Bizarre Patents
A gun that fires a missile, powered by gas "discharged by the operator of the toy."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8115294 | Multichip module with improved system carrier A power semiconductor device has a first chip carrier part (11) and a second chip carrier part (12), the first chip carrier part (11) and the second chip carrier part (12) being spaced apart from one another and being electrically conduct... | 02/14/2012 |
| 8110912 | Semiconductor device A method of manufacturing a semiconductor device includes providing a foil formed of an insulating material, where the foil includes at least one electrically conducting element, providing a chip having contact elements on a first face of the chip, and applying the ... | 02/07/2012 |
| 8106502 | Integrated circuit packaging system with plated pad and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to a portion the external interconnect; mounting a first integrated cir... | 01/31/2012 |
| 8102042 | Reducing plating stub reflections in a chip package using resistive coupling Improving signal quality in a high-frequency chip package by resistively connecting an open-ended plating stub to ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A conductive first layer provides a chip mo... | 01/24/2012 |
| 8097941 | Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof A semiconductor device includes a semiconductor substrate, and a plurality of wiring lines provided on one side of the semiconductor substrate, each of the wiring lines having a connection pad portion. An overcoat film is provided on the wiring lines and the one sid... | 01/17/2012 |
| 8089145 | Semiconductor device including increased capacity leadframe In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly... | 01/03/2012 |
| 8067830 | Dual or multiple row package A dual or multiple row package (300) is provided which comprises a first plurality of terminals (303, 304, 305) and a second plurality of terminals (306, 307), which first and second plurality of terminals are exposed outside the encapsulation a... | 11/29/2011 |
| 8063479 | Housing for a semiconductor component A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose... | 11/22/2011 |
| 8053885 | Wafer level vertical diode package structure and method for making the same A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of th... | 11/08/2011 |
| 8049323 | Chip holder with wafer level redistribution layer A chip holder formed of silicon, glass, other ceramics or other suitable materials includes a plurality of recesses for retaining semiconductor chips. The bond pads of the semiconductor chip are formed on or over an area of the chip holder that surrounds the semicon... | 11/01/2011 |
| 8044499 | Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resi... | 10/25/2011 |
| 8039945 | Plastic electronic component package A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transpare... | 10/18/2011 |
| 8039944 | Electrical connection device and assembly method thereof An electrical connection device and assembly method thereof includes a substrate with a plurality of contacting portions arranged on a surface thereof; a chip module having a plurality of terminals inclining in one direction and compressed and contacted with the con... | 10/18/2011 |
| 8035212 | Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board havi... | 10/11/2011 |
| 8030750 | Semiconductor device packages with electromagnetic interference shielding Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an encapsulant, and a conductive layer. The substrate includes a carrying... | 10/04/2011 |
| 8026590 | Die package and method of manufacturing the same Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the su... | 09/27/2011 |
| 8026588 | Method of wire bonding over active area of a semiconductor circuit A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metall... | 09/27/2011 |
| 8026589 | Reduced profile stackable semiconductor package In accordance with the present invention, there is provided multiple embodiments of a reduced profile stackable semiconductor package. The semiconductor package comprises a substrate having at least one semiconductor die attached thereto. The semiconductor die is al... | 09/27/2011 |
| 8018043 | Semiconductor package having side walls and method for manufacturing the same A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces o... | 09/13/2011 |
| 8013432 | Package substrate, semiconductor package having the package substrate A package substrate includes an insulating substrate having a mount region including external terminals mounted to the insulating substrate and a clamp region having an opening receiving a molding material therein, the clamp region disposed adjacent to the mount reg... | 09/06/2011 |
| 8004076 | Microelectronic package with carbon nanotubes interconnect and method of making same A method of forming a microelectronic package is provided. The method includes providing a silicon substrate having a plurality of carbon nanotubes disposed on a silicon layer and coupling the silicon substrate to a top surface of a packaging substrate, wherein the ... | 08/23/2011 |
| 7999369 | Power electronic package having two substrates with multiple semiconductor chips and electronic components A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patt... | 08/16/2011 |
