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| Number | Title | Issue Date |
| 8188591 | Integrated structures of high performance active devices and passive devices Integrated structures having high performance CMOS active devices mounted on passive devices are provided. The structure includes an integrated passive device chip having a plurality of through wafer vias, mounted to a ground plane. The structure further includes at... | 05/29/2012 |
| 8188590 | Integrated circuit package system with post-passivation interconnection and integration An integrated circuit package system including: providing an integrated circuit die, forming a first layer over the integrated circuit die, forming a bridge on and in the first layer, forming a second layer on the first layer, and forming bump pads on and in the sec... | 05/29/2012 |
| 8183685 | Semiconductor device A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through t... | 05/22/2012 |
| 8178964 | Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same A structure of a semiconductor device package having a substrate with a die receiving through hole, a connecting through hole structure and a contact pad. A die is disposed within the die receiving through hole. A surrounding material is formed under the die and fil... | 05/15/2012 |
| 8169071 | Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers A semiconductor device includes a substrate, a first recessed conductive layer embedded and recessed into a first surface of the substrate, and a first raised conductive layer disposed above the first surface. A first vertical offset exists between an upper surface ... | 05/01/2012 |
| 8164175 | Stackable semiconductor device assemblies A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surfac... | 04/24/2012 |
| 8154113 | Interconnect and test assembly including an interconnect An interconnect includes an elastic body, an electric conductor and a spacer. The elastic body has a first surface, a second surface, a first hole extending from the first surface to the second surface, and a second hole extending from the first surface to the secon... | 04/10/2012 |
| 8143716 | Semiconductor device with plate-shaped component The invention provides a semiconductor device including a plurality of stacked semiconductor chips, which offers a higher degree of freedom in selecting a chip size of the semiconductor chip and arranging the routing, and increase of the reliability and speed in sig... | 03/27/2012 |
| 8125073 | Wafer integrated with permanent carrier and method therefor A semiconductor device has a wafer for supporting the device and a conductive layer formed over a top surface of the wafer. A carrier wafer is permanently bonded over the conductive layer. Within the wafer and the carrier wafer, an interconnect structure is formed. ... | 02/28/2012 |
| 8120167 | System with semiconductor components having encapsulated through wire interconnects (TWI) A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the ... | 02/21/2012 |
| 8093710 | Non-uniform feedthrough and lead configuration for a transistor outline package A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and secon... | 01/10/2012 |
| 8093711 | Semiconductor device A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially en... | 01/10/2012 |
| 8084854 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a substrate, a metal substrate pad, and a... | 12/27/2011 |
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connec... | 12/13/2011 |
| 8072060 | Semiconductor fingerprint apparatus with flat touch surface In a fingerprint apparatus, fingerprint sensing members disposed on a silicon substrate detect skin textures of a finger placed thereon to generate electric signals. A set of integrated circuits formed on the substrate processes the electric signals. First bonding p... | 12/06/2011 |
| 8072059 | Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die A semiconductor device is made by forming a first conductive layer over a temporary carrier. A UBM layer is formed over the temporary carrier and fixed in position relative to the first conductive layer. A conductive pillar is formed over the first conductive layer.... | 12/06/2011 |
| 8067832 | Embedded integrated circuit package system and method of manufacture thereof A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by th... | 11/29/2011 |
| 8058722 | Power semiconductor module and method of manufacturing the same Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through h... | 11/15/2011 |
| 8053886 | Semiconductor package and manufacturing method thereof A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situ... | 11/08/2011 |
| 8049326 | Environment-resistant module, micropackage and methods of manufacturing same An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is bo... | 11/01/2011 |
| 8049327 | Through-silicon via with scalloped sidewalls A semiconductor device having one or more through-silicon vias (TSVs) is provided. The TSVs are formed such that sidewalls of the TSVs have a scalloped surface. In an embodiment, the sidewalls of the TSVs are sloped wherein a top and bottom of the TSVs have differen... | 11/01/2011 |
| 8035215 | Semiconductor device and manufacturing method of the same The invention is directed to prevent corrosion of a semiconductor device. In the semiconductor device manufacturing method of the invention, a semiconductor substrate is etched from its back surface in a position corresponding to a first wiring formed on the semicon... | 10/11/2011 |
| 8035216 | Integrated circuit package and method of manufacturing same Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between th... | 10/11/2011 |
| 8030753 | Semiconductor device and method for making the same A semiconductor device includes a semiconductor element, an electrode formed on the semiconductor element, and a protective member covering the semiconductor element. The protective member is formed with a through-hole facing the electrode. In the through-hole, a wi... | 10/04/2011 |
| 8030752 | Method of manufacturing semiconductor package and semiconductor plastic package using the same A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically co... | 10/04/2011 |
| 8030751 | Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates A method for fabricating a chip-scale board-on-chip substrate, or redistribution element, includes forming conductive planes on opposite sides of a substrate. A first of the conductive planes includes two sets of bond fingers, conductive traces that extend from a fi... | 10/04/2011 |
| 8026592 | Through-silicon via structures including conductive protective layers Through-Silicon-Via (TSV) structures can include a conductive via through a substrate extending from an upper surface of the substrate to a backside surface of the substrate opposite the upper surface, a conductive protective layer including Ni and/or Co can be at a... | 09/27/2011 |
| 8013434 | Thin double-sided package substrate and manufacture method thereof The present invention discloses a package substrate comprising an insulative carrier having a through-hole penetrating the top and bottom surfaces thereof; at least one first and second conductive layers comprising circuits respectively formed on the top and bottom ... | 09/06/2011 |
| 8013433 | Virtual wire assembly having hermetic feedthroughs A virtual wire assembly that includes a substantially electrically-nonconductive substrate and a plurality of hermetic feedthroughs including a conductive region extending transversely through the substrate to form a conductive pathway with accessible surfaces at op... | 09/06/2011 |
| 8004077 | Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof A semiconductor device comprising: a substrate; a terminal on the substrate's first surface; a first electrode on the first surface connected to the terminal; an electronic element on the substrate's second surface; a second electrode connected to the electronic ele... | 08/23/2011 |
| 7994634 | Semiconductor element and semiconductor element fabrication method A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of... | 08/09/2011 |
| 7982305 | Integrated circuit package including a three-dimensional fan-out / fan-in signal routing An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts a... | 07/19/2011 |
| 7982306 | Stackable semiconductor package A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and... | 07/19/2011 |
| 7944043 | Semiconductor device having improved contact interface reliability and method therefor A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is ... | 05/17/2011 |
| 7936061 | Semiconductor device and method of manufacturing the same A semiconductor device includes: a first insulating layer having an opening therethrough; a first wiring pattern disposed on the first insulating layer; an external connection terminal provided on a portion of the first wiring pattern exposed from the opening; a sec... | 05/03/2011 |
| 7919849 | Package substrate and device for optical communication A package substrate includes a laminated body having a conductor circuit and an insulating layer formed and laminated, solder resist layers formed and laminated on both sides of the laminated body, respectively, an optical element, and an optical path for transmitti... | 04/05/2011 |
| 7919850 | Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on th... | 04/05/2011 |
| 7915726 | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes formi... | 03/29/2011 |
| 7902661 | Integrated circuit micro-module Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to an integrated circuit package in which one or more integrated circuits are embedded in a substrate and covered with a layer of photo-imagea... | 03/08/2011 |
| 7902660 | Substrate for semiconductor device and manufacturing method thereof A substrate for a semiconductor device and a manufacturing thereof, and a semiconductor device using the same and a manufacturing method thereof are disclosed. For example, in the substrate according to the present invention, a core is eliminated, so that the substr... | 03/08/2011 |
