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| Number | Title | Issue Date |
| 7528473 | Electronic circuit, a semiconductor device and a mounting substrate An electronic circuit includes a first semiconductor device and a second semiconductor device on a mounting substrate. The mounting substrate lines have lengths which are made unequal for respective bits. Assembling lines which reach connecting electrodes of a semic... | 05/05/2009 |
| 7405470 | Adaptable electronic storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 07/29/2008 |
| 7368794 | Boron carbide particle detectors Boron carbide heteroisomer semiconductor devices are used as particle detectors. The boron carbide semiconductor devices produce electric current in response to incident particles, such as alpha particles, neutrons, or photons. ... | 05/06/2008 |
| 7348241 | Cell structure of EPROM device and method for fabricating the same Provided are a cell structure of an EPROM device and a method for fabricating the same. The cell structure includes a gate stack, which includes a first floating gate, an insulating pattern including a nitride layer, and a control gate that are sequentially stacked ... | 03/25/2008 |
| 7320738 | Method for encapsulation of a chip card and module obtained thus Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided t... | 01/22/2008 |
| 7312106 | Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to k... | 12/25/2007 |
| 7276802 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to t... | 10/02/2007 |
| 7276413 | NROM flash memory devices on ultrathin silicon An NROM flash memory cell is implemented in an ultra-thin silicon-on-insulator structure. In a planar device, the channel between the source/drain areas is normally fully depleted. An oxide layer provides an insulation layer between the source/drain areas and the ga... | 10/02/2007 |
| 7274096 | Light transmissive cover, device provided with same and methods for manufacturing them A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film o... | 09/25/2007 |
| 7268067 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to t... | 09/11/2007 |
| 7262455 | Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system A nonvolatile semiconductor memory package includes a memory device having a memory cell array including a plurality of nonvolatile semiconductor memory cells, a control portion configured to control the memory device, a network interface connectable to a network, a... | 08/28/2007 |
| 7259988 | Method for managing memory blocks in flash memory The present invention discloses a method for managing memory blocks in a flash memory. The method is first to calculate the total number of good blocks and total number of bad blocks in the flash memory, and then all the good blocks and the bad blocks will be evenly... | 08/21/2007 |
| 7205643 | Stray field shielding structure for semiconductors A stray field shielding structure for die attaching onto a magnetic random access memory chip or to other chips to prevent loss of memory due to magnetic fields or radiation is made by a method which provides a thick layer of magnetic material which is precise in it... | 04/17/2007 |
| 7200022 | Apparatus and method for mounting microelectronic devices on a mirrored board assembly The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to th... | 04/03/2007 |
| 7170154 | Glass for window of semiconductor package, glass window for semiconductor package, process for production of glass window, and semiconductor package Provided are a glass for a window which glass is suitably fitted to a semiconductor package made of a plastic and a glass window for the semiconductor package which glass window has various functions, the glass (1) being for use as a window material for a semiconduc... | 01/30/2007 |
| 7161821 | Apparatus and method for mounting microelectronic devices on a mirrored board assembly The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to th... | 01/09/2007 |
| 7157794 | Semiconductor device that suppresses variations in high frequency characteristics of circuit elements A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first area formed with a high-frequency circuit element and a second area located around the first area and formed with a low-frequency circuit element. The... | 01/02/2007 |
| 7157742 | Integrated circuit device An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mec... | 01/02/2007 |
| 7154053 | Optoelectronic package with wire-protection lid An optoelectronic package with a wire-protection lid is provided. An active surface of a silicon die includes a light working area. The silicon die is disposed on a substrate and electrically connected to the substrate through a plurality of bonding wires. A glass i... | 12/26/2006 |
| 7057928 | System and method for erasing high-density non-volatile fast memory A system and method for erasing a high-density non-volatile fast memory is presented. In one embodiment the high-density non-volatile fast memory is a modified flash memory having modified flash cells. One embodiment of the system comprises ultra-violet (UV) light w... | 06/06/2006 |
