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An armor with rollers is provided that enables a user to move in all positions by rolling on a hard and smooth surface while constantly varying his bearing points on the ground.
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| Number | Title | Issue Date |
| 8125074 | Laminated substrate for an integrated circuit BGA package and printed circuit boards A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die pla... | 02/28/2012 |
| 8110918 | Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate A flexible substrate used in a semiconductor package, a method of manufacturing the same, and a semiconductor package including the flexible substrate. A circuit pattern forming region is formed in an insulating substrate with a dented shape and a circuit pattern fo... | 02/07/2012 |
| 8102044 | Bonded wafer structure and method of fabrication A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to cre... | 01/24/2012 |
| 8093712 | Monolithic molded flexible electronic assemblies without solder and methods for their manufacture A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection ... | 01/10/2012 |
| 8084855 | Integrated circuit tampering protection and reverse engineering prevention coatings and methods A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixin... | 12/27/2011 |
| 8044505 | Prepreg, method for manufacturing prepreg, substrate, and semiconductor device A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second re... | 10/25/2011 |
| 8039949 | Ball grid array package having one or more stiffeners Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substr... | 10/18/2011 |
| 8035219 | Packaging semiconductors at wafer level A method for packaging a plurality of semiconductor devices formed in a surface portion of a semiconductor wafer. The method includes: lithographically forming, in a first lithographically processable material disposed on the surface portion of the semiconductor waf... | 10/11/2011 |
| 8004078 | Adhesive composition for semiconductor device Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of therm... | 08/23/2011 |
| 7952188 | Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip A module is described having a semiconductor chip which has at least one contact pad. A first dielectric layer, which contains a fluorocarbon compound, as well as a first wiring layer are applied to the semiconductor chip. ... | 05/31/2011 |
| 7906843 | Substrate having a functionally gradient coefficient of thermal expansion A substrate and a method of making a substrate having a functionally gradient coefficient of thermal expansion are described herein. A system having a silicon die, an organic package substrate, and a substrate having a functionally gradient coefficient of thermal ex... | 03/15/2011 |
| 7888791 | Device for electrical connection of an integrated circuit chip A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of b... | 02/15/2011 |
| 7888790 | Bare die package with displacement constraint Embodiments of the present invention describe a bare die package and its methods of fabrication. The bare die package comprises a die electrically coupled to a package substrate, and a displacement constraint. In an embodiment of the present invention, the displacem... | 02/15/2011 |
| 7875969 | Rigid-flex printed circuit board with weakening structure A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side... | 01/25/2011 |
| 7838983 | Packaged semiconductor device and method of manufacturing the packaged semiconductor device The present invention connects a first wiring portion located at one side of a substrate and a second wiring portion located at the other side. A side electrode connected to the first wiring portion is formed, and the second wiring portion is formed on an insulating... | 11/23/2010 |
| 7825506 | Semiconductor module including semiconductor chips in a plastic housing in separate regions A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. ... | 11/02/2010 |
| 7812440 | Electronic package device, module, and electronic apparatus There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor p... | 10/12/2010 |
| 7808097 | Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention a... | 10/05/2010 |
| 7791187 | Semiconductor device A semiconductor device of the invention includes a semiconductor substrate having a first insulating section formed on one surface thereof. A first conductive section is disposed on the one surface of the semiconductor substrate. A second insulating section is super... | 09/07/2010 |
| 7772689 | Semiconductor package with a conductive post and wiring pattern It is configured to comprise a semiconductor chip 110, a resin member 106 for forming a cavity 109 in which this semiconductor chip 110 is installed, and wiring 105 constructed of pattern wiring 105b formed so as to b... | 08/10/2010 |
| 7763971 | Circuit module and electrical component In an electrical component including a solid-state circuit portion and a substrate connecting portion, the solid-state circuit portion includes: a supporting surface faced to and supported by the substrate connecting portion; and an opposing surface which is widened... | 07/27/2010 |
