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| Number | Title | Issue Date |
| 8188589 | Substrate with pin, manufacturing method thereof, and semiconductor product A semiconductor product is constructed of a wiring substrate in which pads for pin connection are formed, and a substrate with pins in which pins are disposed. The substrate with the pins is formed so that one end of the pin is exposed to one surface of a resin subs... | 05/29/2012 |
| 8159064 | Lead pin for package substrate, and method for manufacturing package substrate with the same Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an o... | 04/17/2012 |
| 8143715 | Semiconductor package transformer The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front ... | 03/27/2012 |
| 8120166 | Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin... | 02/21/2012 |
| 8110917 | Package substrate with a conductive connecting pin A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad | 02/07/2012 |
| 8097945 | Bi-directional, reverse blocking battery switch Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces ... | 01/17/2012 |
| 8035214 | Conductive connecting pin for package substance A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad | 10/11/2011 |
| 7939934 | Microelectronic packages and methods therefor An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible ... | 05/10/2011 |
| 7928557 | Stacked package and method for manufacturing the package In a stacked package in which a plurality of packages having semiconductor elements mounted on substrates are stacked, while being electrically connected together, by use of connection sections, wherein the connection sections are formed from pillar-like members and... | 04/19/2011 |
| 7923832 | Integrated circuit package An integrated circuit package includes a cover plate disposed on a substrate mounted with an integrated circuit chip thereon. The chip is formed with first solder pads coupled respectively and wiredly to pin terminals on the substrate, and second solder pads coupled... | 04/12/2011 |
| 7902659 | Conductive connecting pin and package substrate A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad | 03/08/2011 |
| 7880291 | Integrated circuit package and integrated circuit module An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other su... | 02/01/2011 |
| 7847393 | Conductive connecting pins for a package substrate A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad | 12/07/2010 |
| 7821784 | Electronic apparatus According to one embodiment, an electronic apparatus includes a housing, a battery pack, an ODD unit having a thickness smaller than the battery pack, and an additional device contained in the housing. The battery pack is arranged in a back section of the housing. T... | 10/26/2010 |
| 7791185 | Pin grid array package substrate including pins having curved pin heads An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous cu... | 09/07/2010 |
| 7719102 | Semiconductor device A manufacturing method of a semiconductor device of this invention includes forming metal pads on a Si substrate through a first oxide film, bonding the Si substrate and a holding substrate which bolsters the Si substrate through a bonding film, forming an opening b... | 05/18/2010 |
| 7602059 | Lead pin, circuit, semiconductor device, and method of forming lead pin A lead pin of a circuit includes a pin, an insulator that surrounds the pin, and a conductor that surrounds the insulator, the conductor including non-uniformity. ... | 10/13/2009 |
| RE40887 | Semiconductor chip with redistribution metal layer A new method is provided for the creation of Input/Output connection points to a semiconductor device package. An extension is applied to the conventional I/O connect points of a semiconductor device, allowing the original I/O point location to be relocated to a new... | 09/01/2009 |
| 7436052 | Repatterned integrated circuit chip package A repatterned integrated circuit chip package which balances and/or reduces the package capacitance associated with the gain resistor terminals to reduce the degradation of common mode rejection with frequency. ... | 10/14/2008 |
| 7371687 | Electronic circuit device An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a... | 05/13/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7372169 | Arrangement of conductive pads on grid array package and on circuit board The present invention discloses a dense arrangement in the conductors of a package and the corresponding conductive pads of a circuit board. The conductors and the corresponding conductive pads are separated into at least a first group in a peripheral region of the ... | 05/13/2008 |
| 7372134 | Integrated circuit edge protection method and apparatus An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill... | 05/13/2008 |
| 7365419 | Surface-mount packaging for chip A chip includes a plurality of pins; and a plurality of symbols defined on a surface of the chip, wherein the symbols are arranged as a graduated scale corresponding with the pins. It becomes very easy to find a initial pin from among the plurality of pins of the ch... | 04/29/2008 |
| 7365987 | Structure for heat dissipation of integrated circuit chip and display module including the same A circuit board having a first IC chip mounted thereon, and a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portio... | 04/29/2008 |
| 7358603 | High density electronic packages A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carr... | 04/15/2008 |
| 7355287 | Semiconductor chip package and method for fabricating the same Disclosed are a semiconductor chip package and a method for fabricating the same. The semiconductor chip package includes a semiconductor chip and a circuit board. The semiconductor chip is bonded to the circuit board by means of adhesive except for a metal-exposed ... | 04/08/2008 |
| 7355276 | Thermally-enhanced circuit assembly A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conduct... | 04/08/2008 |
| 7352579 | Apparatus and system for cooling heat producing components An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a he... | 04/01/2008 |
| 7348661 | Array capacitor apparatuses to filter input/output signal An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package and an underlying substrate such as a printed circuit board. ... | 03/25/2008 |
| 7348215 | Methods for assembly and packaging of flip chip configured dice with interposer A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconduc... | 03/25/2008 |
| 7342320 | Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connectio... | 03/11/2008 |
| 7342317 | Low coefficient of thermal expansion build-up layer packaging and method thereof A build-up layer packaging comprising a first ceramic substrate, a second ceramic substrate, and a circuit layer is provided. The first ceramic substrate has a through hole to dispose a die therein. The second ceramic substrate, attached to a common lower surface of... | 03/11/2008 |
| 7339259 | Semiconductor device A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and ... | 03/04/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7335965 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 02/26/2008 |
| 7332862 | Led lamp including a resist bonded to a copper film In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and a gold film are formed on a portion of the copper film where the resi... | 02/19/2008 |
| 7329620 | System and method for providing an integrated circuit having increased radiation hardness and reliability A system and method is disclosed for providing an integrated circuit that has increased radiation hardness and reliability. A device active area of an integrated circuit is provided and a layer of radiation resistant material is applied to the device active area of ... | 02/12/2008 |
| 7323775 | Memory module A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly n... | 01/29/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
