Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 8164174 | Microstructure component A microstructure component, in particular an encapsulated micromechanical sensor element, including at least one microstructure patterned out from a silicon layer being encapsulated by a glass element. At least the region of the glass element covering the microstruc... | 04/24/2012 |
| 8159063 | Substrate and package with micro BGA configuration A substrate of a micro-BGA package is revealed, primarily comprising a substrate core, a first trace, and a second trace where the substrate core has a slot formed between a first board part and a second board part. The first trace is disposed on the first board par... | 04/17/2012 |
| 8138596 | Method for manufacturing an element having electrically conductive members for application in a microelectronic package A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package ( | 03/20/2012 |
| 8125072 | Device including a ring-shaped metal structure and method A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An encapsulation body encapsulates the semiconductor chip and defines a second main surface. An array of external... | 02/28/2012 |
| 8120165 | Semiconductor device A method for manufacturing a semiconductor device includes: preparing a wiring board having a base substrate and wiring that is plated on surface with a plating metal; pressing a bump that is formed on the active side of the semiconductor chip against an end part of... | 02/21/2012 |
| 8115299 | Semiconductor device, lead frame and method of manufacturing semiconductor device A semiconductor device and a lead frame capable of preventing development of defective mounting resulting from a burr and a method of manufacturing a semiconductor device with the lead frame are provided. The semiconductor device includes a semiconductor chip and a ... | 02/14/2012 |
| 8110916 | Chip package structure and manufacturing methods thereof A chip package structure includes a chip module, a plurality of pre-patterned structures, a filling material layer, and a redistribution layer. The chip module includes a chip including an upper surface, a side surface, and an active surface. The pre-patterned struc... | 02/07/2012 |
| 8102043 | Stacked integrated circuit and package system and method for manufacturing thereof A method for manufacturing a stacked integrated circuit and package system includes: attaching a high temperature resistant layer on a top substrate; mounting a first top integrated circuit on the high temperature resistant layer; mounting a second top integrated ci... | 01/24/2012 |
| 8093709 | Semiconductor device and manufacturing method thereof There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is ad... | 01/10/2012 |
| 8093708 | Semiconductor package having non-uniform contact arrangement A semiconductor package has a non-uniform contact arrangement in which clustered contacts (e.g., a group of ground contacts, a group of power contacts, and/or a group of heatslug contacts) are placed closer together than I/O contacts. In one embodiment, I/O contacts... | 01/10/2012 |
| 8022530 | Package substrate having electrically connecting structure A package substrate having an electrically connecting structure are provided. The package substrate include: a package substrate substance with at least a surface having a plurality of electrically connecting pads formed thereon, allowing an insulating protective la... | 09/20/2011 |
| 8018044 | Semiconductor device, substrate for producing semiconductor device and method of producing them A semiconductor device P includes a die pad 20, a semiconductor element 30 which is loaded on the die pad 20, and a sealing resin 40. A plurality of electrically conductive portions 10 each having a layered structure including a me... | 09/13/2011 |
| 7994633 | Substrate for electrical device Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element expos... | 08/09/2011 |
| 7989946 | Multimode signaling on decoupled input/output and power channels A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package... | 08/02/2011 |
| 7968998 | Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated into at least two concentric rows. Connected to the top surface of the die paddle is at least one semiconduc... | 06/28/2011 |
| 7944042 | Semiconductor device and method of manufacturing same A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit boa... | 05/17/2011 |
| 7932594 | Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is pro... | 04/26/2011 |
| 7928556 | Semiconductor device and manufacturing method thereof There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is ad... | 04/19/2011 |
| 7911048 | Wiring substrate There is provided a wiring substrate. The wiring substrate includes: a semiconductor substrate having a through hole; an insulating film provided to cover an upper surface, a lower surface and a first surface of the semiconductor substrate, the first surface corresp... | 03/22/2011 |
| 7880289 | Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same Provided are a semiconductor package having connection terminals whose side surfaces are exposed and a semiconductor module including such a semiconductor package. Also provided are methods of fabricating the semiconductor package and semiconductor module. According... | 02/01/2011 |
