Class 257/700 - Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the housing or package combined with
No. of patents: 1589
Last issue date: 05/15/2012

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Number	Title	Issue Date
8178965	Semiconductor module having deflecting conductive layer over a spacer structure A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to deflect the conductive layer away from the semiconductor chip. ...	05/15/2012
8169072	Semiconductor device, manufacturing method thereof, and electronic device A disclosed semiconductor device includes a reinforcing board having first and second faces, an electronic part accommodating portion penetrating the reinforcing board, a through hole, an electronic part having a front face on which an electrode pad is formed and a ...	05/01/2012
8154114	Power semiconductor module A power semiconductor module is disclosed. One embodiment includes a multilayer substrate having a plurality of metal layers and a plurality of ceramic layers, where the ceramic layers are located between the metal layers. ...	04/10/2012
8148810	Semiconductor device, and inspection method thereof In a substrate for a stacking-type semiconductor device including a connection terminal provided for a connection with a semiconductor chip to be stacked and an external terminal connected to the connection terminal through a conductor provided in a substrate, conne...	04/03/2012
8115300	Wiring substrate and manufacturing method thereof, and semiconductor apparatus In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wi...	02/14/2012
8097946	Device mounting board, semiconductor module, and mobile device A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the gla...	01/17/2012
8063481	High-speed memory package The semiconductor package includes a dielectric layer, a trace layer, a conductive layer, a die and an underfill layer. The dielectric layer has first side and an opposing dielectric layer second side. Multiple vias extend through the dielectric layer from the diele...	11/22/2011
8058723	Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof A package structure in which a coreless substrate has direct electrical connections to a semiconductor chip and a manufacturing method thereof are disclosed. The method includes the following steps: providing a metal carrier board having a cavity; placing a chip hav...	11/15/2011
8044504	Semiconductor device including an inner conductive layer which is cut out in the vicinity of a corner A semiconductor device, includes: an organic multilayer wiring substrate having an inner conductive layer; a semiconductor element mounted and connected on one surface of the wiring substrate; and a plurality of solder balls disposed on the other surface in a grid a...	10/25/2011
8039948	Device mounting board and semiconductor apparatus using the same A device mounting board for a device to be mounted on, comprising: a substrate; and a laminated film composed of a plurality of insulating layers formed on one side of the substrate. Here, any of the second and subsequent insulating layers from the substrate is a ph...	10/18/2011
8035218	Microelectronic package and method of manufacturing same A microelectronic package includes a first substrate (120) having a first surface area (125) and a second substrate (130) having a second surface area (135). The first substrate includes a first set of interconnects (126) having a ...	10/11/2011
8035217	Semiconductor device and method for manufacturing same A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating res...	10/11/2011
8026593	Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening ...	09/27/2011
8018046	Printed wiring board with notched conductive traces A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and on...	09/13/2011
8018045	Printed circuit board The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer p...	09/13/2011
8018047	Power semiconductor module including a multilayer substrate A semiconductor module includes a multilayer substrate. The multilayer substrate includes a first metal layer and a first ceramic layer over the first metal layer. An edge of the first ceramic layer extends beyond an edge of the first metal layer. The multilayer sub...	09/13/2011
7977784	Semiconductor package having redistribution layer A semiconductor package and a method for making the same, whereby the semiconductor package includes a substrate, a first passivation layer, a first metal layer, a second passivation layer, and second and third metal layers. The substrate has a surface having at lea...	07/12/2011
7956454	Wiring board and ceramic chip to be embedded A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a c...	06/07/2011
7952187	System and method of forming a wafer scale package A system and method for forming a wafer level package (WLP) (i.e., wafer level chip size package) is disclosed. The WLP includes a silicon integrated circuit (IC) substrate having a plurality of die pads formed on a top surface thereof and a plurality of polymer lam...	05/31/2011
7939936	Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit A semiconductor package includes a wiring board having a plurality of first electrode pads exposed on a top surface thereof, and a plurality of second electrode pads exposed on a bottom surface thereof, and the first electrode pads are electrically connected to the ...	05/10/2011
7939935	Electronic device substrate, electronic device and methods for fabricating the same A core substrate-less electronic device is fabricated by using an electronic device substrate 10. The electronic device substrate 10 a metal core substrate 11, and an external connection wiring layer 100 provided on the metal core substra...	05/10/2011
7932595	Electronic component package comprising fan-out traces A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t...	04/26/2011
7928558	Production of an electrical component and component An electrical component includes a base body made using ceramic, metallization surfaces that at least partly define component structures on the base body, a passivation layer that is electrically insulating and over a surface of the base body, solder contacts on the...	04/19/2011
7919851	Laminate substrate and semiconductor package utilizing the substrate A laminated substrate and the semiconductor package utilizing the substrate are revealed. The laminated substrate primarily comprises a core layer, a first metal layer and a first solder mask disposed on the bottom surface of the core layer, and a second metal layer...	04/05/2011
7911049	Electrically optimized and structurally protected via structure for high speed signals An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitanc...	03/22/2011
7906842	Wafer level system in package and fabrication method thereof There is provided a system-in-package (SiP), which includes a substrate obtained by cutting a wafer for each unit system; one or more first electronic devices mounted on the substrate by a heat radiation plate; a plurality of interlayer dielectrics sequentially form...	03/15/2011
7902662	Power core devices and methods of making thereof A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is po...	03/08/2011
7893528	Package structure of compound semiconductor device and fabricating method thereof A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating di...	02/22/2011
7888789	Transfer material used for producing a wiring substrate A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring patt...	02/15/2011
7884466	Semiconductor device with double-sided electrode structure and its manufacturing method According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surfa...	02/08/2011
7880296	Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal laye...	02/01/2011
7880297	Semiconductor chip having conductive member for reducing localized voltage drop A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces ar...	02/01/2011
7872347	Larger than die size wafer-level redistribution packaging process Methods, systems, and apparatuses for integrated circuit packages, and processes for forming the same, are provided. In one example, an integrated circuit (IC) package includes an integrated circuit die, a layer of insulating material, a redistribution interconnect ...	01/18/2011
7863728	Semiconductor module including components in plastic casing A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package mo...	01/04/2011
7863729	Circuit board structure embedded with semiconductor chips A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow c...	01/04/2011
7843057	Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parall...	11/30/2010
7838982	Semiconductor package having connecting bumps A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achievin...	11/23/2010
7821122	Method and system for increasing circuitry interconnection and component capacity in a multi-component package A method and system for fabricating a interconnect substrate for a multi-component package is disclosed. The multi-component package includes at least one die and a package substrate. The method and system include providing an insulating base and providing at least ...	10/26/2010
7800217	Power semiconductor device connected in distinct layers of plastic A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side and on its back side large-area electrodes. The electrodes are electrically in connection with external ...	09/21/2010
7800216	Multilayer printed wiring board An IC chip for a high frequency region, particularly, a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer is formed at a thickness of 30 μm on a core substrate and a conductive circuit on an interlayer resin in...	09/21/2010

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Class 257/700 - Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)