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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8183674 | Power semiconductor module comprising an explosion protection system A power semiconductor module for energy distribution, includes at least one power semiconductor, connection terminals for connecting the power semiconductor module, and a housing, in which protection from explosion is ensured in the module even in the event of elect... | 05/22/2012 |
| 7390742 | Method for producing a rewiring printed circuit board The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and th... | 06/24/2008 |
| 7321172 | Selective plating of package terminals In one embodiment, a method including providing a semiconductor pad package having a first pad and a second pad is disclosed. A first layer comprising a first metal is deposited on the first pad using a first process. A second metal is then deposited on the first pa... | 01/22/2008 |
| 7166922 | Continuous metal interconnects A method of forming an interconnection that includes introducing a barrier material in a via of a dielectric to a circuit device on a substrate in such a manner to deposit the barrier material on the circuit device, introducing a seed material into the via in manner... | 01/23/2007 |
| 7151308 | Semiconductor chip package A semiconductor chip package includes an interconnection substrate, a central substrate, a peripheral substrate and a semiconductor chip sandwiched between the interconnection substrate and the central substrate. The interconnection substrate has a recessed cavity f... | 12/19/2006 |
| 7143500 | Method to prevent damage to probe card Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe need... | 12/05/2006 |
| 7132698 | Compression assembled electronic package having a plastic molded insulation ring A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ri... | 11/07/2006 |
| 7126210 | System and method for venting pressure from an integrated circuit package sealed with a lid A system and method is disclosed for venting pressure from an integrated circuit package that is sealed with a lid. During a surface mount process for mounting a ball grid array integrated circuit package to a circuit board the application of heat (1) weakens... | 10/24/2006 |
| 7049685 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In one aspect of the invention, a packaged microelectronic device includes... | 05/23/2006 |
| 7034383 | Electronic component and panel and method for producing the same The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the ... | 04/25/2006 |
| 6975017 | Healing of micro-cracks in an on-chip dielectric In one embodiment there is provided a method comprising performing a sawing operation on a wafer; and treating the wafer to at least reduce a propagation of micro-cracks formed in the wafer during the sawing. In another embodiment there is provided a semi-conductor ... | 12/13/2005 |
| 6963124 | Locking of mold compound to conductive substrate panels A panel assembly of packaged integrated circuit devices including a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery ... | 11/08/2005 |
| 6919623 | Hydrogen diffusion hybrid port and method of forming A hydrogen diffusion port for use in a packaged electronic device. In one embodiment, the hydrogen window is characterized by a substantial absence of plating from the external surfaces of the cover the base. The hydrogen diffusion port is selected from the group of... | 07/19/2005 |
| 6809407 | Semiconductor device A semiconductor device includes an electrically insulating board; conductive interconnections formed on a first face of the board and on a second face opposite to the first face; a semiconductor chip fixed to the board through at least the interconnections on the fi... | 10/26/2004 |
| 6768191 | Electronic component with stacked electronic elements An electronic component includes stacked electronic elements with external contacts. The external contacts are connected to contact terminal pads of an interconnect layer disposed on an isolating body. This isolating body extends over underlying side edges of a furt... | 07/27/2004 |
| 6762502 | Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof A method for forming semiconductor device packages including one or more semiconductor dice, leads in communication with bond pads of the dice, and a protective layer, or package, over at least the active surfaces of the semiconductor dice. The protective layer cove... | 07/13/2004 |
| 6617680 | Chip carrier, semiconductor package and fabricating method thereof A chip carrier, a semiconductor package and a fabricating method thereof are proposed, in which on one side of the chip carrier finally removed from an engaged surface of a mold in a de-molding process there is formed at least one grounding means correspo... | 09/09/2003 |
| 6576989 | Locking of mold compound to conductive substrate panels A panel assembly of packaged integrated circuit devices including conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the p... | 06/10/2003 |
| 6541857 | Method of forming BGA interconnections having mixed solder profiles A method of forming BGA interconnections having improved fatigue life is disclosed. In particular, a combination of mask-defined and pad-defined solder joints are selectively positioned within the BGA package. The mask-defined solder joints possess a high... | 04/01/2003 |
| 6448637 | Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment A hermetically sealed protective package for a space-deployable electronic circuit includes a pressure relief valve. The pressure relief valve is closed during assembly and testing of the circuit in an earth borne environment, so as to prevent the entry o... | 09/10/2002 |