| 7763970 | Power module A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is ... | 07/27/2010 |
| 7728424 | Semiconductor device and method of manufacturing the same A semiconductor device including: a semiconductor substrate having an electrode; a resin protrusion formed on a surface of the semiconductor substrate on which the electrode is formed, the resin protrusion extending along a straight line and having a sloping region ... | 06/01/2010 |
| 7723840 | Integrated circuit package system with contoured die An integrated circuit package system is provided including forming an external interconnect, providing a contoured integrated circuit die having both an extension and a base portion with the extension extending beyond the base portion, placing the contoured integrat... | 05/25/2010 |
| 7719106 | Semiconductor device, electronic card and pad rearrangement substrate A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring ... | 05/18/2010 |
| 7714432 | Ceramic/organic hybrid substrate A semiconductor device is provided that includes one or more ceramic material layers and one or more low dielectric constant (low-K) epoxy layers on top to be electrically coupled to an integrated circuit device, such as a chip die. The resulting ceramic/organic hyb... | 05/11/2010 |
| 7692287 | Semiconductor device and wiring board A wiring board (20A) includes a first wiring portion (10A) having a plurality of wiring layers (1) and external connecting bumps (5), and at least one second wiring portion (15A) having a plurality of contact plugs (14). The... | 04/06/2010 |
| 7671464 | Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at... | 03/02/2010 |
| 7663226 | Heat-releasing printed circuit board and semiconductor chip package A heat-releasing printed circuit board and semiconductor chip package are disclosed. The heat-releasing printed circuit board includes an insulation layer, on a surface of which a circuit pattern is formed, and a solder resist, which is stacked on the insulation lay... | 02/16/2010 |
| 7656022 | Wiring board and manufacturing method for wiring board A wiring board is provided, where in the case where the wiring board and a piezoelectric element are connected via solder, the strength of connection in the peripheral region of the wiring board can be increased, and it is difficult for a connection defect to occur ... | 02/02/2010 |
| 7642641 | Integrated circuit component with passivation layer A semiconductor component includes a semiconductor chip provided with a passivation layer that covers the topmost interconnect structure of the semiconductor chip whilst leaving contact areas free. The passivation layer is in direct adhesive contact with the plastic... | 01/05/2010 |
| 7633149 | Integrated circuit arrangement An integrated circuit arrangement including a nonplanar substrate on which an integrated circuit is formed on at least one side, wherein the side of the substrate which has the integrated circuit is arranged on a carrier and the carrier is produced from a chemically... | 12/15/2009 |
| 7629681 | Ball grid array package with patterned stiffener surface and method of assembling the same Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substr... | 12/08/2009 |
| 7579684 | Methods for packing microfeature devices and microfeature devices formed by such methods Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate hav... | 08/25/2009 |
| 7535095 | Printed wiring board and method for producing the same The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a mult... | 05/19/2009 |
| 7498670 | Semiconductor structures having electrophoretically insulated vias Methods are provided for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the l... | 03/03/2009 |
| 7485955 | Semiconductor package having step type die and method for manufacturing the same A variety of non-rectangular IC chips having a stepped or modified periphery or edge profile including one or more recessed or indented peripheral regions are provided for incorporation in modified package configurations, single chip packages and multi-chip assembli... | 02/03/2009 |
| 7473994 | Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device A method of producing an insulator thin film, for forming a thin film on a substrate by use of the atomic layer deposition process, includes a first step of forming a silicon atomic layer on the substrate and forming an oxygen atomic layer on the silicon atomic laye... | 01/06/2009 |
| 7443020 | Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit Dummy stacks, each providing a common point of connectivity potentially across all metal layers, are incorporated along with the functional block in an integrated circuit. When the connectivity of elements of the functional block need to be changed later, the dummy ... | 10/28/2008 |
| 7436057 | Elastomer interposer with voids in a compressive loading system An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric ... | 10/14/2008 |
