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| Number | Title | Issue Date |
| 8125069 | Semiconductor device and etching apparatus A method for manufacturing a semiconductor device comprises dry-etching a thin film using a resist mask carrying patterns in which at least one of the width of each pattern and the space between neighboring two patterns ranges from 32 to 130 nm using a halogenated c... | 02/28/2012 |
| 7786565 | Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor A semiconductor apparatus includes a semiconductor chip 61 including a power semiconductor device using a wide band gap semiconductor, base materials 62 and 63, first and second intermediate members 65 and 68a, a heat conduc... | 08/31/2010 |
| 7705442 | Contact device for use in a power semiconductor module or in a disc-type thyristor A contact device for use with a power semiconductor component in a power semiconductor module or a disc-type thyristor, the module or thyristor having a molded body with a first recess disposed above the component. The contact device makes electrical contact with th... | 04/27/2010 |
| 7528476 | Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the semiconductor substrate, and projecting from the active surface and th... | 05/05/2009 |
| 7397066 | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/... | 07/08/2008 |
| 7390973 | Memory module and signal line arrangement method thereof The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both ... | 06/24/2008 |
| 7368819 | Multilayer printed wiring board and multilayer printed circuit board In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands formed on the outermost layer of the resin layers and on which the solde... | 05/06/2008 |
| 7358602 | Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor substrate and has a projection which projects from the second surface;... | 04/15/2008 |
| 7352583 | Flexible lead for a pressfit diode bridge An improvement to a bridge rectifier assembly of the type used to convert alternating current produced by an motor vehicle alternator into direct current. The bridge rectifier assembly of this type comprises a heat sink, a plurality of pressfit diodes installed in t... | 04/01/2008 |
| 7335970 | Semiconductor device having a chip-size package Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided i... | 02/26/2008 |
| 7327022 | Assembly, contact and coupling interconnection for optoelectronics A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip ... | 02/05/2008 |
| 7327023 | Semiconductor component with plastic housing, and process for producing the same A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer... | 02/05/2008 |
| 7312400 | Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode patte... | 12/25/2007 |
| 7268417 | Card-type circuit device A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper su... | 09/11/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7208840 | Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module First alignment marks are provided on a film substrate in a manner that they are located at positions offset from the disposed positions of second alignment marks provided on a semiconductor chip. The amount of expansion or contraction of the film substrate is obtai... | 04/24/2007 |
| 7193328 | Semiconductor device Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and the wiring pattern. The semiconductor device of the present invention... | 03/20/2007 |
| 7192804 | Semiconductor device and method for fabricating the same A wafer on which semiconductor elements, a multilevel interconnect layer, a bonding pad, a passivation film, and the like are formed is coated with a buffer coat film. Thereafter, the buffer coat film is patterned by exposure and development so that parts of the buf... | 03/20/2007 |
| 7183580 | Electro-optical device, manufacturing method of the same, and electronic apparatus To provide an electro-optical device having a buffer layer which planarizes a gas barrier layer so that stress-concentration in the gas barrier layer is reduced, the buffer layer being prevented from leaking out of a predetermined area, and to provide a method of pr... | 02/27/2007 |
| 7183647 | Wiring substrate and electronic parts packaging structure In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support... | 02/27/2007 |
| 7173325 | Expansion constrained die stack Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection components. At least one of the printed wiring board assemblies inclu... | 02/06/2007 |
| 7170152 | Wafer level semiconductor package with build-up layer and method for fabricating the same A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the ... | 01/30/2007 |
| 7145254 | Transfer-molded power device and method for manufacturing transfer-molded power device A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are embedded. The thickness t1 of the chip and the thickness t2 of ... | 12/05/2006 |
| 7132698 | Compression assembled electronic package having a plastic molded insulation ring A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ri... | 11/07/2006 |
| 7109575 | Low-cost flexible film package module and method of manufacturing the same Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film packa... | 09/19/2006 |
| 7061090 | Semiconductor device A semiconductor device comprises a semi-conductor chip bonded on a top surface inside a case electrode by a bonding material and a lead electrode bonded on a top surface of the semiconductor chip by a bonding material with a space of the case electrode filled with a... | 06/13/2006 |
| 7053479 | Package of semiconductor device and its manufacturing method A packaged semiconductor device structure comprises a semiconductor chip (20) having a bump electrode (5), a facing substrate (9) having on one face thereof a facing electrode (8) contacting an end face of the bump electrode (5) an... | 05/30/2006 |
| 7030476 | Rectifier diode device Disclosed is a rectifier diode device. The rectifier diode device includes a conductive base, a semiconductor chip, a conductive lead and insulation resin. A trench and a post are formed in the conductive base in order to increase a bonding surface between the condu... | 04/18/2006 |
| 7026721 | Method of improving copper pad adhesion This invention relates to a new improved method and structure in the fabricating of aluminum metal pads. The formation special aluminum bond pad metal structures are described which improve adhesion between the tantalum nitride pad barrier layer and the underlying c... | 04/11/2006 |
| 7009223 | Rectification chip terminal structure A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circu... | 03/07/2006 |
| 6977441 | Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument An interconnect substrate including a first substrate on which a first interconnect pattern is formed, having a mounting region for an electronic chip; and a second substrate on which a second interconnect pattern electrically connected to the first interconnect pat... | 12/20/2005 |
| 6953145 | Soldering method for mounting electric components A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the ... | 10/11/2005 |
| 6943436 | EMI heatspreader/lid for integrated circuit packages An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board. ... | 09/13/2005 |
| 6936913 | High performance vias for vertical IC packaging A semiconductor device, a microelectromechanical system package and a method of making the same utilize high performance vias for vertical IC packaging. A semiconductor die of the device/package has a substrate with integrated circuitry formed on a front side of the... | 08/30/2005 |
| 6924044 | Tin-silver coatings The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of m... | 08/02/2005 |
| 6882040 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 04/19/2005 |
| 6879033 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 04/12/2005 |
| 6867496 | Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument A semiconductor device including a substrate (10). An interconnect pattern (12) is formed over the substrate (10), and the substrate (10) has a first portion (14) and a second portion (16) to be superposed on the first porti... | 03/15/2005 |
| 6858922 | Back-to-back connected power semiconductor device package A small footprint package for two or more semiconductor die includes first and second die, mounted on opposite respective surfaces of a lead frame pad in vertical alignment with one another. A conductive or insulation adhesive can be used. The die can be identical M... | 02/22/2005 |
| 6853066 | Semiconductor device A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base ( | 02/08/2005 |