| 6410981 | Vented semiconductor device package having separate substrate, strengthening ring and cap structures A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The de... | 06/25/2002 |
| 6380632 | Center bond flip-chip semiconductor device and method of making it A center bond flip-chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a layer of conductive material and a layer of elastomeric material. At least one pocket is formed in the layer ... | 04/30/2002 |
| 6326698 | Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of t... | 12/04/2001 |
| 6297549 | Hermetically sealed semiconductor power module and large scale module comprising the same This is a semiconductor power module provided with: a ceramic substrate; a metallic plate bonded to a surface of this substrate; a cylindrical metallic flange which is hermetically bonded to a surface of substrate or the metallic plate; a ceramic housing ... | 10/02/2001 |
| 6245597 | Method for reducing die cracking in integrated circuits The method which applies to plastic encapsulated integrated circuit packages comprises the steps of increasing the thickness of the epoxy adhesive that is used to couple an integrated circuit die to a mounting structure and reducing the thickness of the i... | 06/12/2001 |
| 6225687 | Chip package with degassing holes A semiconductor device package includes multiple built-up layers of metal sandwiching non-conductive layers. The metal layers have grids of degassing holes arranged in rows and columns. The rows and columns are locatable via a first coordinate system. Sig... | 05/01/2001 |
| 6191472 | Hole geometry of a semiconductor package substrate A semiconductor package substrate includes at least one insulative layer, at least two metal lines next to one another on a first side of the insulative layer, and a first metal layer on a second side of the insulative layer opposing the first side. An op... | 02/20/2001 |
| 6184464 | Protective containment apparatus for potted electronic circuits A protective containment apparatus for preventing damage to expensive components of an assembly due to the failure of an electronic component in a nearby potted circuit which is known to fail catastrophically. The containment apparatus can employ a resili... | 02/06/2001 |
| 6140707 | Laminated integrated circuit package A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexibl... | 10/31/2000 |
| 5977621 | Power semiconductor module A power semiconductor module is specified in which a layer of foam is arranged under the housing cover in the housing. The foam not only enables mechanical support of the potting compound, so that the latter is prevented from becoming detached, but can al... | 11/02/1999 |
| 5977568 | Power semiconductor component with a pressure-equalizing contact plate The present invention discloses a power semiconductor component 1 having a special pressure contact system which is suitable, for example, for circuit-breakers, rectifiers, or the like in industrial drives. A pressure-equalizing element 9 in the form of a... | 11/02/1999 |
| 5945733 | Structure for attaching a semiconductor wafer section to a support A method for attaching a semiconductor wafer section to a lead frame comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.... | 08/31/1999 |
| 5818094 | Package for housing a semiconductor element A semiconductor element-housing package which hermetically houses a semiconductor element for protection against moisture in the atmosphere by bonding an insulating substrate and a lid by means of a sealing material, with a moisture absorbent having surfa... | 10/06/1998 |
| 5783426 | Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same The semiconductor device disclosed has a cap in which, at an undersurface periphery portion, a plurality of looped projections are formed for intercepting a continuous bubble path that may be formed for a gas to escape. The preparatory stage steps of asse... | 07/21/1998 |
| 5760336 | Burn and explosion-resistant circuit package for a varistor chip A circuit package for a varistor chip includes a housing made of an electrical insulating and burn-resistant composition. The housing includes a surrounding wall with upright front and rear wall portions and opposite side wall portions which interconnect ... | 06/02/1998 |
| 5744860 | Power semiconductor module A power semiconductor module (201) is disclosed comprising at least one semiconductor chip, which is arranged on a baseplate (202) and is surrounded by a housing (204) arranged above the baseplate (202), and which can be externally connected by means of c... | 04/28/1998 |
| 5736780 | Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes A flexible circuit board includes an insulating flexible film having a lower surface provided with first wiring patterns having first inner ends, and second outer ends extending to a peripheral area of the insulating flexible film. A semiconductor element... | 04/07/1998 |
| 5629562 | Conductive contact structure for two conductors In a conductive contact structure for two conductors, a lower electrode also serves as a cooling element, and two grooves are formed in the lower surface of an electrode. A grease-like insulating material high in thermal conductivity is applied to the low... | 05/13/1997 |
| 5491361 | Hydrogen out venting electronic package A hydrogen out venting window is disposed on or in a hermetically sealed electronic package lid, the window including a catalyst which dissociates internally trapped molecular hydrogen at an interior surface of the catalyst into atomic hydrogen and which ... | 02/13/1996 |
| 5446315 | Resin-sealed semiconductor device containing porous fluorocarbon resin A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any... | 08/29/1995 |
