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| Number | Title | Issue Date |
| 7964956 | Circuit packaging and connectivity The present disclosure describes a unique pin configuration for mounting of circuit packages to corresponding host circuit boards. For example, an apparatus according to embodiments herein comprises a circuit, a substrate, and multiple conductive leads. The substrat... | 06/21/2011 |
| 7439612 | Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector In certain embodiments, a leadframe structure for forming one or more integrated circuit packages includes a number of adjacent substantially parallel lead bars adapted to receive a die associated with an integrated circuit at one or more of the lead bars such that ... | 10/21/2008 |
| 7420271 | Heat conductivity and brightness enhancing structure for light-emitting diode A heat conductivity and brightness enhancing structure for light-emitting diode, including a bracket having a cathode leg support. A bowl structure is formed on upper end of the cathode leg support for resting a light-emitting chip therein. At least one depression i... | 09/02/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7205658 | Singulation method used in leadless packaging process A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of t... | 04/17/2007 |
| 7190065 | Circuit substrate, semiconductor module and method of manufacturing circuit substrate To enhance bonding accuracy to a lead electrode, while coping with narrowing pitch of the lead electrodes, a lead electrode, whose bonding surface is sharpened, is provided to a film substrate, and a protruding electrode is bonded to the lead electrode, while having... | 03/13/2007 |
| 7190604 | Capacity dividable memory IC Two memory areas on a wafer are coupled through pass transistors to double the memory capacity of each area and can be sawed to yield two memory chips each with single memory area. A pair of pass transistors are used to couple each dedicated functional pad in both m... | 03/13/2007 |
| 7179295 | Prosthetic shock absorber A prosthesis is provided having a first plate and a second plate spaced apart from the first plate. A substantially round post separates the first plate and the second plate and a flexure is provided in the second plate proximate the post. ... | 02/20/2007 |
| 7173328 | Integrated circuit package and method having wire-bonded intra-die electrical connections A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The bond pads commonly being formed above active circuit components. The ... | 02/06/2007 |
| 7151027 | Method and device for reducing interface area of a memory device A method and device for reducing interface area of a memory device. A poly-2 layer is formed above a substrate at an interface between a memory array and a periphery of the memory device. The poly-2 layer is etched proximate to the memory array. The poly-2 layer is ... | 12/19/2006 |
| 7151042 | Method of improving flash memory performance A method of improving flash memory performance. The method includes: providing a substrate having a gate structure thereon, the gate structure having a gate dielectric layer, a first polysilicon layer, an interploy dielectric layer, and a second polysilicon layer; t... | 12/19/2006 |
| 7132752 | Semiconductor chip and semiconductor device including lamination of semiconductor chips To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a mai... | 11/07/2006 |
| 7119423 | Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of el... | 10/10/2006 |
| 7091545 | Memory device and fabrication method thereof A memory device and fabricating method thereof. In the memory device of the present invention, a substrate has a plurality of deep trenches, wherein the deep trenches formed in the adjacent rows are staggered. A deep trench capacitor and a control gate are disposed ... | 08/15/2006 |
| 7061084 | Lead-bond type chip package and manufacturing method thereof A lead-bond type chip package includes a multilayer substrate for supporting and electrical interconnecting a semiconductor chip. The multilayer substrate has a slot defined therein. The multilayer substrate comprises an interlayer circuit board having prepregs disp... | 06/13/2006 |
| 6984884 | Electric power semiconductor device A main lead (2) is a single body comprised of an inner lead (2a) and an outer lead (2b) which are integrally formed, the bonding wires are arranged in parallel and fixed onto the inner lead (2a) by the wire bonding po... | 01/10/2006 |
| 6953989 | Film carrier tape for mounting electronic devices thereon and final defect marking method using the same A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying out final defect marking ... | 10/11/2005 |
| 6946726 | Chip carrier substrate with a land grid array and external bond terminals A carrier for a semiconductor die has a substrate with a cavity formed in the substrate. The cavity has a bottom and sidewalls, and the sidewalls have a stepped tier. Electrically conductive contacts are disposed on an underside of the substrate. Electrically conduc... | 09/20/2005 |
| 6919625 | Surface mount multichip devices A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame... | 07/19/2005 |
| 6835004 | Opto-electronic component packaging An opto-electronic package is provided for mounting on a module base. The package comprises a generally rectangular package. An optical connector extends from a first side of the package body along an optical axis, generally parallel to the module base. A radio freq... | 12/28/2004 |
