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| Number | Title | Issue Date |
| 8164176 | Semiconductor module arrangement A semiconductor arrangement has a silicon body with a first surface and a second surface and a thick metal layer arranged on at least one surface of the silicon body. The thickness of the thick metal-layer is at least 10 micrometers (μm). ... | 04/24/2012 |
| 8164177 | Electronic component module and method for production thereof An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for b... | 04/24/2012 |
| 8164178 | Chip-type semiconductor ceramic electronic component A chip-type semiconductor ceramic electronic component including a ceramic body made of a semiconductor ceramic, first external electrodes formed on opposite end surfaces of the ceramic body, and second external electrodes extending to cover surfaces of the first ex... | 04/24/2012 |
| 7948075 | Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same A silicon nitride substrate having appropriately adjusted warpage and surface roughness can be obtained by mixing magnesium oxide of 3 to 4 wt % and at least one kind of rare-earth element oxide of 2 to 5 wt % with silicon nitride source material powder to form a sh... | 05/24/2011 |
| 7859100 | Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the same Provided are a thermal barrier coating material and a member coated with thermal barrier that can suppress the separation when used at a high temperature, and have a high thermal barrier effect; a method for manufacturing the member coated with thermal barrier; a tu... | 12/28/2010 |
| 7781881 | Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the same Provided are a thermal barrier coating material and a member coated with thermal barrier that can suppress the separation when used at a high temperature, and have a high thermal barrier effect; a method for manufacturing the member coated with thermal barrier; a tu... | 08/24/2010 |
| 7705446 | Package structure having semiconductor chip embedded therein and method for fabricating the same A package structure having a semiconductor chip embedded therein and a method of fabricating the same are disclosed. The package structure comprises: an aluminum oxide composite plate and a semiconductor chip. The aluminum oxide composite plate is formed by a stack ... | 04/27/2010 |
| 7598610 | Plate structure having chip embedded therein and the manufacturing method of the same A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity, wherein the chip has an active surface; at least one electrode pad moun... | 10/06/2009 |
| 7586188 | Chip package and coreless package substrate thereof A chip package includes a coreless package substrate and a chip. The coreless package substrate includes an interconnection structure and a ceramic stiffener. The interconnection structure has a first inner circuit, a carrying surface and a corresponding contact sur... | 09/08/2009 |
| 7514782 | Semiconductor device An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is al... | 04/07/2009 |
| 7482685 | Ceramic circuit board, method for making the same, and power module In a ceramic circuit board 1 prepared by integrally joining a circuit layer 4 composed of a clad member including a circuit plate 2 made of an Al plate and an Al—Si brazing material layer 3 to a ceramic substrate 6, a surface of ... | 01/27/2009 |
| 7446406 | Circuit device and manufacturing method thereof A circuit device includes a ceramic substrate, an Al wiring layer provided on the ceramic substrate, and a semiconductor device and a bus bar which are electrically connected to the wiring layer. On part of the wiring layer, a Ni layer is plated. Thus a coated regio... | 11/04/2008 |
| 7414823 | Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heighten... | 08/19/2008 |
| 7405474 | Low cost thermally enhanced semiconductor package In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a multi-layer packaging substrate. Thermal vias may be formed through the sub... | 07/29/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7388293 | Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On bot... | 06/17/2008 |
| 7387827 | Interconnection designs and materials having improved strength and fatigue life Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a large... | 06/17/2008 |
| 7382042 | COF flexible printed wiring board and method of producing the wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding carried out after mounting of semiconductor chips, whereby reliabilit... | 06/03/2008 |
| 7375412 | iTFC with optimized C(T) A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic m... | 05/20/2008 |
| 7372001 | Ceramics heater A ceramics heater comprises a circular heater plate formed of aluminum nitride and a metal foil heater wire formed of a high-melting metal and having a thickness of 100 μm to 175 μm. The heater wire is embedded in the heater plate. The heater wire has an inside po... | 05/13/2008 |
| 7368819 | Multilayer printed wiring board and multilayer printed circuit board In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands formed on the outermost layer of the resin layers and on which the solde... | 05/06/2008 |
| 7364692 | Metal matrix composite material with high thermal conductivity and low coefficient of thermal expansion Metal-matrix composites with combinations of physical and mechanical properties desirable for specific applications can be obtained by varying and controlling selected parameters in the material formation processes, particularly by increasing the microstructural hom... | 04/29/2008 |
| 7361985 | Thermally enhanced molded package for semiconductors An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit. ... | 04/22/2008 |
| 7352061 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 04/01/2008 |
| 7342303 | Semiconductor device having RF shielding and method therefor A semiconductor device and method of manufacturing has a substrate having a plurality of metal layers. At least one metal layer is exposed on at least one side surface of the semiconductor device. A die is coupled to the substrate. A mold compound encapsulates the d... | 03/11/2008 |
| 7329942 | Array-type modularized light-emitting diode structure and a method for packaging the structure An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat con... | 02/12/2008 |
| 7327032 | Semiconductor package accomplishing fan-out structure through wire bonding Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can ... | 02/05/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7320738 | Method for encapsulation of a chip card and module obtained thus Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided t... | 01/22/2008 |
| 7309918 | Chip package structure This invention relates to a chip package structure comprising of a chip, multiple leads with inner and outer ends, an exposed chip upper surface, an encapsulated body encloses the peripherals of the chip, and multiple conducting wires used to connect electrically th... | 12/18/2007 |
| 7304378 | Aluminum/ceramic bonding substrate There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600... | 12/04/2007 |
| 7291547 | Filter device and method for fabricating filter devices A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate elimina... | 11/06/2007 |
| 7291904 | Downsized package for electric wave device A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrical... | 11/06/2007 |
| 7291914 | Power semiconductor module A power semiconductor module has a substrate (1) on which several pressure elements (16, 17, 18, 19) perform a mechanical pressure (F) at different areas (10, 11, 12, 13) thereof in a direction of a cooling element in order to press the undersid... | 11/06/2007 |
| 7276292 | Insulating substrate boards for semiconductor and power modules An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the V... | 10/02/2007 |
| 7274099 | Method of embedding semiconductor chip in support plate A method of embedding a semiconductor chip in a support plate and an embedded structure thereof are proposed. A first dielectric layer having a reinforced filling material is provided, and a semiconductor chip is mounted on the first dielectric layer. A support plat... | 09/25/2007 |
| 7274569 | Power conversion device A power conversion device is downsized by integrally constructing a power conversion module and a control circuit board. The power conversion device includes a power conversion module 11, a control circuit board 21, and a heat sink 12. A case is... | 09/25/2007 |
| 7271525 | Piezoelectric device mounted on integrated circuit chip An electronics filter circuit includes an electromechanical resonator that is mounted directly to the surface of a silicon integrated circuit, rather than being a surface mounted or leaded filter can on a circuit board. This filter circuit allows the integrated circ... | 09/18/2007 |
| 7256431 | Insulating substrate and semiconductor device having a thermally sprayed circuit pattern An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the i... | 08/14/2007 |
| 7253504 | Integrated circuit package and method An integrated circuit package includes a substrate having a central axis dividing the substrate into an upper half and a lower half and an integrated circuit coupled to the substrate. A layer is provided within the substrate in the lower half thereof that is configu... | 08/07/2007 |
