Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 7663210 | Optical component assembly Optical components are flip chip mounted onto a substrate for improved alignment. Each device is fabricated using “build-up” layers above a substrate. Each has an optical confinement region in which optical radiation travels in use, and a bonding surface. The ov... | 02/16/2010 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a... | 05/13/2008 |
| 7355152 | Power control apparatus and method for electric cookers A method of power control apparatus for electric cookers is provided. In the method, a micro controller unit (MCU) with a programmer pulse generator (PPG) and analog/digital (AID) converters is utilized, wherein a command can be inputted externally to the MCU for re... | 04/08/2008 |
| 7350294 | Method of electroplating a plurality of conductive fingers A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace e... | 04/01/2008 |
| 7339262 | Tape circuit substrate and semiconductor apparatus employing the same A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply vol... | 03/04/2008 |
| 7304371 | Lead frame having a lead with a non-uniform width A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width t... | 12/04/2007 |
| 7271372 | Power control apparatus and method for electric cookers A power control apparatus for electric cookers includes an input unit, an output unit, a micro controller unit (MCU), having a programmer pulse generator (PPG) and at least an analog/digital converter built therein, a power circuit, an exciter-coil circuit, an outpu... | 09/18/2007 |
| 7265982 | Semiconductor device A semiconductor device according to an embodiment of the present invention comprises a packaging substrate mounted with semiconductor chips; a heat dissipation metal plate having three or more sides and mounted with the packaging substrates; a frame provided along a... | 09/04/2007 |
| 7245007 | Exposed lead interposer leadframe package An interposer for use in an external lead or land pattern semiconductor package. The interposer includes an interposer body which is molded from a dielectric material. The interposer body defines opposed top and bottom surfaces, an outer peripheral edge, and an inne... | 07/17/2007 |
| 7211880 | Photoelectric conversion apparatus and manufacturing method of same An image reading apparatus (10) includes a photoelectric conversion element formation substrate (4) having a plurality of photoelectric conversion elements (2) on a reverse surface of an information reading surface, and a supporting substrate ( | 05/01/2007 |
| 7205650 | Composite devices of laminate type and processes In a composite device of the laminate type having a laminate structure of a composite ceramic layer and a dielectric ceramic layer, the composite ceramic layer including a layer portion having the same composition as the dielectric ceramic layer and a plurality of p... | 04/17/2007 |
| 7169643 | Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus A method of fabricating a semiconductor device comprising: a step (a) of attaching a plurality of semiconductor chips to a tape; a step (b) of cutting the tape; and a step (c) of providing a plurality of external terminals on an insulating film cut from the tape, wh... | 01/30/2007 |
| 7152316 | Hybrid integrated circuit device and method of manufacturing the same To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a... | 12/26/2006 |
| 7122401 | Area array type semiconductor package fabrication method An area array type semiconductor package includes a plurality of conductive media such as solder bumps or solder balls, attached to respective bond pads of a chip. The conductive media act as external output terminals. The chip is attached to a lead frame by a therm... | 10/17/2006 |
| 7102214 | Pre-molded leadframe A semiconductor package comprising a substrate which includes a leadframe having a plurality of leads which each define opposed top and bottom surfaces and extends in spaced relation to each other such that gaps are defined therebetween. The substrate further compri... | 09/05/2006 |
| 7081666 | Lead frame structure with aperture or groove for flip chip in a leaded molded package A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach... | 07/25/2006 |
| 7057275 | Device with power semiconductor components for controlling the power of high currents and use of said device A device with power semiconductor components controlling the power of high currents has each power semiconductor component insulated and fixed to a common cooled carrier body. Conductor bars, in addition to the power semiconductor components, are fixed to the carrie... | 06/06/2006 |
| 6979888 | LOC semiconductor assembled with room temperature adhesive A semiconductor device assembly having a lead frame and a semiconductor die configured to be attached to each other is disclosed. An adhesive is applied at room temperature through a stencil to the lead frame. The semiconductor die is urged against the adhesive to e... | 12/27/2005 |
| 6977214 | Die paddle clamping method for wire bond enhancement A leadframe configuration for a semiconductor device that has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an ... | 12/20/2005 |
| 6956282 | Stabilizer/spacer for semiconductor device The invention is a leadframe/stabilizer (35) for use with semiconductor devices. Stabilizer (35) is for stabilizing the space between of lead frame leads (36–39) and improving the lead to lead spacing and to improve lead tip planarity. Stabili... | 10/18/2005 |