| 7880288 | Semiconductor module with semiconductor chips and method for producing it A semiconductor module has at least two semiconductor chips (4, 5) with at least one first and one second electrode (12, 13) on their first sides. Each semiconductor chip (4, 5) has a third electrode (14) on its second side (16). A... | 02/01/2011 |
| 7868446 | Semiconductor device and methods of manufacturing semiconductor devices This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip wherein the molded body comprises an array of recesses in a first surface of the molded body, first contact elements, and elastic elemen... | 01/11/2011 |
| 7816781 | Power semiconductor module One embodiment provides a semiconductor module with an electrically insulating substrate. A conductor track is arranged on the substrate. A semiconductor chip and sleeve member are arranged on the substrate and electrically connected to the conductor track. The slee... | 10/19/2010 |
| 7786567 | Substrate for electrical device and methods for making the same Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the conductive elements embedded in the insulator, and two surfaces ... | 08/31/2010 |
| 7755183 | Wiring board, method of manufacturing the same, and semiconductor device According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t larger than a width W. ... | 07/13/2010 |
| 7741709 | Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a com... | 06/22/2010 |
| 7719101 | Semiconductor device with surface-mountable external contacts and method for manufacturing the same A semiconductor device includes surface-mountable external contacts on an underside of the semiconductor device, wherein the external contacts are arranged on external contact pads and surrounded by a solder-resist layer. The external contacts of the outer edge regi... | 05/18/2010 |
| 7714427 | Integrated circuit die configuration for packaging Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for signals sensitive to trace length outside a die are arranged at the cor... | 05/11/2010 |
| 7714428 | High power semiconductor package and method of making the same A high power semiconductor package includes a substrate including a base metal layer, a base insulation layer formed on the base metal layer, and a plurality of conductive patterns formed on the base insulation layer. In one embodiment one or more high power semicon... | 05/11/2010 |
| 7701050 | Side-view optical diode package and fabricating process thereof A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first s... | 04/20/2010 |
| 7649251 | Thin-film device A thin-film device incorporates: a substrate; an insulating layer, a plurality of lower conductor layers, a dielectric film, an insulating layer, a plurality of upper conductor layers and a protection film that are stacked in this order on the substrate; and a plura... | 01/19/2010 |
| 7638872 | Power semiconductor module A power semiconductor module is presented. The power semiconductor module has a substrate, a composite film, and a power semiconductor component between the substrate and the composite film. The composite film has a thin circuit-structured logic metal layer and a th... | 12/29/2009 |
| 7605462 | Universal substrate for a semiconductor device having selectively activated fuses A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses are connected with the bifurcate wirings in series. By the bifurcate... | 10/20/2009 |
| 7589412 | Semiconductor device One of the aspects of the present invention is to provide a semiconductor device, which includes a base plate, an insulating substrate on the base plate, and a wiring patterned layer on the insulating substrate. Also, it includes at least one semiconductor chip bond... | 09/15/2009 |
| 7589414 | I/O Architecture for integrated circuit package A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive ele... | 09/15/2009 |
| 7589413 | Semiconductor device comprising a vertical semiconductor component and method for producing the same A semiconductor device (1; 25) has a vertical semiconductor component (2), a first metalization (8) and a second metalization (13). The second metalization (13) has an integral film with a first end (14) with a first contact... | 09/15/2009 |
| 7569923 | Recyclying faulty multi-die packages The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package. ... | 08/04/2009 |
| 7550838 | Semiconductor device A semiconductor device includes a first power supply which is disposed in a first direction, a first pad array which is disposed in the first direction, adjacent to the first power supply line, a second power supply line extending in the first direction, a first buf... | 06/23/2009 |
| 7476965 | Electronic device with integrated heat distributor The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the ... | 01/13/2009 |
| 7429797 | Electronic device and carrier substrate Consistent with an example embodiment, an electronic device comprises a semiconductor device, particularly an integrated circuit, and a carrier substrate with conductive layers on the first side and the second side, and voltage supply and ground connections mutually... | 09/30/2008 |