| 6836010 | Semiconductor device include relay chip connecting semiconductor chip pads to external pads Disposal and replacement of bonding pads is conducted easily and accurately. A semiconductor chip that includes bonding pads is fixed on a die pad. A relay chip is fixed on the semiconductor chip via an insulating material. The relay chip includes bonding pads that ... | 12/28/2004 |
| 6828667 | Surface mounting type electronic component A surface mounted electronic component includes a case and a board mounting part. The board mounting part includes a leg bent in parallel with a printed circuit board at its tip, an outer frame soldered to a land of a mounted part on the board, and a projection disp... | 12/07/2004 |
| 6822164 | Semiconductor device and electro-optical device including the same A semiconductor device for supplying a signal to an electro-optical device which displays a two-dimensional image, includes first terminals which are formed along a first side of the semiconductor device in a longitudinal direction and have a length L1 in a d... | 11/23/2004 |
| 6809410 | Power semiconductor module A power semiconductor module with a connection structure in which an electrode terminal whose one end is connected with an electric power semiconductor device which is resin sealed inside of the case, is exposed along an outer surface of a case for taking out electr... | 10/26/2004 |
| 6800932 | Package for semiconductor die containing symmetrical lead and heat sink A semiconductor package contains a plurality of sheet metal leads that are attached to one or more terminals on a top side of a semiconductor die. A heat sink is attached to a terminal on a bottom side of the die. Each of the leads extends across the die and beyond ... | 10/05/2004 |
| 6784464 | Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor la... | 08/31/2004 |
| 6744122 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device A semiconductor device comprising: a substrate (30) including a plurality of holes (36) and a surface over which an interconnecting pattern (32) is formed, part of the interconnecting pattern (32) being superposed over the holes (36 | 06/01/2004 |
| 6744133 | Adhesive film for semiconductor, lead frame and semiconductor device using the same An adhesive film for semiconductor comprises a support film, and adhesive layers formed on both surfaces of the support film, in which each adhesive layer comprises an adhesive having a glass transition temperature of 200° C. or less, a coefficient of linear expans... | 06/01/2004 |
| 6700138 | Modular semiconductor die package and method of manufacturing thereof A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive ... | 03/02/2004 |
| 6686648 | Electronic component with stacked semiconductor chips and method of producing the component The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic c... | 02/03/2004 |
| 6667545 | Rectifier diode with improved means for tension relief of the connected headwire The rectifier diode includes a press-fit base (12) including an axially extending substantially securing region (14) for a semiconductor chip (20); a head wire (24) attached to the semiconductor chip (20); an encapsulation (40) for at least an end portion... | 12/23/2003 |
| 6635955 | Molded electronic component A molded electronic component has numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge of molded housing material protrudes from the other side area surfaces on the pl... | 10/21/2003 |
| 6630727 | Modularly expandable multi-layered semiconductor component A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provi... | 10/07/2003 |
| 6611049 | Semiconductor device with chamfered substrate and method of making the same A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on the reverse surface of the substrate, a semiconductor chip ... | 08/26/2003 |
| 6538306 | Electronic part The present invention relates to an electronic component formed of an electrically conductive plate and including a plurality of leads 1, 2 each having an island 10 for mounting of a semiconductor chip 3 or having a connecting portion 20 for connection wi... | 03/25/2003 |
| 6534853 | Semiconductor wafer designed to avoid probed marks while testing A semiconductor wafer is disclosed for avoiding probed marks while testing. The wafer has a plurality of metal interconnects, each metal interconnect connecting underlying bonding pad, corresponding contact pad and test pad. Each contact pad being outer e... | 03/18/2003 |
| 6531769 | SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, SEMICONDUCTOR APPARATUS PROVIDED WITH A PLURALITY OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGES, METHOD OF INSPECTING SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT The present invention provides a resin-sealed semiconductor IC package of a large integration size having a size substantially equal to that of its component semiconductor IC chip. The resin-sealed semiconductor IC package comprises a semiconductor IC chi... | 03/11/2003 |
| 6483182 | Integrated-circuit case A case for an integrated-circuit mounted on a substrate provides electrical conducting contacts between the integrated circuit and contact elements on an external circuit, e.g., a printed circuit, connected to the case. The case includes contact pins and ... | 11/19/2002 |
| 6455929 | Embedded type package of power semiconductor device An embedded type package of power semiconductor device comprises a semiconductor device and a cup. One side of the semiconductor device is connected to a leader and another side of the semiconductor device is connected to the cup. The cup has guiding beve... | 09/24/2002 |