| 7049690 | Information card An information card includes a ground plate that is connected to a ground conductor portion of a printed substrate and is integral with an external panel. Plural contacts are provided with the ground plate, and are exposed at the upper side out of windows provided i... | 05/23/2006 |
| 7015579 | Semiconductor device for fingerprint recognition A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reli... | 03/21/2006 |
| 6995462 | Image sensor packages Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semi... | 02/07/2006 |
| 6940140 | Package structure of solid-state image sensor A package structure of a solid-state image sensor having a solid-state image sensor chip and a color filter stuck on a light receiving surface of the chip. The package structure includes a vessel for packaging the solid-state image sensor chip. An optically transpar... | 09/06/2005 |
| 6919628 | Stack chip package structure A stack chip package structure is provided. One principal feature of the structure is the formation of a few peripheral surfaces (e.g. ladder or lead-angle surfaces) at the bottom peripheral sections of a stack structure. When the stack structure is attached to a su... | 07/19/2005 |
| 6740603 | Control of Vmin transient voltage drift by maintaining a temperature less than or equal to 350° C. after the protective overcoat level A method for fabricating a non-FLASH integrated circuit that minimizes Vmin shift. A protective overcoat (134) is deposited to protect and encapsulate the top metal interconnect layer (118). The protective overcoat (134) is patterned and etched ... | 05/25/2004 |
| 6690057 | EPROM structure for a semiconductor memory An EPROM structure for a nonvolatile semiconductor memory includes a plurality of memory cells that each include a floating gate transistor (6) that can be programmed by hot electrons and erased by UV light. An additional, common gate capacitance (7) is a... | 02/10/2004 |
| 6646289 | Integrated circuit device An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechan... | 11/11/2003 |
| 6576991 | Device with integrated circuit protected against attacks made by the controlled destruction of an additional layer An integrated circuit device is disclosed. The device includes an active film having a semiconducting material and an integrated circuit disposed on an active face of the active film. The integrated circuit includes a plurality of circuit elements. In add... | 06/10/2003 |
| 6483030 | Snap lid image sensor package An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of... | 11/19/2002 |
| 6441499 | Thin form factor flip chip ball grid array A method for making a flip chip ball grid array (BGA) package includes the step of thinning a die for matching a composite coefficient of thermal expansion to that of a second level board.... | 08/27/2002 |
| 6121656 | Semiconductor memory device mounted with a light emitting device A semiconductor memory device in which a stored information can be simply erased only by an electric signal so as to be rewritten is provided. The semiconductor memory device includes (a) a semiconductor chip having an array of memory cells, stored inform... | 09/19/2000 |
| 6020646 | Intergrated circuit die assembly An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process ... | 02/01/2000 |
| 5949655 | Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second surfaces. A flip chip integrated circuit device is placed on the... | 09/07/1999 |
| 5867368 | Mounting for a semiconductor integrated circuit device A mounting for a semiconductor integrated circuit device, such as a charge coupled device ("CCD") or an erasable programmable read only memory device ("EPROM"), includes an insulating substrate having an aperture between its first and second surfaces. A f... | 02/02/1999 |
| 5834799 | Optically transmissive preformed planar structures A semiconductor die is disposed on a side of an optically-transmissive preformed planar structure (interposer), and an optical element is disposed on an opposite side of the interposer. The interposer may be provided with through holes extending at least ... | 11/10/1998 |
| 5760439 | Semiconductor memory device A semiconductor memory device in which a stored information can be simply erased only by an electric signal so as to be rewritten is provided. The semiconductor memory device includes: (a) a semiconductor chip having an array of memory cells, stored infor... | 06/02/1998 |
| 5703395 | Electronic memory device having a non-peripheral contact for reading and writing An electronic miniaturized memory device according to the invention has at least one integrated memory circuit (2,20) and an interconnection interface (3), said memory device comprises a case (1) being a housing for an electronic subsystem (17), said inte... | 12/30/1997 |
| 5541448 | Electronic circuit card An electronic circuit card has a metal case including top and bottom surfaces connected by first and second sidewalls and a rear wall. The case has an interior chamber and an opening at one end. A substrate is positioned in the interior chamber and a conn... | 07/30/1996 |
| 5495450 | Method and assembly for mounting an electronic device having an optically erasable surface An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion ... | 02/27/1996 |
