Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 8188592 | Apparatus and method configured to lower thermal stresses An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a heat sink plate and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure i... | 05/29/2012 |
| 7964957 | Circuit substrate, circuit device and manufacturing process thereof A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive patt... | 06/21/2011 |
| 7772688 | Electronic circuit unit The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing,... | 08/10/2010 |
| 7719104 | Circuit board structure with embedded semiconductor chip and method for fabricating the same The present invention provides a circuit board structure with an embedded semiconductor chip and a method for fabricating the same. The circuit board structure includes a carrier board having a first surface, a second surface, and a through hole penetrating the carr... | 05/18/2010 |
| 7659613 | Semiconductor device A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, which is provided with a stepped surface positioned at lower level at a portion of the base plate than a main surface of the base pl... | 02/09/2010 |
| 7642640 | Semiconductor device and manufacturing process thereof The semiconductor device according to one of the embodiments of the present invention includes a metal block having first and second main surfaces and defining a recess on the first main surface. It also includes a semiconductor chip received within the recess of th... | 01/05/2010 |
| 7576423 | Semiconductor device A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, a first dielectric plate is arranged on one side of the semiconductor element and a first circuit pattern is formed on its surface, ... | 08/18/2009 |
| 7521789 | Electrical assembly having heat sink protrusions An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink prot... | 04/21/2009 |
| 7411288 | Semiconductor device A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, a first dielectric plate is arranged on one side of the semiconductor element and a first circuit pattern is formed on its surface, ... | 08/12/2008 |
| 7408258 | Interconnection circuit and electronic module utilizing same A method for fabricating copper-faced electronic modules is described. These modules are mechanically robust, thermally accessible for cooling purposes, and capable of supporting high power circuits, including operation at 10 GHz and above. An imprinting method is d... | 08/05/2008 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7289547 | Laser and detector device A detector is disposed on the passive side of a laser to detect photon leakage through the passive side mirror and measure as current created in the detector via a Schottky contact. ... | 10/30/2007 |
| 7247938 | Carrier, method of manufacturing a carrier and an electronic device The carrier (30) comprises a first etch mask (14), a first metal layer (11), an intermediate layer (12), a second metal layer (13) and a second etch mask (17). Both the first and the second etch mask (14, 17) can be p... | 07/24/2007 |
| 7244965 | Power surface mount light emitting die package A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conduc... | 07/17/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7239525 | Circuit board structure with embedded selectable passive components and method for fabricating the same A circuit board structure with embedded selectable passive components and a method for fabricating the same are proposed, wherein a plurality of passive components are embedded in a circuit board and a plurality of electrical connections are formed on a surface of t... | 07/03/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7236675 | Process for producing optical waveguide The invention provides a process for producing an optical waveguide, which comprises the steps of: forming a substrate adhesion layer on a surface of a substrate from a layer-forming material containing a coupling agent; forming an undercladding layer on the substra... | 06/26/2007 |
| 7221048 | Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage s... | 05/22/2007 |
| 7221050 | Substrate having a functionally gradient coefficient of thermal expansion A substrate and a method of making a substrate having a functionally gradient coefficient of thermal expansion are described herein. A system having a silicon die, an organic package substrate, and a substrate having a functionally gradient coefficient of thermal ex... | 05/22/2007 |
| 7215021 | Electronic device The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosi... | 05/08/2007 |
| 7205956 | Structural waveguide formed in a leg of an antenna tower and method of use A communications tower, or other structure is provided with at least one waveguide defined in a structural support. The waveguide can be used to transmit signals up and down the communications tower thereby eliminating at least some cabling. ... | 04/17/2007 |
| 7205648 | Flip-chip light emitting diode package structure A flip-chip LED package structure is disclosed. The flip-chip LED package structure includes a submount, patterned conductive films, a LED chip and two bumps. Several grooves are formed on the sidewalls of the submount. The patterned conductive films are formed on t... | 04/17/2007 |
| 7205645 | Wiring board, semiconductor device, and method of manufacturing wiring board A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers... | 04/17/2007 |
| 7115435 | Manufacturing method for wiring substrates A manufacturing method for wiring substrates for photographing a positioning mark formed with a high precision using reflected light and executing a relative positioning operation between a wiring substrate workpiece and an exposure mask based thereon. The method st... | 10/03/2006 |
| 7085469 | Process for producing three-dimensional polyimide optical waveguide This invention provides a process for producing a three-dimensional polyimide optical waveguide, which comprises: (I) irradiating a polyamic acid film with a laser beam while converging the laser beam at an inside portion of the film and relatively moving the light ... | 08/01/2006 |
| 7081661 | High-frequency module and method for manufacturing the same In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the s... | 07/25/2006 |
| 7067912 | Wired circuit board A wired circuit board can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency eve... | 06/27/2006 |
| 7061096 | Multi-surface IC packaging structures and methods for their manufacture An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other device... | 06/13/2006 |
| 7035617 | High power block upconverter A system and method for high power block upconversion having a stand-alone and surface-mountable component is provided. The HP-BUC system of the invention provides a “drop-in” component capable of mixing a local oscillator signal with an IF signal to produce an ... | 04/25/2006 |
| 7012192 | Feedthrough terminal assembly with lead wire bonding pad for human implant applications A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device. ... | 03/14/2006 |
| 6994589 | Method for production of a gas-tight ducting for a contact through a wall and device for ducting an electrical contact through a wall The invention relates to a method for production of a gas-tight ducting for a contact (4) through a wall (12), in particular in a fuel tank and a device for said ducting. According to the method, the contact is placed in a tool form (1), in whic... | 02/07/2006 |
| 6982486 | Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotrop... | 01/03/2006 |
| 6974517 | Lid with window hermetically sealed to frame, and a method of making it An apparatus (10) includes a digital micromirror device (16) disposed within a housing (11) that has an opening (13) hermetically sealed by a lid (17). The lid includes a radiation transmissive window (22) with peripheral ed... | 12/13/2005 |
| 6973227 | Optical communication device There is provided an optical communication device in which a plurality of lands 45a and 45c of the printed board 32 connected to a plurality of main signal leads 50 and 51 of a co-axial laser diode module 34 ar... | 12/06/2005 |
| 6967390 | Electronic component and method of manufacturing same An electronic component includes an electronic chip (110) and a chip carrier portion (120) having sidewalls (121) and a bottom portion (122). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip... | 11/22/2005 |
| 6947295 | Ball grid array package with an electromagnetic shield connected directly to a printed circuit board A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receive... | 09/20/2005 |
| 6917099 | Die carrier with fluid chamber A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber. ... | 07/12/2005 |
| 6908026 | Method and apparatus for making a lid with an optically transmissive window A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157). Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231)... | 06/21/2005 |
| 6891258 | Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit Structures that provide decoupling capacitance to packaged IC devices with reduced capacitor and via parasitic inductance. A capacitive interposer structure is physically interposed between the packaged IC and the PCB, thus eliminating the leads and vias that traver... | 05/10/2005 |