| 7999370 | Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same A semiconductor package includes a semiconductor chip including a body unit having one or more circuit units. A first bonding pad is disposed in a first face of the body unit and is connected to a circuit unit. A second bonding pad is disposed in the first face of t... | 08/16/2011 |
| 7994628 | Package structure of photoelectronic device and fabricating method thereof A package structure for photoelectronic devices comprises a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and a sec... | 08/09/2011 |
| 7994629 | Leadless integrated circuit packaging system and method of manufacture thereof A method of manufacture of a leadless integrated circuit packaging system includes: providing a substrate; patterning a die attach pad on the substrate; forming a tiered plated pad array around the die attach pad; mounting an integrated circuit die on the die attach... | 08/09/2011 |
| 7986034 | Power semiconductor module and method for producing the same A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the... | 07/26/2011 |
| 7986035 | Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package A multilayer wiring substrate included in the semiconductor package includes: a first insulating layer and a second insulating layer, in which wiring layers are respectively provided on the upper and the lower surfaces; and; a core layer provided between the first i... | 07/26/2011 |
| 7982300 | Stackable layer containing ball grid array package Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded togethe... | 07/19/2011 |
| 7982299 | Power semiconductor module Included are a semiconductor package, a first bus bar, a second bus bar and a soldering control unit. The semiconductor package includes a power semiconductor element, a first electrode plate and a second electrode plate. The first bus bar is a conductive member whi... | 07/19/2011 |
| 7964955 | Electronic device package and electronic equipment This electronic device package includes a substrate upon which an electronic device is mounted, a plurality of device electrodes which are formed upon an electronic device, a plurality of substrate electrodes which are formed upon the substrate, and a plurality of c... | 06/21/2011 |
| 7956452 | Flip chip packages Flip chip packages and methods of manufacturing the same are provided, the flip chip packages may include a package substrate, a semiconductor chip, conductive bumps, a ground pattern and an underfilling layer. The semiconductor chip may be over the package substrat... | 06/07/2011 |
| 7952185 | Semiconductor device with hollow structure A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed. ... | 05/31/2011 |
| 7944038 | Semiconductor package having an antenna on the molding compound thereof The present invention relates to a semiconductor package having an antenna. The semiconductor package includes a substrate, a chip, a molding compound and an antenna. The substrate has a first surface and a second surface. The chip is disposed on the first surface o... | 05/17/2011 |
| 7944039 | Semiconductor device and method of manufacturing the same A semiconductor device includes a chip, a laminated wiring structure formed integrally with the chip, a frame disposed to surround the chip and made of a material having stiffness, and a sealing resin formed to bury therein the frame and at least the periphery of th... | 05/17/2011 |
| 7944040 | Semiconductor device and electronic apparatus equipped with the semiconductor device A semiconductor device comprises an IC chip body and a package substrate that has thereon many external electrodes arranged in a two-dimensional grid configuration. Groups of signal lines that are likely to emit noise (noisy signal lines) are separated and spaced ap... | 05/17/2011 |
| 7939930 | Crosstalk reduction in electrical interconnects using differential signaling An electrical device includes a plurality of interconnects passing through a plane. The interconnects have a longitudinal axis substantially perpendicular to the plane and including an arrangement pattern which reduces or eliminates cross-talk between nearest neighb... | 05/10/2011 |
| 7939932 | Packaged chip devices with atomic layer deposition protective films A low-temperature inorganic dielectric ALD film (e.g., Al2O3 and TiO2) is deposited on a packaged or unpackaged chip device so as to coat the device including any exposed electrical contacts. Such a low-temperature ALD film generally... | 05/10/2011 |
| 7939931 | Semiconductor device There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a ... | 05/10/2011 |
| 7939929 | Semiconductor laser device and method of fabricating semiconductor laser device A semiconductor laser device includes a supporting substrate; a semiconductor laser device portion which is formed on a surface of the supporting substrate, and which includes a pair of cavity surfaces; an adhesive layer with which the supporting substrate and the s... | 05/10/2011 |
| 7932592 | Compound and organic light-emitting element A novel organic compound and a high-performance organic light-emitting element containing the same. The organic light-emitting element contains a novel compound represented by general formula (1): ... | 04/26/2011 |
