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| Number | Title | Issue Date |
| 8035220 | Semiconductor packaging device Embodiments of the invention relate to a semiconductor module and to a method for manufacturing a semiconductor module. In an embodiment of the invention, a semiconductor module for mounting to a board may include at least an integrated circuit having connections on... | 10/11/2011 |
| 8018048 | Semiconductor device The semiconductor device includes a plurality of semiconductor chips, and a circuit substrate having a substantially rectangular outer shape. The semiconductor device is an MCM having an MCM packaging structure in which the plurality of semiconductor chips are juxta... | 09/13/2011 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation s... | 03/29/2011 |
| 7838984 | Adhesive tape, connected structure and semiconductor package An adhesive tape 101 electrically connecting conductive components includes a resin layer 132 containing a thermosetting resin, a solder powder 103 and a curing agent. The solder powder 103 and the curing agent reside in the resin layer | 11/23/2010 |
| 7834441 | Multilayer substrate and method of manufacturing the same A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least ... | 11/16/2010 |
| 7816783 | Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same On a surface of a resin base material (11), a first resin coating film (19) having a larger thickness and a larger area than a second resin coating film (20) formed on the other surface of the resin base material (11) is continuously form... | 10/19/2010 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exp... | 10/19/2010 |
| 7808098 | Semiconductor device and manufacturing method thereof The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a manufacturing method of a highly-reliable semiconductor device, which is not destroyed by external local pressure, ... | 10/05/2010 |
| 7772690 | Insulating film An insulating film for semiconductor devices is obtained by curing, on a substrate, a high molecular compound obtained by polymerizing a cage-type silsesquioxane compound having two or more unsaturated groups as substituents and having a cyclic siloxane structure, w... | 08/10/2010 |
| 7759788 | Semiconductor device A highly reliable semiconductor device which is not damaged by local pressing force from the outside and in which unevenness of a portion where an antenna and an element overlap with each other is reduced. The semiconductor device includes a chip and an antenna. The... | 07/20/2010 |
| 7719107 | Semiconductor device and electronic apparatus equipped with the semiconductor device A semiconductor device comprises an IC chip body and a package substrate that has thereon many external electrodes arranged in a two-dimensional grid configuration. Groups of signal lines that are likely to emit noise (noisy signal lines) are separated and spaced ap... | 05/18/2010 |
| 7615860 | Rigid-flex printed circuit board with weakening structure A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side... | 11/10/2009 |
| 7514781 | Circuit substrate and manufacturing method thereof A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric members. The plurality of dielectric members includes a mount dielectri... | 04/07/2009 |
| 7495332 | Multilayer printed wiring board A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up... | 02/24/2009 |
| 7466022 | Wafer-level seal for non-silicon-based devices One embodiment disclosed relates to a method for sealing an active area of a non-silicon-based device on a wafer. The method includes providing a sacrificial material over at least the active area of the non-silicon-based device, depositing a seal coating over the w... | 12/16/2008 |
| 7459782 | Stiffener for flip chip BGA package Provided are semiconductor die flip chip packages with warpage control and fabrication methods for such packages. A package includes a heat spreader that is attached to a die and a stiffener, which are in turn attached to a package substrate. In general, the stiffen... | 12/02/2008 |
| 7429789 | Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such di... | 09/30/2008 |
| 7408244 | Semiconductor package and stack arrangement thereof A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor pac... | 08/05/2008 |
| 7405475 | Method and system of tape automated bonding A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of t... | 07/29/2008 |
| 7405474 | Low cost thermally enhanced semiconductor package In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a multi-layer packaging substrate. Thermal vias may be formed through the sub... | 07/29/2008 |
| 7402457 | Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is e... | 07/22/2008 |
| 7402905 | Methods of fabrication of wafer-level vacuum packaged devices An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to th... | 07/22/2008 |
| 7387945 | Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same A semiconductor chip is provided that is highly packageable and particularly well suited for mounting on a circuit board having a curved surface. The semiconductor chip comprises a warpage control film that controls the warpage of a substrate. ... | 06/17/2008 |
| 7388293 | Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On bot... | 06/17/2008 |
| 7385288 | Electronic packaging using conductive interproser connector Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together... | 06/10/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361608 | Method and system for forming a feature in a high-k layer A method for plasma processing a high-k layer includes providing a substrate having a high-k layer formed thereon, on a substrate holder in a process chamber, and creating a plasma in the process chamber to thereby expose the high-k layer to the plasma. RF power is ... | 04/22/2008 |
| 7356917 | Method for manufacturing multi-layer printed circuit board A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface r... | 04/15/2008 |
| 7354619 | Protection of the SiC surface by a GaN layer The invention relates to a process for protecting the surface of an SiC substrate. This process comprises deposition of a temporary protection layer with a thickness equal to at least two monolayers on the surface of the substrate to be protected, the protection lay... | 04/08/2008 |
| 7355278 | Mold die for a semiconductor device A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a ... | 04/08/2008 |
| 7348283 | Mechanically robust dielectric film and stack A method for forming a mechanically robust dielectric film comprises depositing a dielectric film on a substrate and then inducing a compressive strain in a top surface of the dielectric film to form a compressive strained surface. The compressive strain may be indu... | 03/25/2008 |
| 7339118 | Printed wiring board and method for manufacturing the same In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive ... | 03/04/2008 |
| 7339260 | Wiring board providing impedance matching A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via... | 03/04/2008 |
| 7332799 | Packaged chip having features for improved signal transmission on the package A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together f... | 02/19/2008 |
| 7329947 | Heat treatment jig for semiconductor substrate When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that... | 02/12/2008 |
| 7327018 | Chip package structure, package substrate and manufacturing method thereof A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit layer disposed on a surface thereof. The interposer includes a second ... | 02/05/2008 |
| 7327019 | Semiconductor device of a charge storage type According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. ... | 02/05/2008 |
| 7320604 | Electronic circuit module and method for fabrication thereof Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in ... | 01/22/2008 |
| 7317255 | Reliable printed wiring board assembly employing packages with solder joints An exemplary assembly comprises a printed wiring board having a first surface, and a package including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via is defined through the first surface of the printed wiring board, ... | 01/08/2008 |
| 7315086 | Chip-on-board package having flip chip assembly structure and manufacturing method thereof A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the fil... | 01/01/2008 |
