | Carbon nanotubes for active direct and indirect cooling of electronics device A system for cooling a semiconductor device is disclosed. The system includes a lid encasing the semiconductor device, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. Furthermore, a second... | 03/09/2010 |
| 7656023 | Electronic parts packaging structure and method of manufacturing the same In an electronic parts packaging structure of the present invention, an electronic parts is mounted or formed on a silicon circuit substrate having a structure in which wiring layers on both sides thereof are connected to each other through a through electrode, and ... | 02/02/2010 |
| 7652369 | Integrated circuit package and apparatus and method of producing an integrated circuit package An integrated circuit package is disclosed. The integrated circuit package comprises an integrated circuit die having a plurality of solder bumps; and a substrate comprising a first plurality of contact pads on a first surface and a second plurality of contact pads ... | 01/26/2010 |
| 7646092 | Semiconductor device and manufacturing method thereof A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the sub... | 01/12/2010 |