| 6953988 | Semiconductor package A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of le... | 10/11/2005 |
| 6946721 | Leadframe of a conductive material and component with a leadframe of a conductive material A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at l... | 09/20/2005 |
| 6933592 | Substrate structure capable of reducing package singular stress A substrate structure capable of reducing the package singular stress comprises a substrate having a plurality of substrate units. A molding gate is provided at a corner of each substrate unit. A plurality of slots are provided at the periphery of each substrate uni... | 08/23/2005 |
| 6888229 | Connection components with frangible leads and bus A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the su... | 05/03/2005 |
| 6867481 | Lead frame structure with aperture or groove for flip chip in a leaded molded package A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach... | 03/15/2005 |
| 6861734 | Resin-molded semiconductor device In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is m... | 03/01/2005 |
| 6858922 | Back-to-back connected power semiconductor device package A small footprint package for two or more semiconductor die includes first and second die, mounted on opposite respective surfaces of a lead frame pad in vertical alignment with one another. A conductive or insulation adhesive can be used. The die can be identical M... | 02/22/2005 |
| 6858919 | Semiconductor package A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of le... | 02/22/2005 |
| 6853057 | Lead frame for a plastic encapsulated semiconductor device In a lead frame which has second tie bars in the vicinity of plastic packages first notches are formed along first edges of the second tie bars (in areas defined on both sides of the inner leads and to come into contact with a punch during the tie bar cutting step).... | 02/08/2005 |
| 6831352 | Semiconductor package for high frequency performance An improved lead frame structure for use in a semiconductor package, including: a plurality of leads; a paddle structure electrically isolated from the leads, the paddle structure including at least one lower paddle section having a first top surface to which a die ... | 12/14/2004 |
| 6798046 | Semiconductor package including ring structure connected to leads with vertically downset inner ends A semiconductor package includes a chip mounting pad having a peripheral edge. The package further includes a semiconductor chip attached to the chip mounting pad. The package further includes a plurality of leads. Each lead includes an inner end and an opposing dis... | 09/28/2004 |
| 6774465 | Semiconductor power package module A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, is provided. The semiconductor power module includes a case; a terminal inserted into the case, the terminal including portions protruding upward to th... | 08/10/2004 |
| 6768211 | Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging A novel five-layer tape is provided for applications such as bonding, interconnection and insulation of different parts of a semiconductor package at the same time. The five layer tape includes a metal conductive layer that is sandwiched between two insulative layer... | 07/27/2004 |
| 6750479 | Semiconductor component and a method for identifying a semiconductor component The invention concerns a semiconductor component and a method for identifying a semiconductor component that comprises at least one semiconductor substrate equipped with electronic/electromechanical components, which said semiconductor substrate—except for its lea... | 06/15/2004 |
| 6744120 | Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board A flexible interconnect substrate (1) comprises a tape-shaped base substrate (10) and a plurality of interconnect patterns (20) formed on the base substrate (10). The base substrate (10) bas a plurality of first regions (44)... | 06/01/2004 |
| 6740969 | Electronic device An electronic device having a first semiconductor device for powering MOSFET and a second semiconductor device for controlling on a principal surface and sealed by a resin body. The first semiconductor device has a semiconductor chip with a first and a second electr... | 05/25/2004 |
| 6713850 | Tape carrier package structure with dummy pads and dummy leads for package reinforcement An improved tape carrier package (TCP) structure is proposed, which is characterized in the provision of dummy pads and dummy leads to help reinforce the package construction. The dummy pads are provided on the corners of the semiconductor chip, while the dummy lead... | 03/30/2004 |
| 6703694 | Frame for semiconductor package including plural lead frames having thin parts or hollows adjacent the terminal roots A frame for semiconductor packages has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are mounted on the respective die-pads. These semiconductor devices are collectively molded with molding compound, and then th... | 03/09/2004 |
| 6693304 | Laminated lead frame, and optical communication module and method of manufacturing the same The optical communication module comprises a laminated lead frame composed of a plurality of lead frames that are laminated and held by a tie bar made of an insulating material, and an optical communication functional unit that is disposed on at least one... | 02/17/2004 |
